SIAE-MICROELETTRONICA
10.6.2019 08:02:09 CEST | Business Wire | Press release
Infinera (NASDAQ: INFN) and SIAE MICROELETTRONICA, a leader in wireless communications, announced today the successful completion of end-to-end, software-defined networking (SDN)-enabled service orchestration across integrated IP/Multiprotocol Label Switching (MPLS) transport and microwave/millimeter-wave transport domains. Conducted in collaboration with a leading Tier 1 mobile operator, this proof of concept trial showcased the ability of network operators to simplify and automate multi-domain, multi-vendor operations as mobile networks evolve to support new high-capacity, latency-sensitive 5G services.
The trial featured seamless interworking of the SIAE MICROELETTRONICA SM-DC microwave domain controller, Infinera IP domain controller, SIAE MICROELETTRONICA AGS20 Layer3 microwave platform, Infinera Transcend Orchestrator, and Infinera 8600 Smart Router Series IP/MPLS platforms. Leveraging open, standards-based application programming interfaces, the integrated IP/MPLS and microwave transport solution provided a multi-domain, multi-vendor framework for a wide variety of SDN-enabled service creation and traffic management use cases, including:
- Network and service discovery and visualization , including discovery of inventory of network elements, link topology (Layers 0-3), and network services (Layers 2-3)
- End-to-end multi-domain service provisioning , including Layer 2 Ethernet pseudowire and Layer 3 IP virtual private networks over microwave links
- Closed-loop automation and multi-domain optimization , including the automatic shaping of IP layer traffic based on microwave modulation and bandwidth changes
In addition to reducing operational expenses via simplified operations and service provisioning, the integrated solution enables network operators to reduce capital expenses by maximizing the utilization of existing infrastructure as end-user capacity demands scale.
“This solution builds upon our widely deployed Tier 1 edge router solutions and provides an easy way to improve operational efficiencies with an evolutionary approach to SDN migration that leverages existing infrastructure,” said Mikko Hannula, Vice President, Engineering and Product Management at Infinera. “Our joint solution with SIAE MICROELETTRONICA brings a new level of dynamic network optimization to multi-domain, multi-layer, and multi-vendor networks while reinforcing the operational benefits of open networking.”
“This implementation demonstrates how network resources can be addressed to set up services in real time across different transport technologies and network areas,” said Paolo Galbiati, Product Line Management Director at SIAE MICROELETTRONICA. “This is proof of how SDN can really serve operators in shaping their networks and fully exploiting network potential.”
About SIAE MICROELETTRONICA
SIAE MICROELETTRONICA is a
leader in wireless communication technology, offering to operators
advanced solutions for microwave and millimeter-wave transport, services
and design. SIAE MICROELETTRONICA designs and produces its own RF
components, liaising over in-house RF lab, clean-room facilities and
complete product assembly with latest generation SMT smart-manufacturing
4.0 facility.
Info: http://www.siaemic.com
About Infinera
Infinera is a global supplier of innovative
networking solutions that enable carriers, cloud operators, governments
and enterprises to scale network bandwidth, accelerate service
innovation and automate network operations. The Infinera end-to-end
packet-optical portfolio delivers industry-leading economics and
performance in long-haul, subsea, data center interconnect and metro
transport applications. To learn more about Infinera visit www.infinera.com
,
follow us on Twitter @Infinera
and read our latest blog posts at www.infinera.com/blog
.
Infinera and the Infinera logo are registered trademarks of Infinera Corporation.
View source version on businesswire.com: https://www.businesswire.com/news/home/20190609005001/en/
Contact:
Infinera Media: Anna Vue Tel. +1 (916) 595-8157 avue@infinera.com
SIAE MICROELETTRONICA Media: Fabio Gavioli, Head of Marketing marketing@siaemic.com
Infinera Investors: Ted Moreau Tel: + 1 (408) 542-6205 tmoreau@infinera.com
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack12.10.2026 22:00:00 CEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the latest version of its Lattice Sentry™ solution stack (v5.0), the industry’s first post-quantum cryptography (PQC)-enabled Platform Firmware Resilience (PFR) and attestation solution. Extending Lattice's post-quantum cryptography leadership from silicon to a complete platform security stack, Lattice Sentry now delivers CNSA 2.0-aligned, NIST-compliant protection across AI data centers, and critical infrastructure, giving system designers a validated, production-ready path to quantum-resistant security. Lattice Sentry extends the company’s PQC leadership, combining the industry's first CNSA 2.0-compliant FPGA portfolio with AMI's platform management software to deliver a complete, integrated platform security solution. “AI infrastructure and the threat landscape are evolving rapidly. Platform firmware has become a primary attack vector, and the quantum era will upend decades
Cooler Master Expands End-to-End Cooling Solutions for AI Infrastructure12.10.2026 19:00:00 CEST | Press release
2,500 kW CDU anchors a portfolio spanning facility cooling, coolant distribution, rack-level thermal management and deployment equipment for high-density AI infrastructure Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012102572/en/ “Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities,” said Thomas Chen, CEO at Cooler Master Corporation. “We aim to help them put liqui
GigaDevice Deepens Ecosystem Collaboration with LVGL to Advance GD32’s Global Open-Source GUI Ecosystem12.10.2026 15:00:00 CEST | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providing developers worldwide with more convenient and efficient support for embedded graphics development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012320702/en/ Eight GD32 product series supported on LVGL website LVGL is an open-source graphical user interface framework designed for embedded devices, commercially supported by LVGL Ltd., a technology company based in Cambridge, UK. Lightweight, efficient, and cross-platform, it can be widely used in applications such as smart home devices, industrial control systems, consumer electronics, a
W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 14:00:00 CEST | Press release
The integrated battery vent combines pressure equalization, moisture protection, and resealable thermal-runaway evacuation in a single part, with one opening in the pack wall. Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combine
Echodyne and ACS Sign Strategic Collaboration Agreement to Advance Counter-UAS Capabilities Worldwide12.10.2026 14:00:00 CEST | Press release
Successful integration of EchoShield® radar with ACS’s Bullfrog™ autonomousweapon station delivers precise tracking and affordable kinetic defeat across land and maritime missions. Echodyne, the radar platform company, and ACS, a precision robotics company for defense, today announced the signing of a Strategic Collaboration Agreement to accelerate the development, demonstration, and deployment of integrated counter-unmanned aircraft system (C-UAS) solutions. The agreement establishes collaboration across Echodyne’s high-performance commercial counter-UAS radar hardware and software roadmaps and ACS’s Bullfrog robotic weapon station capabilities, and follows the recent announcement of each company’s award from Joint Interagency Task Force 401 for Domestic Shield, the JIATF-401 C-UAS Marketplace, and other critical counter-drone requirements. Bullfrog combines computer vision, autonomous control, and precision robotics with existing weapon systems to detect, track, identify, and engage
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom