Business Wire

TEMENOS

7.6.2021 08:32:04 CEST | Business Wire | Press release

Share
Temenos the Only Vendor Recognized as a Global Power Seller, a Top Global Player and a Top Global Cross-Seller in the 2021 Deal Survey, with 3X the Number of New Named Deals of the Next Vendor Surveyed

Temenos (SIX: TEMN), the banking software company, has been listed as the only ‘Global Power Seller’ in Forrester’s prestigious Global Banking Platform Deals Survey 2021 , with a 20% increase in new named deals compared to previous year. Temenos was the only top 5 vendor to grow its number of deals in 2020. Temenos landed more new global banking deals than any other surveyed provider in 2020, as stated in the Forrester report. Temenos was also named a ‘Top Global Player’ in the survey, based on combined deals, which represent a vendor’s ability to enhance its market position and keep creating value for its existing customers. Temenos also became the first vendor to be recognized by Forrester as a ‘Top Global Cross-Seller’ in Forrester’s newest category focused on extended business. According to Forrester, “extended business deals represent a vendor’s ability to keep creating value for its existing customers.”

Forrester reconfirmed Temenos’ status as a ‘Top Global Player’ for the 9th consecutive year. This ranking recognizes platforms with over 150 combined deals (new names and extended deals with existing customers) in more than five regions. With 209 deals signed with new and existing customers, Temenos maintained its position. Temenos also retains its position as a ‘Global Power Seller’, the highest status in the vendor pyramid for new deals, with 93 new business deals in 2020, 3X more deals than the next surveyed vendor. This marks the 15th consecutive year that Temenos has received this recognition.

Max Chuard, Chief Executive Officer, Temenos, said: “We are delighted to be recognized in Forrester’s Global Banking Platform Deals Survey across all seven surveyed regions and categories, and to be the only technology company to be in the top segment of all three tables. We operate in a huge USD 63 billion addressable market, which is largely underpenetrated, with only 27% today spent with third-parties, which creates big opportunities. As the deal figures show, Temenos is one of the only technology providers continuing to grow. We have over 3,000 customers, including over 70 challengers, and we are servicing them by constantly investing in innovation and in our technology roadmap across products and geographies to help them transform their IT landscapes. And by bringing to market The Temenos Banking Cloud, we now empower banks to digitally transform and massively scale faster than ever. We are putting banks in control of their business models and innovation cycles, giving them the agility and speed to deliver real value to their customers and build profitable businesses.”

The report, Use The Pandemic's Market Impact To Improve The ROI Of Digital Transformation:

Results From Forrester's Global Banking Platform Deals Survey 2021 , authored by Jost Hoppermann, Vice President and Principal Analyst, Forrester, states: “Banks have long recognized that their application landscapes can’t deliver the seamless and convenient experiences their customers require, leading to many institutions accepting the transformation imperative[...]. The pandemic has improved the banking industry’s application landscapes and digital readiness. However, it is still far from perfect: Despite the increased transformation pace, plenty of functional areas still need digital transformation. Well-suited off-the-shelf banking software is an effective option to drive this transformation.”

Temenos was most recently recognized as a leader in ‘The Forrester Wave : Digital Banking Processing Platforms, Q3 2020’ (Retail Banking and Corporate Banking ) and previously in ‘The Forrester Wave™: Digital Banking Engagement Platforms, Q3 2019 ’.

The Global Banking Platform Deals Survey 2021 is an independent survey conducted annually by Forrester. It assesses both the volume and geographical spread of banking platform sales to new and existing customers for 2020 deals. The research is used by decision-makers at financial institutions around the world looking to effectively evaluate the plethora of banking software solutions available.

– Ends –

About Temenos

Temenos AG (SIX: TEMN) is the world’s leader in banking software. Over 3,000 banks across the globe, including 41 of the top 50 banks, rely on Temenos to process both the daily transactions and client interactions of more than 1.2 billion banking customers. Temenos offers cloud-native, cloud-agnostic and AI-driven front office, core banking, payments and fund administration software enabling banks to deliver frictionless, omnichannel customer experiences and gain operational excellence.

Temenos software is proven to enable its top-performing clients to achieve cost-income ratios of 26.8% half the industry average and returns on equity of 29%, three times the industry average. These clients also invest 51% of their IT budget on growth and innovation versus maintenance, which is double the industry average, proving the banks’ IT investment is adding tangible value to their business.

For more information, please visit www.temenos.com .

Link:

ClickThru

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Medscape Brings AI to the Hematology Frontline at EHA 20262.6.2026 08:00:00 CEST | Press release

Landmark symposium to equip clinicians with practical, ethical AI frameworks, chaired by a lead author of Europe's ESMO EBAI and ELCAP oncology guidelines. Medscape Education will launch Future-Ready Hematologists: Practical and Ethical Use of AI in Hematology and Oncology at EHA 2026 on June 11, where leading experts will convene to explore responsible AI in one of medicine's most complex, rapidly evolving specialties. Registration is free for all EHA delegates. Reserve your seat here. The session is chaired by Prof. Jakob N. Kather, MD, MSc, Else Kroener Fresenius Center for Digital Health, Technical University Dresden, and NCT, University Hospital Heidelberg. He is joined by Prof. Chan Cheah, MBBS, DMSc, Consultant Hematologist, Sir Charles Gairdner Hospital, Perth, Australia; and Prof. Matthew Lunning, DO, FACP, Chief of Hematology and Assistant Vice Chancellor of Research, University of Nebraska Medical Center. Hematology moves faster than any clinician can track alone. AI can clo

Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release

Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th

Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release

Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv

Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release

Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te

Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release

Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye