Business Wire

TRIPLE-1-INC.

4.2.2020 12:02:06 CET | Business Wire | Press release

Share
TRIPLE-1 Inc., Announcement of Two New Products That Use Cutting Edge 7 nm Process and 5 nm Process

TRIPLE-1 Inc. (Headquarters: Hakata-ku, Fukuoka-shi, Fukuoka; Representative Director CEO: Takuya Yamaguchi; Henceforth: TRIPLE-1) has announced two new products: The ASIC "KAMIKAZE Ⅱ" for Bitcoin mining that uses a 7 nm process made by TSMC, and the AI processor "GOKU" for deep learning that uses the world's leading 5 nm process.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20200204005385/en/

--- Overview

In the "cryptocurrency mining market" that is driving the miniaturization of semiconductor processes in recent years, an extremely severe business model has been formed that directly links the power performance of semiconductors used for mining with mining proceeds. Starting in February 2017, TRIPLE-1 has been using core know-how involving the designability for cutting edge processes, the optimization of electrical consumption, and the improvement of the yield rate that have been fostered from the development of ASIC (application-specific integrated circuits) for cryptocurrency mining. Development has started on both "KAMIKAZE Ⅱ", the latest high-performance ASIC for Bitcoin mining that uses a 7 nm process made by TSMC, and the AI processor "GOKU" for deep learning that uses the world's leading 5 nm process.

--- Next generation 7 nm Bitcoin mining ASIC "KAMIKAZE Ⅱ" – That design completed

By making use of the know-how fostered from the initial "KAMIKAZE" model, the design for the next generation model "KAMIKAZE Ⅱ" has been finalized. After tape outing to TSMC and the prototype has been inspected, we will start mass production from 2021.

Additionally, we have started to offer reference boards and reference designs for the first "KAMIKAZE" mining machine model, the system that can provide smoother installation support is ready.

< Feature > ASIC Boost is built-in, improving the mining efficiency rapidly

By loading the custom algorithm "ASIC Boost" that improves mining efficiency (it was not loaded on to the first “KAMIKAZE” model), a more highly efficient mining environment is provided. Additionally, by supporting ultra-low voltage drive (supplied voltage 0.2x V), we anticipate a drastic reduction in electrical consumption.

KAMIKAZE / KAMIKAZE Ⅱ Performance specifications comparison

 

KAMIKAZE

KAMIKAZE Ⅱ

Process

TSMC 7 nm

TSMC 7 nm improved process

Die size

3.5 × 3.9 mm

3.0 × 9.0 mm

Package

7 × 7 mm FC-BGA

7 × 12 mm FC-LGA

Input voltage

0.3 V or less

Drives at a lower voltage than KAMIKAZE

Power consumption

1.2 W / chip

6.7 W / chip

Hash rate

23 GHs / chip

240 GHs / chip

Electrical efficiency

52 W / THs

28 W / THs

ASIC Boost

None

Supported

*KAMIKAZE: Chip actual value, KAMIKAZEⅡ: Design target

--- New challenges, enter the AI market

In recent years, various companies have entered the AI chip market, including not only giant IT companies but also fast-growing start-ups in China. As competition for edge AI chip development intensifies, oligopoly supply by several major companies continues in the deep learning AI processor market. Currently there are no mass-produced chips smaller than 12 nm process.

On the other hand, the electrical consumption of data centers is expected to excess 10% of the entire world's electrical energy by 2030. TRIPLE-1 believe that AI processors for deep learning need not only high "computing power" to learn and process a huge amount of data, but also a severe viewpoint on "power consumption" from the viewpoint of energy conservation and cost reduction.

Therefore TRIPLE-1 has launched the project to develop "GOKU", an ultra-low power consumption dedicated deep learning AI processor using the world's most advanced 5nm process, utilizing our unique Low power / High performance technology and design know-how in the most advanced processes.

--- "GOKU", an AI processor for deep learning with the world's leading 5 nm process

The first stage prototype has been completed, and we are inspecting the performance. Realizing the mass production in 2021, we will complete the prototypes closer to mass-produced products within 2020. It will be sold to the equipment and devices manufacturers for data servers or deep learning centers around the world, and we have already begun to discuss with multiple companies.

< Feature > Using the world's leading 5 nm process, it has 10 times higher power efficiency than conventional

Our goal is to reduce power consumption by 1/10 of the equivalent performance compared to conventional products (process: 12 nm), and its feature is low-voltage operation that is inconceivable with existing products.

< Feature > Design to connect multiple calculation units

Like the structure of the human brain, where synapses connect neurons in a complex manner, great amount and very complex inter-core communication is important for deep learning AI processors.

Utilizing the unique circuit design technology of "GOKU", which arranges many small arithmetic units on one large die as much as possible, it is designed to secure the communication (interconnect) band between the arithmetic units as much as possible.

It has been designed to get closer to the human brain.

< Reference > GOKU performance table (Design target)

Process

5 nm

Power consumption

100 W

Peak performance (half-precision)

1 PFLOPS (1,000 TFLOPS)

Electrical efficiency (half-precision)

10 TFLOPS / W

--- TRIPLE-1 outline

Company Name: TRIPLE-1, Inc.
Corporate Headquarter:
7F IT Bldg.Ⅱ,1-14-20 Hakataeki-Higashi, Hakata-ku Fukuoka-shi, Fukuoka, Japan
Representatives: Representative Director CEO Takuya Yamaguchi
The capital: 3662 million 895 thousand and 398 yen (including the capital reserve)

Link:

ClickThru

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release

Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th

Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release

Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv

Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release

Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te

Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release

Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i

SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days2.6.2026 00:35:00 CEST | Press release

CINDE Assortment and Space closes the loop between assortment, planogram, and in-store execution, proven across 500-plus global CPG deployments Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram execution, and in-store compliance, compressing the category review cycle from four to six weeks to a matter of days. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602137061/en/ The platform is underpinned by SymphonyAI's Transferable Demand AI, a model trained across 25 years of retail data a

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye