WA-KYMETA
1.9.2021 15:02:07 CEST | Business Wire | Press release
Kymeta (www.kymetacorp.com ), the communications company making mobile global, announced today a launch of the Kymeta™ u8 MIL hybrid terminal, providing military users with a camouflaged, flexible, and more robust connectivity solution for communications-on-the-move (COTM) and networks-on-the-move (NOTM). The new terminal adds to the growing number of solutions offered by Kymeta based on the innovative u8 antenna technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210901005240/en/
The u8 MIL hybrid terminal utilizes Kymeta’s revolutionary software-defined, electronic beam-steering technology to transform military communications through the ruggedized, low-profile terminal, which is easy to mount on vehicles and vessels. Kymeta u8 MIL hybrid terminals integrate the iDirect 950mp router and support external modems such as Comtech 5650B, Viasat CBM400 and most commercial modems.
Offering a complete and customized solution, the u8 MIL features Military Standard (MIL-STD) shock mounts, military-specific connectors and wiring, a rugged shroud with expansion capabilities, and Chemical Agent Resistant Coating (CARC) in a weatherproofed radome. Kymeta’s u8 MIL hybrid terminal is designed to meet MIL-STD-810 and MIL-STD-461, contains embedded expansion capabilities for radio over internet protocol (RoIP) and software-defined networking in a wide area network (SD-WAN) and edge computing, maintains internal and external modem support, and has embedded modem(s) that are field upgradeable.
Kymeta Connect™ packages offer full-service connectivity solutions for u8 MIL hybrid terminals. Satellite Broadband by-the-gigabyte packages are available from Kymeta with either satellite or hybrid satellite/cellular capacity. TRANSEC services are also offered for the u8 MIL hybrid terminal.
“We are pleased to once again meet the connectivity needs of the military wherever and whenever they depend on it most,” said, Bill Marks, Executive Vice President and Chief Development Officer, of Kymeta. “For years, Kymeta’s advanced technology has been a proven resource for mission-critical operations. Our new u8 MIL hybrid terminal is tailored specifically for military users, providing them with a rapid-deployment solution and the fastest out-of-the-box communication anywhere.”
The announcement comes just less than two months after Kymeta was awarded placement on an Indefinite-Delivery/Indefinite-Quantity (IDIQ) with a $950M ceiling from the Department of Defense as part of a multiple award multi-level security effort to provide development and operation of systems as a unified force across air, land, sea, space, cyber, and electromagnetic spectrums.
About Kymeta
Kymeta is unlocking the potential of broadband satellite connectivity, combined with cellular networks, to satisfy the overwhelming demand for comms on the move and making mobile global. Lepton Global Solutions, a Kymeta company, hosts the company’s satellite connectivity solutions and offers unique, complete, and turnkey bundled solutions to the market based on best-in-class technologies and tailored customer-centric services that meet and exceed customer mission requirements. These solutions in tandem with the company’s flat-panel satellite antenna, the first of its kind, and Kymeta Connect™ services provide revolutionary mobile connectivity on satellite and hybrid satellite-cellular networks to customers around the world. Backed by U.S. and international patents and licenses, the Kymeta terminal addresses the need for lightweight, slim, and high-throughput communication systems that do not require mechanical components to steer toward a satellite. Kymeta makes connecting easy – for any vehicle, vessel, or fixed platform.
Kymeta is a privately held company based in Redmond, Washington.
For more information, visit kymetacorp.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20210901005240/en/
Link:
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 02:30:00 CET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom