TSMC
2.6.2021 01:02:13 CEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium. Taking place online for a second year, the symposium connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphone and WiFi 6/6e performance, N5A for state-of-the-art automotive applications, and enhancements across the range of 3DFabric technologies. Over 5,000 customers and technology partners around the world have registered for our 2021 Technology Symposium, being held from June 1-2.
“Digitalization is transforming society faster than ever as people use technology to overcome the barriers created by the global pandemic to connect, collaborate, and solve problems,” said Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a new world full of opportunities for the semiconductor industry. Our global Technology Symposium highlights many of the ways we are enhancing and expanding our technology portfolio to unleash our customers’ innovations.”
Advanced Technology Leadership – N5, N4, N5A, and N3
TSMC was first in the industry to bring 5 nanometer (nm) technology into volume production in 2020 with defect density improving faster than the preceding 7nm generation. The N4 enhancement to the 5nm family further improves performance, power efficiency and transistor density along with the reduction of mask layers and close compatibility in design rules with N5. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021.
TSMC is introducing N5A , the newest member of the 5nm family; the N5A process is aimed at satisfying the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits. N5A brings the same technology used in supercomputers today to vehicles, packing the performance, power efficiency, and logic density of N5 while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2 as well as other automotive safety and quality standards. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be available in third quarter of 2022.
TSMC’s N3 technology is poised to be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain.
Advanced Radio Frequency Technology for the 5G Era – N6RF
5G smartphones require more silicon area and consume more power to deliver higher wireless data rates compared with 4G. 5G enabled chips integrate more functionality and components and are increasingly growing in size and competing against the battery for a limited amount of space inside the smartphone.
TSMC debuted the N6RF process, which brings the power, performance, and area benefits of its advanced N6 logic process to 5G radio frequency (RF) and WiFi 6/6e solutions. N6RF transistors achieve more than 16% higher performance over the prior generation of RF technology at 16nm. Additionally, N6RF supports significant power and area reduction for 5G RF transceivers for both sub-6 gigahertz and millimeter wave spectrum bands without compromising performance, features and battery life offered to consumers. TSMC N6RF will also enhance WiFi 6/6e performance and power efficiency.
TSMC 3DFabric System Integration Solutions
TSMC continues to expand its comprehensive 3DFabric family of 3D silicon stacking and advanced packaging technologies.
- For high-performance computing applications, TSMC will be offering larger reticle-size for both its InFO_oS and CoWoS® packaging solutions in 2021, enabling larger floor plans for chiplet and high-bandwidth memory integration. Additionally, the chip-on-wafer (CoW) version of TSMC-SoIC™ will be qualified on N7-on-N7 this year with production targeted for 2022 at a new fully-automated factory.
- For mobile applications, TSMC is introducing its InFO_B solution, designed to integrate a powerful mobile processor in a slim, compact package with enhanced performance and power efficiency and support mobile device makers’ DRAM stacking on the package.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20210601005871/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Andersen Consulting styrker sit cybersikkerhedstilbud gennem samarbejde med Trillium Information Security Systems21.3.2026 02:16:00 CET | Pressemeddelelse
Andersen Consulting udbygger sine kompetencer inden for teknologi og risikostyring gennem en samarbejdsaftale med Trillium Information Security Systems (TISS), et cybersikkerhedsfirma. Med en tilstedeværelse i Canada og Pakistan leverer TISS omfattende cybersikkerhedsløsninger til organisationer inden for finans, telekommunikation og den offentlige sektor. Virksomhedens team tilbyder et bredt udvalg af ydelser, herunder sikkerhedsvurderinger, managed security operations, red team-tjenester, digital efterforskning og hændelsesrespons samt GRC-rådgivning. Med næsten to årtiers erfaring leverer TISS adaptive, efterretningsdrevne forsvarsmekanismer, der hjælper kunder med at forudse og reagere på cybertrusler, der er i konstant udvikling. "Hos TISS arbejder vi på at skabe et mere sikkert digitalt miljø ved at give organisationer mulighed for at operere sikkert og med selvtillid," udtalte Mahir Mohsin Sheikh, administrerende direktør for TISS. "Vores samarbejde med Andersen Consulting giver
Andersen Consulting udvider sin teknologiplatform i Frankrig20.3.2026 17:28:00 CET | Pressemeddelelse
Andersen Consulting udvider sit udbud inden for digital transformation med en samarbejdsaftale med Teolia Consulting, et fransk firma, der specialiserer sig i projekt- og produktstyring, cloud-platformsudvikling, datatransformation samt implementering og brug af Atlassian-pakken. Teolia Consulting blev grundlagt i 2014 og hjælper organisationer med at opnå digital performance, fra agile metoder til løsninger, der reducerer lanceringstiden. Virksomhedens ekspertise består i at levere integrerede strategier, der bringer teknologi og organisatorisk forandring i overensstemmelse. Virksomheden arbejder på tværs af brancher, herunder inden for bank- og finanssektoren, forsikring, mode og detailhandel, og hjælper kunder med at få større robusthed og accelerere deres digitale modenhed. "Hos Teolia Consulting mener vi, at ægte transformation opstår, når teknologi og mennesker udvikler sig sammen," sagde Lucienne Jacquet, der er administrerende partner i Teolia. "Ved at samarbejde med Andersen C
Incyte to Highlight Late-Breaking Hidradenitis Suppurativa Data at the 2026 American Academy of Dermatology (AAD) Annual Meeting20.3.2026 15:00:00 CET | Press release
- New, late-breaking 54-week data for povorcitinib in hidradenitis suppurativa (STOP-HS1 & STOP-HS2) to be highlighted - Featured abstracts for ruxolitinib cream (Opzelura®) and povorcitinib include multiple ePosters in atopic dermatitis, hidradenitis suppurativa and vitiligo Incyte (Nasdaq:INCY) today announced that data from key programs in its Inflammation and Autoimmunity (IAI) franchise will be presented at the 2026 American Academy of Dermatology (AAD) Annual Meeting, to be held March 27 – 31, 2026, in Denver. “At AAD 2026, we are presenting late‑breaking 54-week results from the Phase 3 STOP‑HS program evaluating povorcitinib in hidradenitis suppurativa (HS),” said Jim Lee, M.D., Ph.D., Group Vice President, Inflammation and Autoimmunity, Incyte. “These data provide longer term evidence of the safety and efficacy of povorcitinib in HS patients and further strengthen the significant growth potential of our Inflammation and Autoimmunity franchise.” Details on key data presentation
MUSASHI JAPAN by TAIMATSU Launches “Road to Shogun” – A Journey Through Craftsmanship and Discovery20.3.2026 13:58:00 CET | Press release
Musashi Japan by TAIMATSU Co., Ltd., a contemporary Japanese knife brand rooted in the spirit of craftsmanship and cultural harmony, has announced its newest experiential campaign: “Road to Shogun.” This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260320887471/en/ Designed as the brand’s most ambitious customer journey to date, the campaign invites visitors to explore participating Musashi Japan stores while discovering the traditions, culture and craftsmanship that inspire the brand. Inspired by the journey towards mastery, the experience encourages participants to progress through a series of ranks whilst visiting stores and unlocking rewards that celebrate elements of everyday Japanese culture. At Musashi Japan, craftsmanship is not only about the final product, but also about the path taken to achieve mastery. The Road to Shogun reflects this philosophy by guiding customers through a journey that mirrors the dedication, cu
Futur Delivers Strong Growth and Record Profit in 202520.3.2026 12:05:00 CET | Press release
In 2025, Futur added 21,000 new customers and the inflows amounted to 34 billion kronor. At the end of the year, the total savings capital was 252 billion kronor, an increase of 7% from the previous year and a new record level. "2025 was a record year for Futur. In a market characterized by sharp market fluctuations, Futur continued to invest, grow and deliver strong results. Behind this record performance is stable customer growth, strong inflows and cost discipline. Our close cooperation with over 60 partners gives customers the freedom to choose the asset management and advisory services that best suit them. The strategy of letting the customer choose is appreciated, which is reflected in us welcoming more than 21,000 new customers during the year", says Torgny Johansson, CEO of Futur. "We are optimistic about the future. Futur has great opportunities to continue growing in the coming years by developing innovative and efficient services for savings and pensions. I am proud of how a
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom