Business Wire

WA-SPIE

5.1.2023 18:37:41 CET | Business Wire | Press release

Share
SPIE, the international society for optics and photonics, announces its 2023 Fellows

This year, SPIE, the international society for optics and photonics, welcomes 83 Members as new Fellows of the Society. They join their Fellow Member colleagues in being honored for their technical achievements, as well as for their service to the optics and photonics community and to SPIE.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230105005777/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

SPIE, the international society for optics and photonics, announces its 2023 Fellows. (Graphic: Business Wire)

Fellows are Members of the Society who have made significant scientific and technical contributions in the multidisciplinary fields of optics, photonics, and imaging. Since the Society's inception in 1955, more than 1,700 SPIE Members have become Fellows.

The inductees this year hail from across the globe, representing a varied group of countries that includes Australia, Belgium, China, France, Japan, Mexico, India, Germany, the Netherlands, Switzerland, the United Kingdom, the United States, and New Zealand. In a Society first, 35% of the new Fellows come from the industry sector including Edmund Optics CEO Samuel Sadoulet. The 2023 Fellows cohort also includes a strong constituency of women, including the University of Auckland’s Cather Simpson and Frédérique Vanholsbeeck, and Ball Aerospace’s Makenzie Lystrup and Jeanette Domber.

“As well as being recognized for their technical achievements and contributions to the Society, SPIE Fellows represent our international and diverse community,” notes Chair of the SPIE Fellows Committee and TracInnovations Director of Business Development and Sales Michelle Stock. “I’m especially delighted this year to welcome so many new Fellow Members from industry – my own professional area – alongside their colleagues from the academic and government sectors. It's been a pleasure this year to work with the Fellows Committee to honor our new SPIE Fellow Members, and to recognize their professional successes. As a Society, we celebrate our 83 new inductees, their innovative research and breakthrough technologies across optics and photonics, as well as their invaluable contributions to SPIE.”

New Fellows are acknowledged during the SPIE symposium of their choice throughout the year. The complete list of the 2023 SPIE Fellows is available online, along with a list of all SPIE Fellows, nomination criteria, and the SPIE Fellows nomination form.

About SPIE

SPIE, the international society for optics and photonics, brings engineers, scientists, students, and business professionals together to advance light-based science and technology. The Society, founded in 1955, connects and engages with our global constituency through industry-leading conferences and exhibitions; publications of conference proceedings, books, and journals in the SPIE Digital Library; and career-building opportunities. Over the past five years, SPIE has contributed more than $22 million to the international optics community through our advocacy and support, including scholarships, educational resources, travel grants, endowed gifts, and public-policy development. www.spie.org.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20230105005777/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release

Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent

Toshiba Showcases End-to-End Innovations Shaping What’s Next in Retail at EuroShop 202617.2.2026 15:45:00 CET | Press release

At EuroShop, Toshiba showcases intelligent, scalable solutions that combine AI, computer vision, and energy-efficient design to transform the future of retail. At EuroShop 2026, Toshiba Global Commerce Solutions will showcase how retailers across Europe are using scalable, sustainable innovation to address today’s challenges and build what’s next. Exhibiting in Hall 6, Booth C41 from the 22nd to 26th February, Toshiba will demonstrate technologies designed to evolve with retailers, empowering flexibility, resilience, and long-term growth, and prepare them for what’s next. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260216755053/en/ At EuroShop, we’re showing how Toshiba empowers retailers across all segments to transform with confidence by scaling intelligent solutions to deliver lasting impact. “Retailers are under pressure to move faster, operate more efficiently, and deliver better experiences than ever before. At Euro

Andersen Consulting Expands Executive Talent Capabilities With Lansdowne Executive Search17.2.2026 15:30:00 CET | Press release

Andersen Consulting strengthens its human capital practice through a Collaboration Agreement with Lansdowne Executive Search, a Dublin-based firm specializing in executive search, interim management and board level appointments. Founded in 2015, Lansdowne Executive Search is an Irish-owned firm, delivering C-level executive search, fractional executives, and board placement services. As a partner-led, boutique practice, Lansdowne is known for the deep involvement of senior leadership in all client engagements. Lansdowne helps clients navigate complex leadership transitions and growth strategies across a wide range of sectors including financial services, construction, nonprofit, agriculture, higher education, public sector, and TMT. “Great leadership is contextual and getting it right means understanding far more than just a resume,” said Tom Keane, partner at Lansdowne Executive Search. “Collaborating with Andersen Consulting gives us the scale and access to expertise we need to conti

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye