TX-MAVENIR
12.4.2021 19:03:06 CEST | Business Wire | Press release
Mavenir, the industry’s only end-to-end cloud-native Network Software Provider and a leader in accelerating software network transformation for communications service providers (CSPs), announced today the launch of an AI-on-5G Hyper Converged Edge solution working in close collaboration with NVIDIA.
Mavenir has developed this unique solution, based on NVIDIA’s hardware and software technologies, enabling Enterprises & Telcos to implement AI-on-5G applications for many promising verticals such as Manufacturing, Mining, and Healthcare that cover Industry 4.0 applications, including Industrial Internet of Things (IIoT), Intelligent Video Analytics (IVA) and Extended Reality (XR) and Gaming use cases. The use cases can be around remote and immersive collaboration, precision robotics control, people safety, intrusion detection, smart connected factories, real-time manufacturing component defect detection and proactive maintenance using near real-time analytics of sensor data.
5G enables an architecture for the smart connected factories and farms, cities, logistics operations in which wireless sensors, machinery, robots, and people can flexibly collaborate on the same system. It provides the speed, latency, and quality-of-service assurance required by mission-critical applications and eliminates the need for rigid and expensive local area networks (LANs) and indeterministic performance of the Wi-Fi systems. Mavenir’s Edge AI solution provides industry vertical use-cases and helps enterprises benefit from the confluence of 5G and AI.
Mavenir’s Edge AI solution can be deployed by CSPs to enhance their Mobile Edge Cloud offering by providing differentiated services to their enterprise customers and their network service users with enhanced revenue generating services such as gaming. This fully automated, dynamically scalable solution is also offered as a managed service for private networks deployment by enterprises.
“Mavenir is running its market-leading 5G stack on commercial off-the-shelf servers with GPUs, DPUs and associated software modules from NVIDIA and enhancing the solution by integrating Artificial Intelligence and Machine Learning algorithms running on the same hardware and platform. This unique hyperconvergence between the 5G stack and AI applications is the enabler of the key promises of Industry 4.0 and 5G,” says Kuntal Chowdhury, SVP & GM for the AI & Analytics Business Unit at Mavenir. “For Industry 4.0 and 5G, an innovative edge solution is required to process data in near real time and support wide carrier bandwidths to provide high data rate and low latency while maintaining low power consumption and overall cost-effectiveness.”
“Working with Mavenir, the power of AI-on-5G will soon become apparent across multiple industries,” said Ronnie Vasishta, senior vice president of Telecoms at NVIDIA. “The security and low latency of 5G, combined with the computing power of AI are set to transform whole industries and increase productivity around the world.”
The solution features NVIDIA’s highly flexible, power-optimized general-purpose graphics processing units (GPUs) with a high-level coding platform using NVIDIA CUDA, and Precision Time Protocol (PTP) data processing units (DPUs). This helps the efficient offload of all compute-intensive processing applications from the CPU to all in-line processing in GPUs and DPUs, making it flexible to program and upgrade while minimizing maintenance costs and energy usage.
About Mavenir:
Mavenir is building the future of networks and pioneering advanced technology, focusing on the vision of a single, software-based automated network that runs on any cloud. As the industry's only end-to-end, cloud-native network software provider, Mavenir is focused on transforming the way the world connects, accelerating software network transformation for 250+ Communications Service Providers in over 120 countries, which serve more than 50% of the world’s subscribers. www.mavenir.com
View source version on businesswire.com: https://www.businesswire.com/news/home/20210412005272/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
