TSMC
16.9.2021 11:09:10 CEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM) today marked the International Day for the Preservation of the Ozone Layer with a commitment to reach net zero emissions by 2050. The Company also published its Task Force on Climate-related Financial Disclosures (TCFD) Report, becoming a semiconductor industry frontrunner in climate disclosure while taking actions towards the Company’s environmental sustainability goals.
As a responsible corporate citizen, TSMC strives to adapt to climate change and mitigate climate impact to protect our shared global environment. Guided by its ESG Policy and Environmental Policy, TSMC actively plans and implements actions to mitigate climate change, closely tracks a wide range of global climate action indicators, and is now taking a step further to create its roadmap to reach net zero emissions.
In 2018, TSMC published its Climate Change Statement, clearly stating that the Company addresses climate change through the two key measures of impact mitigation and risk adaption. At the same time, TSMC adopted the framework set by the Financial Stability Board's TCFD to identify risks and opportunities, as well as to set measurement benchmarks and manage targets. With an effective grasp of the progress and results of its actions taken on climate change, TSMC is able to lower the financial impact of climate risk on operations, and disclose results in the TSMC Corporate Social Responsibility Report.
To further address stakeholders’ concerns on climate change and focus on related issues, TSMC followed the TCFD framework and its spirit to publish the TCFD report in 2021, systematically disclosing management strategy and targets, ensuring sound execution and controls, and providing a comprehensive description of TSMC’s work and progress in responding to climate change.
“TSMC is deeply aware that climate change has a severe impact on the environment and humanity. As a world-leading semiconductor company, TSMC must shoulder its corporate responsibility to face the challenge of climate change,” said Dr. Mark Liu, Chairman of TSMC and Chairman of the Company’s ESG Steering Committee. “In addition to becoming the world’s first semiconductor company to join RE100, this year we have answered the call to action on net zero and published our TCFD report, aiming to broaden our green influence and drive the industry towards low-carbon sustainability.”
In 2020, TSMC established its Net Zero Project, composed of working groups from relevant organizations which discuss and evaluate the net zero target. In the same year, TSMC’s global offices achieved net zero emissions of greenhouse gases. To achieve its goal of net zero by 2050, TSMC will set related mitigation measures, continue to strengthen its wide variety of green innovations, and actively adopt renewable energy. The Company has set the short-term goals of zero emissions growth by 2025, and reducing emissions to year 2020 levels by 2030. TSMC will continue actively evaluating and investing in all types of opportunities to reduce carbon emissions.
For TSMC 2020 TCFD Report, please visit https://esg.tsmc.com/download/csr/TSMC_TCFD_Report_E.pdf
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information, please visit https://www.tsmc.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20210916005379/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Quectel Unveils Versatile Pi Series SBCs to Power Developer Innovation10.3.2026 09:00:00 CET | Press release
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of its range of Quectel Pi series of single-board computers (SBCs), designed for a broad range of industrial use cases. The portfolio currently includes three compact development platforms - the Quectel Pi M1, L1, and H1 boards - engineered for low power consumption, cost efficiency, and full-stack software support. Designed to accelerate prototyping and product development, they are well suited for embedded applications, IoT solutions, robotics projects, and edge computing deployments. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310949640/en/ Quectel unveils versatile Pi series SBCs to power developer innovation “We’re delighted to launch the affordable, versatile, open source Quectel Pi series of SBCs to help developers of real IoT projects in areas such as home automation, robotics, sensors and edge computing to achiev
Expereo Appoints Kevin Brown as Chief Operating Officer to Drive Operational Excellence and Customer-Focused Growth10.3.2026 09:00:00 CET | Press release
Expereo, the world-leading Managed Network as a Service (NaaS) provider, today announces the appointment of Kevin Brown as Chief Operating Officer (COO), reinforcing the company’s focus on operational integration, efficiency, and scaling its customer and supplier-facing functions globally. Brown will assume overall accountability for operational strategy, transformation delivery, and performance across all customer and supplier-facing functions, while working in close partnership with the Digital Office, to deliver on our digital transformation. He brings extensive global operational leadership experience across Telco, Cybersecurity, and SaaS, most recently serving as Global COO of NCC Group, where he built and scaled operating models to drive customer experience, efficiency, and growth. Earlier in his career, Brown led the cybersecurity business at BT, establishing a strong track record of transforming operations into engines of value creation at scale. Kevin Brown, Chief Operating Of
Cooler Master Earns Four iF Design Awards 2026 for PC Design Innovation10.3.2026 08:07:00 CET | Press release
COSMOS Alpha, MasterFrame 360 Panorama, Custom GPU Fan Cooling Kit, and MasterFan A120 Recognized for Outstanding Product Design Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced that four of its products have received the iF DESIGN AWARD 2026, one of the world’s most respected design honors presented annually by iF Design in Hamburg, Germany. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310659475/en/ Cooler Master's winning iF designs: MasterFan A120, MasterFrame 360 Panorama, COSMOS Alpha and Custom GPU Fan Cooling Kit. The award recognizes outstanding achievement in product design, innovation, and user experience. For Cooler Master, the recognition highlights a design philosophy that combines engineering performance with builder-focused creativity. The award-winning products include the COSMOS Alpha, MasterFrame 360 Panorama, Custom GPU Fan Cooling Kit, and MasterFan A120,
GigaDevice Expands GD25UF Series Density Empowering AI Computing with 1.2V Ultra-Low Power Storage10.3.2026 08:00:00 CET | Press release
GigaDevice (HKEX: 3986), a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today announced the expanded density range of its GD25UF series 1.2V ultra-low power SPI NOR Flash, now spanning from 8Mb to 256Mb. This expansion precisely addresses diverse storage needs across wide range of applications from the advanced high performance AI computing space to the low power battery operated devices. From its intrinsic low-voltage and ultra-low power performance, portable devices like wearables, hearables, AI ASIC platforms, medical devices, and other fast-growing emerging markets can have longer battery life while driving device miniaturization from edge AI to ultra-compact form factors. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310862079/en/ GD25UF SPI NOR Flash Expanded Density Powering the Low-Voltage SoC Era with a Smarter System Architecture As se
GigaDevice Introduces GD32M531 MCU, Empowering Technological Innovation in Motor Control10.3.2026 08:00:00 CET | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products today officially announced the launch of the GD32M531 series 32-bit microcontrollers (MCUs) specifically tailored for motor control applications. Powered by the Arm® Cortex®-M33 core, the series integrates dedicated hardware accelerators for motor control and highly integrated peripheral resources. With exceptional computing performance, precise control capability, and industrial-grade high reliability, it achieves accurate control of dual motors + PFC, providing a high-efficiency and cost-effective solution for various home appliance application scenarios such as air conditioner outdoor units, air source heat pumps, washing machines/dryers, dishwashers, and multi-burner induction cookers. Samples and development boards of the GD32M531 series MCU are now available, and mass production and supply will officially start in April. This press release feature
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
