THUNDERCOMM
14.3.2023 05:13:40 CET | Business Wire | Press release
Thundercomm, a leading global supplier of smart Internet of Things (IoT) modules, announced today that its new-generation of 5G cellular module the TurboXT62G-EA has been certified by Deutsche Telekom, leading carrier in Europe. Being the industry’s leading cellular module, TurboX T62G-EA SOM is based on the innovative Snapdragon® X62 5G Modem-RF System, has already achieved both regulatory CE and KC certification for Europe and Korean, and carrier approvals of Deutsche Telekom and KT. Snapdragon X62 is designed to extend 5G in more applications, including IoT. TurboX T62G-EA enables customers to immediately deploy into a diverse range of high end IoT devices across Europe and Korea, such as MIFI, gateway/CPE/routers, high resolution vide transmission, online entertainment, robotics, AR/VRs, remote control/drones etc.
Targeting European and Asian markets, the T62G-EA SOM is a highly-integrated global 5G Sub-6GHz, supporting both SA and NSA modes, LTE and WCDMA bands. With footprint of 42mm x 45mm x 2.65mm, T62G-EA provides a plentiful peripheral interface such as UART/USB/I2C/I2S/PCI-e etc. MIFI and CPE reference design and development kits are available based on T62G-EA, aiming to help customers shorten the time to market.
Besides working with external hosts with different operating systems, Windows, Linux Ubuntu, Android etc. T62G-EA also supports comprehensive SDK which helps customers to work in Open CPU way, This is also part of turnkey software kits that offer end customers the best development experience on top of hardware functionalities.
T62G-EA SOM is one form factor of the T62 SOM series. The other variant is T62M-EA, which supports 5G Sub-6GHz/4G/3G and targets for laptop, notebook, CPE and router applications, will be available for Japanese and European markets soon.
“Thundercomm is continuously investing in 5G, as we believe it’s an essential part of connected world, where we see the increasing numbers and requirement of 5G-capable devices,” said Hiro Cai, CEO at Thundercomm. “ Thundercomm will work closely with global telecom operators, leveraging our expertise in 5G CPE design and performance tunning, to meet the requirements of global customers.”
About Thundercomm
Thundercomm, a joint venture between Thunder Software Technology Co., Ltd and Qualcomm (China) Holding Co. Ltd., a subsidiary of Qualcomm Technologies, Inc., was established to accelerate innovation in the Internet of Things and automotive industry, providing one-stop solutions powered by Qualcomm Technologies. Through its capabilities in operating systems including Android, Linux, and others, abroad software and on-device AI technology portfolio, and a global sales and support network, Thundercomm is a valuable and trusted partner to global customers aiming to build high-quality, next-generation products and shorten time-to-commercialization. Learn more at www.thundercomm.com
Snapdragon is a trademark or registered trademark of Qualcomm Incorporated.
Snapdragon branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230313005865/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Rehlko Defines What It Takes to Build AI-Ready Power Infrastructure as Data Center Energy Demands Evolve4.8.2026 15:15:00 CEST | Press release
New eBook highlights how increasingly dynamic AI workloads are reshaping critical power requirements and explores strategies for building resilient, scalable energy infrastructure Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today released new insights on the power infrastructure requirements emerging from the rapid growth of large language models and artificial intelligence. In its latest eBook, AI Readiness Starts with Power: Designing for Real-World Load Conditions, Rehlko examines how increasingly dynamic AI workloads are reshaping expectations for data center power systems and highlights key infrastructure considerations for operators seeking to scale AI capacity reliably and efficiently. As the eBook outlines, AI readiness is increasingly defined not by installed capacity, but by how systems perform under highly variable real-world load conditions. The AI Power Challen
HappyRobot Raises $150 Million Series C to Build Enterprise Superintelligence4.8.2026 14:30:00 CEST | Press release
New funding led by Prysm Capital and co-led by Eurazeo will accelerate global growth as HappyRobot expands its engineering, deployment and go-to-market teams HappyRobot, the company putting AI agents to work across complex enterprise operations, today announced it has raised $150 million in Series C funding led by Prysm Capital and co-led by Eurazeo. Existing investors a16z, Base10, Y Combinator are doubling down with participation from strategics like Koch Disruptive Technologies (KDT), Orange, and T.Capital (Deutsche Telekom), Bankinter, Endeavor Catalyst, Kfund and Wave-X. The round values the company at $1.2 billion post-money, bringing total funding to around $200 million and marking a new stage of growth as enterprises deploy AI agents across mission-critical work. HappyRobot works with more than 150+ enterprise customers, including DHL, Kuehne + Nagel, Naturgy, Repsol, and Uber, and has grown 5x since raising its Series B late last year. After first proving its platform in logis
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND4.8.2026 14:30:00 CEST | Press release
10th-generation QLC 3D flash memory represents a major leap forward for AI storage architectures, cloud platforms, and data‑intensive innovations Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804147821/en/ Leveraging the companies’ revolutionary CMOS directly Bonded to Array (CBA) technology2 which fabricates CMOS logic and the memory array on separate wafers before bonding them together with high-precision wafer-to-wafer alignment, the new generation improves read and write bandwidth c
Altasciences Completes Expansion of Research and Development Laboratory in Harleysville, Pennsylvania4.8.2026 14:00:00 CEST | Press release
Altasciences is excited to share it has expanded the R&D laboratory at its drug product formulation and manufacturing services facility in Harleysville, Pennsylvania, adding approximately 768 square feet of new laboratory space. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804164599/en/ From left to right: Nasir Egal (General Manager, CDMO Services); Marie-Hélène Raigneau (Chief Executive Officer); Anuji Abraham (Senior Director, Pharmaceutical Development, CDMO Services); Robert Sabelli (Co-Chief Operating Officer); Cathy Konidas (Chief Administrative Officer) The expansion brings together formulation development and analytical testing within a single laboratory. This integrated setup is designed to accelerate decision-making, streamline workflows, and strengthen collaboration across scientific disciplines. “With this expansion, we are strengthening our focus on early-stage integration, bringing our CDMO capabilities t
Vasion® is Imprivata®-Ready Certified to Bring Trusted Identity Across Healthcare Print Infrastructure4.8.2026 14:00:00 CEST | Press release
New integration brings Imprivata Enterprise Access Management directly into the Vasion Platform: closing the identity gap at the print layer, enabling clinicians and healthcare users to securely release jobs at any printer with a single badge tap. Vasion, a leader in intelligent print automation, today announced a strategic integration with Imprivata, a leading digital identity and access management company for life- and mission-critical industries, starting with healthcare. The Vasion platform, with PrinterLogic®, PrinterLogic Output, and Vasion Automate, offers shared Imprivata customers a unified identity layer, spanning endpoints and printers, for secure, enterprise-wide visibility into every print job. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804404337/en/ The integration is designed to maximize existing Imprivata deployments. No rip-and-replace is required. The Vasion platform works with the Imprivata infrastr
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
