TSMC
2.6.2021 01:02:13 CEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium. Taking place online for a second year, the symposium connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphone and WiFi 6/6e performance, N5A for state-of-the-art automotive applications, and enhancements across the range of 3DFabric technologies. Over 5,000 customers and technology partners around the world have registered for our 2021 Technology Symposium, being held from June 1-2.
“Digitalization is transforming society faster than ever as people use technology to overcome the barriers created by the global pandemic to connect, collaborate, and solve problems,” said Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a new world full of opportunities for the semiconductor industry. Our global Technology Symposium highlights many of the ways we are enhancing and expanding our technology portfolio to unleash our customers’ innovations.”
Advanced Technology Leadership – N5, N4, N5A, and N3
TSMC was first in the industry to bring 5 nanometer (nm) technology into volume production in 2020 with defect density improving faster than the preceding 7nm generation. The N4 enhancement to the 5nm family further improves performance, power efficiency and transistor density along with the reduction of mask layers and close compatibility in design rules with N5. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021.
TSMC is introducing N5A , the newest member of the 5nm family; the N5A process is aimed at satisfying the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits. N5A brings the same technology used in supercomputers today to vehicles, packing the performance, power efficiency, and logic density of N5 while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2 as well as other automotive safety and quality standards. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be available in third quarter of 2022.
TSMC’s N3 technology is poised to be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain.
Advanced Radio Frequency Technology for the 5G Era – N6RF
5G smartphones require more silicon area and consume more power to deliver higher wireless data rates compared with 4G. 5G enabled chips integrate more functionality and components and are increasingly growing in size and competing against the battery for a limited amount of space inside the smartphone.
TSMC debuted the N6RF process, which brings the power, performance, and area benefits of its advanced N6 logic process to 5G radio frequency (RF) and WiFi 6/6e solutions. N6RF transistors achieve more than 16% higher performance over the prior generation of RF technology at 16nm. Additionally, N6RF supports significant power and area reduction for 5G RF transceivers for both sub-6 gigahertz and millimeter wave spectrum bands without compromising performance, features and battery life offered to consumers. TSMC N6RF will also enhance WiFi 6/6e performance and power efficiency.
TSMC 3DFabric System Integration Solutions
TSMC continues to expand its comprehensive 3DFabric family of 3D silicon stacking and advanced packaging technologies.
- For high-performance computing applications, TSMC will be offering larger reticle-size for both its InFO_oS and CoWoS® packaging solutions in 2021, enabling larger floor plans for chiplet and high-bandwidth memory integration. Additionally, the chip-on-wafer (CoW) version of TSMC-SoIC™ will be qualified on N7-on-N7 this year with production targeted for 2022 at a new fully-automated factory.
- For mobile applications, TSMC is introducing its InFO_B solution, designed to integrate a powerful mobile processor in a slim, compact package with enhanced performance and power efficiency and support mobile device makers’ DRAM stacking on the package.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20210601005871/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Money20/20 Europe Celebrates Ten Years of Industry Leadership as AI, Digital Assets and Financial Sovereignty Take Centre Stage8.6.2026 17:37:00 CEST | Press release
Money20/20, the world's leading fintech show and the place where money does business, celebrated a major milestone with its 10th Europe edition, convening more than 7,500 attendees, one in three at C-suite level, and over 2,300 companies from over 105 countries in Amsterdam, for three days of industry-defining announcements, strategic partnerships, and dealmaking that set the agenda for the future of financial services. Featuring more than 450 speakers across six stages, Money20/20 Europe welcomed leaders from banking, fintech, payments, policy, technology and digital assets to explore the forces reshaping the future of money. “This year’s show demonstrated that financial services have entered a new phase of transformation,” said Bryony Naylor, Vice President of Money20/20 Europe. “Across the show floor and on stage, we saw leaders move beyond discussing what’s next to actively building it. From AI and digital identity to financial sovereignty and digital assets, the conversations and
Liberty Latin America Selects BTS as Exclusive A2P Messaging Managed Services Partner Across All Its Markets8.6.2026 17:36:00 CEST | Press release
BTS announced today that it has been chosen as the exclusive provider of managed A2P SMS services for Liberty Latin America (LLA), supporting the company’s efforts to strengthen revenue protection, fraud mitigation, traffic intelligence, and operational visibility across its markets. The agreement reinforces LLA’s A2P messaging strategy throughout a broad regional footprint and establishes a coordinated operating model to improve control, visibility, and monetization of A2P traffic across its markets. The partnership will support revenue maximization, stronger fraud protection and grey-route mitigation, enhanced real-time traffic visibility, operational reporting and analytics, revenue assurance, and 24x7x365 managed services support. The agreement spans 25 markets and reflects a high level of operational trust in BTS’ ability to deliver consistent performance across diverse regulatory, technical, and commercial environments. “This agreement gives us a stronger and more consistent oper
The Estée Lauder Companies Strengthens UK Manufacturing Network as Whitman Facility Celebrates 60 Years of British Craftsmanship8.6.2026 17:14:00 CEST | Press release
As The Estée Lauder Companies’ (NYSE: EL) Whitman manufacturing facility celebrates its 60th anniversary, the company today announced a strategic investment that will strengthen its UK manufacturing network, further reinforcing its long-standing commitment to British craftsmanship, innovation, and growth in prestige fragrance. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260608415843/en/ From left to right: Jo Dancey, Global Brand President, Jo Malone London; Alex Gregorian, SVP, Global Manufacturing & Engineering; Roberto Canevari, Chief Value Chain Officer; Nadine Graf, President, EUKEM; Stéphane de La Faverie, President and Chief Executive Officer; William P. Lauder, Chair of the Board of Directors; Maria Genouzos, VP, EUKEM and APAC Manufacturing; Pernilla Nyberg, SVP, General Manager, UK & Ireland; Jamal Chamariq, SVP, EUKEM & TR Value Chain; and Ben Smith, Whitman Plant Manager, celebrate the 60th anniversary of The
IQM and Real Asset Acquisition Corp. Announce Effectiveness of Registration Statement for Proposed Business Combination8.6.2026 16:16:00 CEST | Press release
RAAQ Extraordinary General Meeting Scheduled for June 25, 2026 IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced today that the registration statement on Form F-4 (the “Registration Statement”), relating to their previously announced business combination, has been declared effective by the U.S. Securities and Exchange Commission (“SEC”) on June 5, 2026. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260608520188/en/ IQM Radiance quantum computer The extraordinary general meeting of RAAQ’s shareholders in connection with the proposed business combination (the “Extraordinary General Meeting”) will be held on June 25, 2026. The proxy statement/prospectus relating to the Extraordinary General Meeting was mailed to RAAQ’s shareholders of record
Monster Hunter Wilds: Ascendance to Launch in 2027!8.6.2026 15:00:00 CEST | Press release
– Monster Hunter: World, released in 2018, surpassed 30 million units as Capcom looks to expand its global user base – Capcom Co., Ltd. (TOKYO:9697) today announced that Monster Hunter Wilds: Ascendance, a massive expansion for Monster Hunter Wilds, is scheduled for release in 2027. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260608183725/en/ Monster Hunter Wilds Ascendance key art Monster Hunter Wilds: Ascendance is a massive expansion (paid content) for Monster Hunter Wilds, which was released in February 2025. As a continuation of the main game’s story, the expansion will further deepen the gameplay experience with new content including new quest ranks, locales, additional monsters and expanded weapon actions through new gameplay features. The company is currently developing the title for release in 2027. Capcom is also developing Monster Hunter Wilds for Nintendo Switch™ 2 in addition to the existing platforms. Furthe
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom