WA-SORACOM
7.6.2022 11:02:13 CEST | Business Wire | Press release
Soracom , Inc., a global provider of advanced IoT connectivity, today announced that SPRESENSE™ from Sony Semiconductor Solutions Corporation (hereafter “SSS”) has joined the Soracom Partner Space ecosystem and SSS identified Soracom as a recommended provider of connectivity for its SPRESENSE microcontrollers.
SSS’s SPRESENSE 6-core microcontroller board is ideal for professional IoT use cases, with a streamlined form factor, ultra-low power consumption, multiple sensor inputs, internal GPS, and edge AI support. The unique combination of solid computing performance and advanced power efficiency makes SPRESENSE suitable for edge computing. SPRESENSE is featured in applications where there is a need for sensor analysis, machine learning, image processing and data filtering in which other microcontroller-based alternatives fall short.
SSS’s SPRESENSE LTE extension board offers an on-board antenna for global LTE Cat-M1 connectivity. Combined with Soracom’s global IoT connectivity, SSS’s SPRESENSE LTE extension board makes it easy to connect almost anywhere in the world, control connections through the Soracom console and API, and access a wide range of services supporting secure private networking, data and protocol management, and integration with leading cloud platforms.
"Collaboration with Soracom enables global connectivity to our IoT SPRESENSE solution, providing an out-of-the-box experience that ensures our customers can be dedicated to driving innovative IoT solutions, especially for Edge AI applications," said Kenichi Nakano, General Manager, Sony Semiconductor Solutions Corporation.
Supporting more than 4 million connections with global IoT coverage in more than 160 countries, Soracom offers a portfolio of powerful connectivity solutions that help IoT deployments connect securely and easily to leading hyperscaler platforms, reduce data and power requirements, and manage total cost of ownership at scale.
The Soracom Partner Space enables partners to access live opportunities and technical collaborations to provide services to IoT innovators around the world. In turn, customers are able to find trusted partners who will help them bring solutions to market and scale more quickly, create differentiators, and simplify the IoT journey. Soracom Partner Space partners have supported many of the projects behind Soracom’s expansion.
Soracom now offers the SPRESENSE LTE-M IoT Connectivity Kit in its online store. The package also includes the official LTE Extension board for SPRESENSE, a Soracom IoT SIM card, and access to Soracom connectivity and platform services.
“Soracom is committed to partnering with leaders in hardware, software, and services to offer customers a robust global ecosystem that accelerates speed to market and success at scale,” said Kenta Yasukawa, co-founder and CTO, Soracom. “Sony’s SPRESENSE offers IoT innovators an exceptional platform for creation of new connected experiences that take full advantage of edge and the cloud.”
For more information on the SPRESENSE LTE-M IoT Connectivity Kit or to purchase, visit the Soracom store or the SPRESENSE webpage .
SPRESENSE™ is a trademark of Sony Group Corporation.
About SPRESENSE™
SPRESENSE is a low-power board computer for the IoT that is equipped with a GPS receiver and supports High-Resolution Audio codecs. The board allows for IoT versatility and can be developed for a vast range of uses, such as a drone utilizing the GPS and high-performance processor, a smart speaker utilizing High-Resolution Audio recording and playback as well as the built-in full-digital amplifier, or a low-power time-lapse camera utilizing the camera interface. SPRESENSE will make the IoT smarter and more efficient.
About Soracom
Soracom is leading the democratization of IoT connectivity, offering robust solutions specifically designed to make it easy to build, operate, and scale IoT deployments. Founded in 2015, Soracom now serves more than 20,000 startups, SMBs and global enterprises across all industries, from agriculture, energy, construction and transportation to consumer electronics, manufacturing, real estate and healthcare. Customers trust Soracom for affordable, reliable connectivity that accelerates speed to market, makes it easy to connect to the cloud, and offers access to a worldwide partner ecosystem. More information is available at www.soracom.io .
View source version on businesswire.com: https://www.businesswire.com/news/home/20220607005281/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 02:30:00 CET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom