TX-MOUSER-ELECTRONICS
7.7.2021 17:52:05 CEST | Business Wire | Press release
Mouser Electronics Inc. today releases the third installment of the 2021 series of its award-winning Empowering Innovation Together ™ program. The series’ third installment dives deep into artificial intelligence (AI), through an engaging collection of video, long-form articles, blog and infographic content.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210707005716/en/
Embedded electronics systems have continued to evolve alongside the development of machine-learning algorithms. Their union is giving rise to the concept of edge computing. As IoT developers tackle emerging IoT requirements, edge devices will play a central role in addressing the many challenges that lie ahead in large-scale IoT systems, including the necessary security requirements to protect private information.
“As AI impacts more and more aspects of our lives, people want to understand the many facets and potential of this new machine intelligence,” states Glenn Smith, President and CEO of Mouser Electronics. “The series will explore the true definition of AI and what the future may hold in terms of applications, issues, benefits and risks. We hope the series will inform and enlighten.”
The 2021 EIT series will also include four byte -sized videos , Then, Now and Next, in addition to articles , blogs, infographics and other content with discussions led by Mouser thought leaders and other experts. Future tech topics following artificial intelligence will delve deeper into connected cars and industrial automation and review new product technologies like sensors and RF and wireless. The program spotlights various new product developments and unveils the technical developments required to stay up to date with new trends in the marketplace.
The third episode of the series is sponsored by Mouser’s valued manufacturer partners Advantech, Intel® , Maxim Integrated, Microchip Technology, Micron, NXP Semiconductors, TE Connectivity and Xilinx.
Established in 2015, Mouser’s Empowering Innovation Together program is one of the industry’s most recognized electronic component programs. To learn more, visit https://www.mouser.com/empowering-innovation and follow Mouser on Facebook and Twitter .
For more Mouser news, visit https://www.mouser.com/newsroom/ .
About Mouser Electronics
Mouser Electronics, a Berkshire Hathaway company, is an authorized semiconductor and electronic component distributor focused on New Product Introductions from its leading manufacturer partners. Serving the global electronic design engineer and buyer community, the global distributor’s website, mouser.com, is available in multiple languages and currencies and features more than 5 million products from over 1,100 manufacturer brands. Mouser offers 27 support locations worldwide to provide best-in-class customer service in local language, currency and time zone. The distributor ships to over 630,000 customers in 223 countries/territories from its 1 million-square-foot, state-of-the-art distribution facilities in the Dallas, Texas, metro area. For more information, visit https://www.mouser.com/ .
Trademarks
Mouser and Mouser Electronics are registered trademarks of Mouser Electronics, Inc. All other products, logos, and company names mentioned herein may be trademarks of their respective owners.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210707005716/en/
Link:
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
HAZAMA ANDO Becomes an Official Partner in Helical Fusion’s Commercial Fusion Initiative and Signs MoU Toward Construction of the Fusion Pilot Plant6.7.2026 08:40:00 CEST | Press release
A long-established Japanese general contractor will contribute construction expertise to advance Fusion Pilot Plant development toward commercially viable fusion power. Helical Fusion Co., Ltd. (“Helical Fusion”), a Japan-based fusion energy startup developing fusion power plants, and HAZAMA ANDO CORPORATION (“HAZAMA ANDO”), a long-established Japanese general contractor, today announced that HAZAMA ANDO has become an Official Partner in the Helix Program, Helical Fusion’s commercial fusion initiative. The two companies have also signed a memorandum of understanding (“MoU”) to collaborate toward the construction of Helix KANATA, Helical Fusion’s Fusion Pilot Plant targeted for the 2030s. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260706176052/en/ (L-R) Kazuhiko Kuniya (Representative Director and President, HAZAMA ANDO CORPORATION) and Takaya Taguchi (Co-Founder and CEO, Helical Fusion Co., Ltd.) at a press conference in
Sofinnova Partners Announces Myricx Bio Agrees to Be Acquired by Novartis6.7.2026 07:15:00 CEST | Press release
Sofinnova Partners co-led the seed investment in 2019 and has supported the company from founding through to exitThe proposed acquisition combines the oncology expertise of Novartis with Myricx Bio’s novel ADC assets and platform having broad potential across multiple solid tumor typesMyricx Bio's first-in-class NMTi payload platform is designed to improve the therapeutic index of ADCs, offering the potential for more effective and better-tolerated treatment options for cancer patientsThe transaction valued at up to $1.5 billion including $1.1 billion cash upfront Sofinnova Partners, a leading European life sciences venture capital firm, today announced that its portfolio company Myricx Bio (“Myricx”) has reached agreement to be acquired by Novartis, for up to $1.5 billion including $1.1 billion cash upfront plus potential milestone payments. This marks Sofinnova Partners' seventh exit in three years. Myricx Bio is a UK-headquartered transatlantic biotech company focused on the discove
Global New Material International Wins Technology Innovation Best Practice Award at Sino-European ESG Conference6.7.2026 05:59:00 CEST | Press release
Global New Material International Holdings Ltd. has received the Technology Innovation Best Practice Award at the Third Sino-European Corporate ESG Best Practice Conference recently in Mainz, Germany, in recognition of its efforts to advance sustainable development through material innovation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260705533555/en/ Thorsten Giehler (L), Director of the Economic, Social Development and Employment Division of The German Society for International Cooperation (GIZ), delivered the award to Zhou Fangchao, Executive Director and Vice President of Global New Material International. The annual conference, initiated by the Chinese Consulate General in Frankfurt and jointly organized with Chinese and European partners, recognizes corporate best practices in environmental, social and governance (ESG) performance. This year's event brought together government officials, business leaders and exper
Access Advance Welcomes Samsung and Sharp to the VVC Advance Patent Pool6.7.2026 02:00:00 CEST | Press release
Access Advance LLC today announced significant additions to the VVC Advance Patent Pool, including Samsung Electronics and Sharp Corporation joining as both Licensors and Licensees. The additions strengthen Access Advance's position in VVC licensing, bringing two of the world's largest video codec patent holders into the program on both sides of the license. "The growth we are seeing in VVC Advance reflects the broad range of industries and companies that are moving toward VVC as the next standard for video delivery," said Peter Moller, CEO of Access Advance. "Samsung and Sharp joining as both Licensors and Licensees is significant, but so is the participation of leading smartphone brands and the range of consumer electronics and technology companies now executing licenses. We are building a program that reflects where the video market is actually heading." The following companies have joined the VVC Advance Patent Pool as Licensees since the beginning of 2026: American Future Technolo
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products atKitakami Plant Fab23.7.2026 12:19:00 CEST | Press release
Companies Showcase Ongoing Buildout of Manufacturing Infrastructure at K2 to Address Growing Demand for NAND Flash Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom