TSMC
TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium. Taking place online for a second year, the symposium connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphone and WiFi 6/6e performance, N5A for state-of-the-art automotive applications, and enhancements across the range of 3DFabric technologies. Over 5,000 customers and technology partners around the world have registered for our 2021 Technology Symposium, being held from June 1-2.
“Digitalization is transforming society faster than ever as people use technology to overcome the barriers created by the global pandemic to connect, collaborate, and solve problems,” said Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a new world full of opportunities for the semiconductor industry. Our global Technology Symposium highlights many of the ways we are enhancing and expanding our technology portfolio to unleash our customers’ innovations.”
Advanced Technology Leadership – N5, N4, N5A, and N3
TSMC was first in the industry to bring 5 nanometer (nm) technology into volume production in 2020 with defect density improving faster than the preceding 7nm generation. The N4 enhancement to the 5nm family further improves performance, power efficiency and transistor density along with the reduction of mask layers and close compatibility in design rules with N5. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021.
TSMC is introducing N5A , the newest member of the 5nm family; the N5A process is aimed at satisfying the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits. N5A brings the same technology used in supercomputers today to vehicles, packing the performance, power efficiency, and logic density of N5 while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2 as well as other automotive safety and quality standards. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be available in third quarter of 2022.
TSMC’s N3 technology is poised to be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain.
Advanced Radio Frequency Technology for the 5G Era – N6RF
5G smartphones require more silicon area and consume more power to deliver higher wireless data rates compared with 4G. 5G enabled chips integrate more functionality and components and are increasingly growing in size and competing against the battery for a limited amount of space inside the smartphone.
TSMC debuted the N6RF process, which brings the power, performance, and area benefits of its advanced N6 logic process to 5G radio frequency (RF) and WiFi 6/6e solutions. N6RF transistors achieve more than 16% higher performance over the prior generation of RF technology at 16nm. Additionally, N6RF supports significant power and area reduction for 5G RF transceivers for both sub-6 gigahertz and millimeter wave spectrum bands without compromising performance, features and battery life offered to consumers. TSMC N6RF will also enhance WiFi 6/6e performance and power efficiency.
TSMC 3DFabric System Integration Solutions
TSMC continues to expand its comprehensive 3DFabric family of 3D silicon stacking and advanced packaging technologies.
- For high-performance computing applications, TSMC will be offering larger reticle-size for both its InFO_oS and CoWoS® packaging solutions in 2021, enabling larger floor plans for chiplet and high-bandwidth memory integration. Additionally, the chip-on-wafer (CoW) version of TSMC-SoIC™ will be qualified on N7-on-N7 this year with production targeted for 2022 at a new fully-automated factory.
- For mobile applications, TSMC is introducing its InFO_B solution, designed to integrate a powerful mobile processor in a slim, compact package with enhanced performance and power efficiency and support mobile device makers’ DRAM stacking on the package.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20210601005871/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Northern Escape Heli-Skiing Takes the Title of “World’s Best Heli-Ski-Operator” for the 4th Year Running5.12.2025 02:40:00 CET | Press release
4x World’s Best Heli-Skiing Operation near Terrace, BC Northern Escape Heli-Skiing (NEH) has been named World’s Best Heli-Ski Operator 2025 by the World Ski Awards, marking its fourth straight victory following years 2022, 2023 and 2024. This recognition places NEH amongst an elite group of ski tourism operators consistently voted best in the world by industry leaders and enthusiasts alike. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251204074550/en/ A four-year run built on reliability NEH operates in British Columbia’s Skeena Mountains, where deep northern snow and vast terrain come together with small-group heli-skiing and heli snowboarding. When helicopters can’t safely fly, NEH has cat skiing readily available as a backup — an exceedingly rare offering in this industry. The operation spans over 833,571 wild acres of alpine bowls, glaciers and old-growth tree skiing. The NEH experience Guests choose from three lodge f
IDE034, a Bispecific ADC Licensed by Biocytogen to IDEAYA, Receives FDA IND Clearance5.12.2025 01:00:00 CET | Press release
Biocytogen Pharmaceuticals (Beijing) Co., Ltd. (Biocytogen, HKEX: 02315), announced that its partner IDEAYA Biosciences, Inc. (Nasdaq: IDYA), a precision oncology company, has received the clearance of an investigational new drug (IND) application with the U.S. Food and Drug Administration (FDA) for the initiation of a Phase 1 clinical trial of IDE034, a potential first-in-class B7H3/PTK7 bispecific antibody-drug conjugate (ADC). IDEAYA expects to begin patient enrollment in Q1 2026, initially evaluating patients with solid tumors known to express B7H3 and PTK7, including lung, colorectal, head and neck, and ovarian/gynecological cancers. IDE034 is a bispecific B7H3/PTK7 TOP1 ADC, independently developed by Biocytogen and licensed to IDEAYA in July 2024. The IND clearance marks an important milestone for this licensed program, supporting subsequent clinical development of IDE034, while highlighting Biocytogen’s technical capabilities in bispecific ADC discovery and development. Dr. Yue
Helical Fusion, Developer of Next-Generation Clean Energy Through Nuclear Fusion, Completes USD 5.5M Series A Extension Round5.12.2025 01:00:00 CET | Press release
Stakeholder base expands with participation from an individual-investor-oriented fund, alongside corporate and individual investors, bringing Total Funding to USD 38M Helical Fusion Co., Ltd. (Head Office: Chuo-ku, Tokyo; CEO: Takaya Taguchi; hereafter “Helical Fusion”), which is developing a next-generation energy source using Japan’s original Helical Stellarator technology to realize commercially viable fusion power plant in the 2030s, announced the completion of its Series A Extension round, raising approximately USD 5.5 million (≈ JPY 870 million). The round included investments from “Ecrowd NEXT”, a fund designed for individual investors, as well as multiple corporate investors and individual investors. As a result, Helical Fusion’s total Series A funding, including loans, amounts to approximately USD 21 million (≈ JPY 3.2 billion), bringing the company’s cumulative fundraising—including grants and loans—to approximately USD 38 million (≈ JPY 6.0 billion). With this funding, Helic
Andersen Consulting udvider sin tilstedeværelse gennem samarbejde med Hilal Technology4.12.2025 23:04:00 CET | Pressemeddelelse
Andersen Consulting indgår en samarbejdsaftale med Hilal Technology for at styrke sine kompetencer inden for digital infrastruktur, cybersikkerhed og AI. Med tilstedeværelse i Bahrain, Saudi-Arabien, De Forenede Arabiske Emirater, Oman og Indien leverer Hilal Technology et komplet spektrum af digital infrastruktur og managed services inden for cloudcomputing, cybersikkerhed, enterprise ai og systemintegration. Deres ydelser omfatter cloudtjenester, sikkerheds- og netværksdrift, implementering af ERP og applikationer samt udvikling af generative ai-kapaciteter. Med et team på mere end 250 fagfolk servicerer firmaet en bred vifte af brancher, herunder den finansielle sektor, olie og gas, logistik og den offentlige sektor. "Transformation er mere end systemer; det handler om parathed, tillid og løbende samarbejde," udtaler Roshan George, direktør for Hilal Technology. "Vi er begejstrede for at samarbejde med Andersen Consulting og levere skalerbare løsninger, der matcher tempoet i den dig
Xsolla Integrates MVola as a Payment Method to Enable Instant, Card-Free Payments for Gamers in Madagascar’s Mobile-First Market4.12.2025 21:00:00 CET | Press release
MVola Integration Enhances Payment Accessibility And Supports The Growth Of Madagascar’s Thriving Mobile Gaming Ecosystem Xsolla, a global video game commerce company that helps developers launch, grow, and monetize their games, today announced that MVola, Madagascar’s number one digital wallet, is now available as a payment option for players across the country. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251204268075/en/ Chris Hewish, President of Xsolla Madagascar is a fast-growing, mobile-first market of 32 million people, where digital wallets are the primary driver of daily transactions. MVola, recently licensed as a digital bank, has established itself as the leading wallet in the country, with over 10 million users and powering more than 1 billion transactions annually. By adding MVola as a payment method to its portfolio, Xsolla removes the friction of card payments, enabling players to pay seamlessly with a trus
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom