SOSLAB
12.1.2021 14:02:34 CET | Business Wire | Press release
SOSLAB that specializes in LiDAR, won the CES 2021 Innovation Awards at the world's largest electronics exhibition 'CES 2021,' for its Solid-state LiDAR ‘ML’ for automotive.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210112005486/en/
The CES Innovation Awards are awarded by about 50 expert judges who select the most innovative products in 28 categories each year. The products selected for this innovation award are displayed at the CES Innovation Showcase from January 11th.
SOSLAB’s Solid-state LiDAR ‘ML’ for autonomous vehicles won the Innovation Awards in the Vehicle Intelligence & Transportation category. This award recognizes the excellence of this product ML: Compact LiDAR without moving parts inside which enables simpler vehicle sensor deployment in terms of size, weight and stability.
The mechanical type of LiDAR currently used for research on autonomous driving has a limitation in mass production due to the system complexity caused by the moving components; ML is easy to mass-produce with a simple structural design which is expected to attract attention in the automotive LiDAR market.
ML was previously unveiled at KES2020 held at the COEX Exhibition Hall last year and will be supplied to strategic partners only, launching prototype products in the global market at CES 2021. More information on ML can be found at the SOSLAB booth at the CES 2021 exhibition held online from January 11th to 14th.
SOSLAB’s CEO, Jiseong Jeong said, “SOSLAB will become a company that makes the world smarter with LiDAR. Along with the verification of ML's technical excellence, we plan to complete product performance verification and auto-grade qualification by the second half of this year by securing additional capital with the goal of mass production of Solid-state LiDARs in 2022. SOSLAB will grow into a company that leads the global LiDAR market by commercializing LiDAR for vehicles.”
See SOSLAB's Compact 3D Solid-state LiDAR ‘ML’ video on
https://youtu.be/o3hSOnNKlDw
Additional Info.
Website: http://soslab.co/
YouTube: https://www.youtube.com/soslab
About SOSLAB
SOSLAB specializes in LiDAR (Light Detection and Ranging), which measures the distance to an object using light. We develop and supply 2D and 3D LiDARs to the market, growing into a global company by successfully developing Solid-state LiDAR for automotive.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210112005486/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Growing with Purpose, Delivering with Impact: ProAmpac Releases 2026 Sustainability Impact Report4.8.2026 17:13:00 CEST | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the release of its 2026 Sustainability Impact Report, centered around the theme Growing with Purpose, Delivering with Impact, the report highlights the company's advancements in sustainable innovation, environmental stewardship, employee safety, and responsible business practices while expanding its global footprint. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804969765/en/ ProAmpac's 2026 Impact Report is here Reflecting another year of meaningful achievements, the report demonstrates how ProAmpac is embedding sustainability throughout its business, from advancing innovative packaging solutions and reducing environmental impacts to strengthening workplace safety and supporting the communities where employees live and work. Notable achievements highlighted in the 2026 Sustainability Impact Report include:Continued Global Growth: Expanded Pr
New Esri Press Book Empowers Users to Unlock the Potential of AI with the Power of Geography4.8.2026 16:35:00 CEST | Press release
Exploring GeoAI: Tools and Workflows Offers Cutting-Edge Geospatial AI Models and Step-By-Step Tutorials Using ArcGIS Esri has released Exploring GeoAI: Tools and Workflows, a practical guide for applying geospatial AI using ArcGIS. Designed for GIS professionals, analysts, and data scientists, the workbook supports real-world spatial analysis through hands-on GeoAI workflows. The book addresses the growing importance of GeoAI by guiding readers through data preparation, model training, evaluation, and deployment. Step-by-step tutorials use real-world datasets to demonstrate deep learning, object detection, lidar classification, transfer learning, and predictive spatial analysis in ArcGIS. Esri has released Exploring GeoAI: Tools and Workflows, a practical guide to applying geospatial artificial intelligence (GeoAI) using ArcGIS. Designed for GIS professionals, analysts, and data scientists, this hands-on workbook provides the knowledge and tools needed to integrate advanced AI workflo
Rehlko Defines What It Takes to Build AI-Ready Power Infrastructure as Data Center Energy Demands Evolve4.8.2026 15:15:00 CEST | Press release
New eBook highlights how increasingly dynamic AI workloads are reshaping critical power requirements and explores strategies for building resilient, scalable energy infrastructure Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today released new insights on the power infrastructure requirements emerging from the rapid growth of large language models and artificial intelligence. In its latest eBook, AI Readiness Starts with Power: Designing for Real-World Load Conditions, Rehlko examines how increasingly dynamic AI workloads are reshaping expectations for data center power systems and highlights key infrastructure considerations for operators seeking to scale AI capacity reliably and efficiently. As the eBook outlines, AI readiness is increasingly defined not by installed capacity, but by how systems perform under highly variable real-world load conditions. The AI Power Challen
HappyRobot Raises $150 Million Series C to Build Enterprise Superintelligence4.8.2026 14:30:00 CEST | Press release
New funding led by Prysm Capital and co-led by Eurazeo will accelerate global growth as HappyRobot expands its engineering, deployment and go-to-market teams HappyRobot, the company putting AI agents to work across complex enterprise operations, today announced it has raised $150 million in Series C funding led by Prysm Capital and co-led by Eurazeo. Existing investors a16z, Base10, Y Combinator are doubling down with participation from strategics like Koch Disruptive Technologies (KDT), Orange, and T.Capital (Deutsche Telekom), Bankinter, Endeavor Catalyst, Kfund and Wave-X. The round values the company at $1.2 billion post-money, bringing total funding to around $200 million and marking a new stage of growth as enterprises deploy AI agents across mission-critical work. HappyRobot works with more than 150+ enterprise customers, including DHL, Kuehne + Nagel, Naturgy, Repsol, and Uber, and has grown 5x since raising its Series B late last year. After first proving its platform in logis
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND4.8.2026 14:30:00 CEST | Press release
10th-generation QLC 3D flash memory represents a major leap forward for AI storage architectures, cloud platforms, and data‑intensive innovations Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804147821/en/ Leveraging the companies’ revolutionary CMOS directly Bonded to Array (CBA) technology2 which fabricates CMOS logic and the memory array on separate wafers before bonding them together with high-precision wafer-to-wafer alignment, the new generation improves read and write bandwidth c
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom