Business Wire

TEMENOS

1.10.2020 13:02:10 CEST | Business Wire | Press release

Share
Temenos Names Roger Klantschi EVP of Delivery for the Americas to Drive Customer Business Value and Success

Temenos (SIX: TEMN), the banking software company, today announced that Roger Klantschi has been appointed as Executive Vice President of Delivery, Americas, effective immediately. In this new role, Roger will be leading Services and Support for North America and Latin America & Caribbean, with a focus on building customer value and success in the region. Roger will report directly to Alexa Guenoun, President, Americas, and Global Head of Partners, Temenos.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20201001005069/en/

Temenos has identified the Americas as a strategic region, and has invested over US$1 billion in the past few years acquiring leading US-based SaaS companies such as Kony and Avoka. Temenos has 1300 clients in North America ranging from large nationals to regional banks to credit unions, de novo banks and fund administrators. Temenos also has over 100 clients in LATAM & Caribbean including blue-chip customers such as Itaú Unibanco and leading regional banks such as Banco Ripley.

Roger will be responsible for leading the Customer Engagement and Delivery Teams across all Temenos products, as well as the newly formed Customer Success division in the Americas to bring best practices in the region and support customers’ business needs and growth.

Roger Klantschi, Executive Vice President of Delivery, Americas, said: “It’s a privilege to join Temenos and lead the Services organization in Americas as the company’s customer presence and footprint expands in this market. Temenos has the most advanced cloud and AI technology as well as the richest product functionality, it has a blue-chip customer base and talented employees. I am committed to help unlock and sustain business value for our customers.”

Roger’s more than 30 years of banking expertise in customer services and support, as well as his experience in delivering large-scale digital transformation projects, bring both breadth and depth to the new role. Prior to Temenos, he spent 18 years at Infosys holding senior executive positions in the US and Europe, including Head of Services for Americas and Europe, and Head of Presales Americas. Roger was also CIO at Banco Hipotecario in Argentina, a bank that pioneered mortgage lending on extended, low-interest terms, and contributed to consolidating a modern Argentine economy . Roger started his career with Accenture, where he spent eight years with the consultancy in Europe and later in Argentina.

Alexa Guenoun, President, Americas, and Global Head of Partners, Temenos, said: “I am delighted to strengthen the Americas leadership team by bringing Roger onboard. He will be responsible for driving business outcomes for our customers, and I am confident he will help us take the Americas region through its next phase of growth. He has an impressive record in delivering large-scale transformation projects globally and specifically in the US and LATAM as well as delivering best practices and great customer experiences. We take pride in building strong partnerships with our clients and helping them grow their business, and this will be a key focus for Roger and his team.”’

– Ends –

About Temenos

Temenos AG (SIX: TEMN) is the world’s leader in banking software. Over 3,000 banks across the globe, including 41 of the top 50 banks, rely on Temenos to process both the daily transactions and client interactions of more than 500 million banking customers. Temenos offers cloud-native, cloud-agnostic and AI-driven front office, core banking, payments and fund administration software enabling banks to deliver frictionless, omnichannel customer experiences and gain operational excellence.

Temenos software is proven to enable its top-performing clients to achieve cost-income ratios of 26.8% half the industry average and returns on equity of 29%, three times the industry average. These clients also invest 51% of their IT budget on growth and innovation versus maintenance, which is double the industry average, proving the banks’ IT investment is adding tangible value to their business.

For more information, please visit www.temenos.com .

Link:

ClickThru

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release

Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye