TSMC
2.6.2021 01:02:13 CEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium. Taking place online for a second year, the symposium connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphone and WiFi 6/6e performance, N5A for state-of-the-art automotive applications, and enhancements across the range of 3DFabric technologies. Over 5,000 customers and technology partners around the world have registered for our 2021 Technology Symposium, being held from June 1-2.
“Digitalization is transforming society faster than ever as people use technology to overcome the barriers created by the global pandemic to connect, collaborate, and solve problems,” said Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a new world full of opportunities for the semiconductor industry. Our global Technology Symposium highlights many of the ways we are enhancing and expanding our technology portfolio to unleash our customers’ innovations.”
Advanced Technology Leadership – N5, N4, N5A, and N3
TSMC was first in the industry to bring 5 nanometer (nm) technology into volume production in 2020 with defect density improving faster than the preceding 7nm generation. The N4 enhancement to the 5nm family further improves performance, power efficiency and transistor density along with the reduction of mask layers and close compatibility in design rules with N5. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021.
TSMC is introducing N5A , the newest member of the 5nm family; the N5A process is aimed at satisfying the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits. N5A brings the same technology used in supercomputers today to vehicles, packing the performance, power efficiency, and logic density of N5 while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2 as well as other automotive safety and quality standards. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be available in third quarter of 2022.
TSMC’s N3 technology is poised to be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain.
Advanced Radio Frequency Technology for the 5G Era – N6RF
5G smartphones require more silicon area and consume more power to deliver higher wireless data rates compared with 4G. 5G enabled chips integrate more functionality and components and are increasingly growing in size and competing against the battery for a limited amount of space inside the smartphone.
TSMC debuted the N6RF process, which brings the power, performance, and area benefits of its advanced N6 logic process to 5G radio frequency (RF) and WiFi 6/6e solutions. N6RF transistors achieve more than 16% higher performance over the prior generation of RF technology at 16nm. Additionally, N6RF supports significant power and area reduction for 5G RF transceivers for both sub-6 gigahertz and millimeter wave spectrum bands without compromising performance, features and battery life offered to consumers. TSMC N6RF will also enhance WiFi 6/6e performance and power efficiency.
TSMC 3DFabric System Integration Solutions
TSMC continues to expand its comprehensive 3DFabric family of 3D silicon stacking and advanced packaging technologies.
- For high-performance computing applications, TSMC will be offering larger reticle-size for both its InFO_oS and CoWoS® packaging solutions in 2021, enabling larger floor plans for chiplet and high-bandwidth memory integration. Additionally, the chip-on-wafer (CoW) version of TSMC-SoIC™ will be qualified on N7-on-N7 this year with production targeted for 2022 at a new fully-automated factory.
- For mobile applications, TSMC is introducing its InFO_B solution, designed to integrate a powerful mobile processor in a slim, compact package with enhanced performance and power efficiency and support mobile device makers’ DRAM stacking on the package.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20210601005871/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Agent Assurance by TestMu AI Is Now Generally Available, Letting Teams Test What Their AI Agents Actually Change26.10.2026 16:15:00 CET | Press release
The trial includes 4,000 credits and four concurrent runs, so a team can generate functional and adversarial suites from its own agent's docs and endpoint, with code optional, and gate CI on evidence-backed verdicts without booking a demo. TestMu AI (formerly LambdaTest), the world's first Agentic AI-powered Quality Engineering platform, today announced the general availability of Agent Assurance. Agent Assurance tests AI agents that take actions, such as calling tools, writing files, and changing records, by checking what a run actually changed rather than what the agent says it did. Any team can now create a TestMu AI account and run it against its own agent without booking a demo first. Agent Assurance launched on August 17, 2026, behind a waitlist and a guided onboarding session. Since then, Rook, the CLI that runs Agent Assurance, has shipped a steady run of releases, shaped by feedback from early teams. Agent evaluation has mostly graded the final reply, and that reply can be wro
Actiphy Announces ImageServer for Centralized Backup Storage and Post-Backup Processing26.10.2026 16:13:00 CET | Press release
New platform combines centralized backup management, Inter-File Deduplication, automated workflows, and remote replication. Actiphy™, Inc., a provider of backup, disaster recovery, and virtualization software, today announced Actiphy ImageServer™, a centralized platform for storing, managing, verifying, and replicating backups created with ActiveImage Protector™. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261026410729/en/ Actiphy ImageServer Console ImageServer combines the management capabilities of Actiphy ImageCenter™ with the secure storage of Actiphy StorageServer™. By moving Verify, Replication, Consolidation, and BootCheck™ to a dedicated server, ImageServer reduces processing load on protected systems and simplifies backup administration. As organizations protect more systems and retain more backup generations, storage and administrative demands grow. ImageServer addresses these challenges by centralizing backup
Dubai Chambers Launches World's First Agentic AI Marketplace by a Chamber of Commerce26.10.2026 16:06:00 CET | Press release
Dubai Chambers has launched Chamber AI Hub, the world's first Agentic AI marketplace developed by a chamber of commerce, enabling businesses in Dubai to access ready-to-use AI agents that independently perform a range of administrative and operational tasks. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261026467531/en/ H.E. Sultan bin Saeed Al Mansoori Chairman of Dubai Chambers. (Photo: AETOSWire) The marketplace currently offers 22 specialised AI agents across seven business functions including Compliance, Procurement, Operations, Finance, Sales, Human Resources, and Logistics. The offering is set to expand to 100 agents. The initiative supports Dubai's efforts to accelerate the adoption of Agentic AI across the private sector, helping businesses enhance efficiency, strengthen competitiveness, and transform their operating models. H.E. Eng. Sultan bin Saeed Al Mansoori, Chairman of Dubai Chambers, commented: “Success in
Media Release: Allianz Beach Arena for the LA28 Olympic and Paralympic Games Joins the Allianz Family of Stadiums26.10.2026 15:37:00 CET | Press release
First Olympic and Paralympic venue in history to display the Allianz name and the eighth member of the Allianz Family of Stadiums.The nearly 15,000 seat temporary arena on the Long Beach waterfront will host Olympic Beach Volleyball and Paralympic Blind Football (Soccer).Allianz unveils its customized LA28 Games emblem, marking the start of its preparations for the LA28 Olympic and Paralympic Games. For the first time in Olympic and Paralympic history, a competition venue will carry the Allianz name. The Allianz Beach Arena in Long Beach, California, for the LA28 Olympic and Paralympic Games will become the newest member of the Allianz Family of Stadiums. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261026919959/en/ Allianz's "custom A" emblem for LA28. From Horse Guards Parade in London to Copacabana Beach in Rio and the Eiffel Tower in Paris, Olympic Beach Volleyball has always found its home in iconic settings around th
Even Realities Brings Classic Tortoiseshell Design to Smart Glasses with New Even G2 Brown 226.10.2026 15:00:00 CET | Press release
The new brown colorway pairs traditional eyewear craftsmanship with display-first technology, alongside Even G2 Clip (Polarized) and Even G2 Chain Even Realities, the company behind camera-free, display-first smart glasses, today introduced Brown 2, a new tortoiseshell-inspired colorway for Even G2, alongside two accessories: Even G2 Clip (Polarized) and the Even G2 Chain. Designed to bring the warmth and character of traditional tortoiseshell eyewear to smart glasses, Brown 2 features a newly developed material that carries its layered pattern throughout the frame rather than applying it as a surface finish. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261026502782/en/ Even G2 Chain. Photo Credit: Even Realities Each frame is individually shaped, pressed, tumbled, and polished for 20 hours, creating subtle variations that make every pair unique. Brown 2 is also the lightest Even G2 design to date, while retaining the came
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom