SIAE-MICROELETTRONICA
10.6.2019 08:02:09 CEST | Business Wire | Press release
Infinera (NASDAQ: INFN) and SIAE MICROELETTRONICA, a leader in wireless communications, announced today the successful completion of end-to-end, software-defined networking (SDN)-enabled service orchestration across integrated IP/Multiprotocol Label Switching (MPLS) transport and microwave/millimeter-wave transport domains. Conducted in collaboration with a leading Tier 1 mobile operator, this proof of concept trial showcased the ability of network operators to simplify and automate multi-domain, multi-vendor operations as mobile networks evolve to support new high-capacity, latency-sensitive 5G services.
The trial featured seamless interworking of the SIAE MICROELETTRONICA SM-DC microwave domain controller, Infinera IP domain controller, SIAE MICROELETTRONICA AGS20 Layer3 microwave platform, Infinera Transcend Orchestrator, and Infinera 8600 Smart Router Series IP/MPLS platforms. Leveraging open, standards-based application programming interfaces, the integrated IP/MPLS and microwave transport solution provided a multi-domain, multi-vendor framework for a wide variety of SDN-enabled service creation and traffic management use cases, including:
- Network and service discovery and visualization , including discovery of inventory of network elements, link topology (Layers 0-3), and network services (Layers 2-3)
- End-to-end multi-domain service provisioning , including Layer 2 Ethernet pseudowire and Layer 3 IP virtual private networks over microwave links
- Closed-loop automation and multi-domain optimization , including the automatic shaping of IP layer traffic based on microwave modulation and bandwidth changes
In addition to reducing operational expenses via simplified operations and service provisioning, the integrated solution enables network operators to reduce capital expenses by maximizing the utilization of existing infrastructure as end-user capacity demands scale.
“This solution builds upon our widely deployed Tier 1 edge router solutions and provides an easy way to improve operational efficiencies with an evolutionary approach to SDN migration that leverages existing infrastructure,” said Mikko Hannula, Vice President, Engineering and Product Management at Infinera. “Our joint solution with SIAE MICROELETTRONICA brings a new level of dynamic network optimization to multi-domain, multi-layer, and multi-vendor networks while reinforcing the operational benefits of open networking.”
“This implementation demonstrates how network resources can be addressed to set up services in real time across different transport technologies and network areas,” said Paolo Galbiati, Product Line Management Director at SIAE MICROELETTRONICA. “This is proof of how SDN can really serve operators in shaping their networks and fully exploiting network potential.”
About SIAE MICROELETTRONICA
SIAE MICROELETTRONICA is a
leader in wireless communication technology, offering to operators
advanced solutions for microwave and millimeter-wave transport, services
and design. SIAE MICROELETTRONICA designs and produces its own RF
components, liaising over in-house RF lab, clean-room facilities and
complete product assembly with latest generation SMT smart-manufacturing
4.0 facility.
Info: http://www.siaemic.com
About Infinera
Infinera is a global supplier of innovative
networking solutions that enable carriers, cloud operators, governments
and enterprises to scale network bandwidth, accelerate service
innovation and automate network operations. The Infinera end-to-end
packet-optical portfolio delivers industry-leading economics and
performance in long-haul, subsea, data center interconnect and metro
transport applications. To learn more about Infinera visit www.infinera.com
,
follow us on Twitter @Infinera
and read our latest blog posts at www.infinera.com/blog
.
Infinera and the Infinera logo are registered trademarks of Infinera Corporation.
View source version on businesswire.com: https://www.businesswire.com/news/home/20190609005001/en/
Contact:
Infinera Media: Anna Vue Tel. +1 (916) 595-8157 avue@infinera.com
SIAE MICROELETTRONICA Media: Fabio Gavioli, Head of Marketing marketing@siaemic.com
Infinera Investors: Ted Moreau Tel: + 1 (408) 542-6205 tmoreau@infinera.com
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 01:00:00 CEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 01:00:00 CEST | Press release
Production planned at Fab2 of Kitakami Plant Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stac
Bending Spoons S.p.A. announces closing of initial public offering2.7.2026 20:35:00 CEST | Press release
Bending Spoons S.p.A. (“Bending Spoons”), a leading technology company, today announces the closing of its initial public offering of an aggregate of 57,971,015 of its ordinary shares, at an initial public offering price of $29.00 per share. The offering consisted of 34,398,640 shares sold by Bending Spoons and 23,572,375 shares sold by certain selling shareholders (the “Selling Shareholders”). The gross proceeds from the offering to Bending Spoons, before deducting underwriting discounts and commissions and other offering expenses, was approximately $953,917,285.50. Bending Spoons did not receive any proceeds from the sale of shares by the Selling Shareholders. Bending Spoons’ ordinary shares began trading on the Nasdaq Global Select Market on July 1, 2026 under the ticker symbol “BSP”. Goldman Sachs International, J.P. Morgan, and Allen & Company LLC are acting as joint lead book-running managers for the offering. Wells Fargo Securities, BofA Securities, Jefferies, Evercore ISI, BNP
Strategic Partnership Between Record Asset Management and Admicasa2.7.2026 19:00:00 CEST | Press release
RAM Swiss Holding AG announces a strategic partnership with Admicasa Holding AG (Admicasa). RAM Swiss Holding AG is a subsidiary of LSE-listed Record Financial Group (Record) and part of the Record Asset Management (RAM) group of companies. The partnership is a milestone in the growth of Admicasa and marks an important step in the continued expansion of Record’s private markets platform. Subject to regulatory approval, the agreement, signed on 1st July 2026, provides RAM Swiss Holding AG with a 50% participation in the Admicasa Fondsleitung AG, part of Admicasa, and establishes a long-term partnership to develop investment opportunities in the Swiss and Global real estate market with a plan to expand into other asset classes in the medium term. RAM is the European asset management arm of Record, the LSE-listed specialist investment group managing USD 115 billion of assets on behalf of institutional clients worldwide. Record's client base comprises pension funds, foundations, sovereign
IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange2.7.2026 16:47:00 CEST | Press release
IQM begins trading on Nasdaq Global Select Market under the ticker symbol “IQMX” Company enters next phase of growth as a publicly traded leader in full-stack superconducting quantum computing IQM maintains a strong pro forma cash position of EUR 337 million IQM Quantum Computers (Nasdaq: IQMX) (“IQM”, “IQM Quantum Computers” or the “Company”), a global leader in full-stack superconducting quantum computers, today became a publicly traded company following the completion of its business combination with Real Asset Acquisition Corp. (“RAAQ”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702960460/en/ IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange The company’s American Depositary Shares begin trading today on the Nasdaq Global Select Market under the ticker symbol “IQMX”. The listing marks a major milestone for IQM establishing the company as the first European quan
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
