SAMSUNG
11.11.2021 10:02:08 CET | Business Wire | Press release
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211111005553/en/
"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies,” said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."
“In today’s environment where system integration is increasingly required and substrate supplies are constrained, Samsung Foundry and Amkor Technology have successfully co-developed H-Cube to overcome these challenges,” said JinYoung Kim, senior vice president of Global R&D Center at Amkor Technology. “This development lowers barriers to entry in the HPC/AI market and demonstrates successful collaboration and partnership between the foundry and outsourced semiconductor assembly and test (OSAT) company.”
H-Cube Structure and Features
2.5D packaging enables logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a small form factor. Samsung’s H-Cube technology features a hybrid substrate combined with a fine-pitch substrate which is capable of fine bump connection, and a High-Density Interconnection (HDI) substrate, to implement large sizes into 2.5D packaging.
With the recent increase in specifications required in the HPC, AI, and networking application market segments, large-area packaging is becoming important as the number and size of chips mounted in one package increases or high-bandwidth communication is required. For attachment and connection of silicon dies including the interposer, fine-pitch substrates is essential but prices rise significantly following an increase in size.
When integrating six or more HBMs, the difficulty in manufacturing the large-area substrate increases rapidly, resulting in decreased efficiency. Samsung solved this problem by applying a hybrid substrate structure in which HDI substrates that are easy to implement in large-area is overlapped under a high-end fine-pitch substrate.
By decreasing the pitch of solder ball, which electrically connects the chip and the substrate, by 35% compared to the conventional ball pitch, the size of fine-pitch substrate can be minimized, while adding HDI substrate (module PCB) under the fine-pitch substrate to secure connectivity with the system board.
In addition, to enhance the reliability of the H-Cube solution, Samsung applied its proprietary signal/power integrity analysis technology that can stably supply power while minimizing the signal loss or distortion when stacking multiple logic chips and HBMs.
Looking ahead, in cooperation with its ecosystem partners, Samsung will hold its 3rd Annual ‘Samsung Advanced Foundry Ecosystem (SAFETM ) Forum' virtually on November 17 (PST).
For pre-registration on the SAFE forum, please visit https://www.samsungfoundry.com
# # #
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20211111005553/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Xsolla Releases The Xsolla Report: Mobile D2C Edition28.9.2026 15:00:00 CEST | Press release
New Data From More Than 800 Mobile Web Shops Finds Direct-to-Consumer Has Become a Standard Operating Discipline, With Top Performers Capturing More Than Half of a Title's Revenue Regardless of Studio Size Xsolla, a global commerce company, today released The Xsolla Report: Mobile D2C Edition, a new study examining how direct-to-consumer commerce is performing across mobile games. Drawing on data from more than 800 live Xsolla Web Shops alongside public market and regulatory data, the report shows that D2C has moved past the question of whether it works and into a new phase: studios seeing the strongest results are the ones treating their Web Shop as an operating discipline rather than a one-time build. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260928312597/en/ Graphic: Xsolla Three themes run through the report. First, the gap between a typical Web Shop and a top-performing one is wide, and closing it has little to do
Incognito Software Systems Launches NEXA, an AI-Enabled Solution for Automated Broadband Operations28.9.2026 15:00:00 CEST | Press release
NEXA unifies network, device, service, and subscriber data to help broadband service providers identify issues earlier, improve customer experience, reduce churn, and automate operations. Incognito Software Systems, a leading global provider of service orchestration, device management, and network intelligence solutions, today introduced NEXA, an AI-driven network intelligence and automation platform that enables broadband service providers to turn operational data into action. NEXA unifies network, device, service, and subscriber data in a single intelligence layer, delivering real-time and predictive insights that help service providers identify issues sooner, better understand the subscriber experience, and take faster, more informed action across their operations. As service providers seek to differentiate beyond connectivity, subscriber experience has become a critical competitive advantage. However, networks have evolved into complex service platforms that span access, edge, cust
Volante Technologies and Circle advance stablecoin payment and settlement capabilities for financial institutions28.9.2026 15:00:00 CEST | Press release
Collaboration enables banks to integrate USDC workflows within existing multi-rail payments infrastructure Volante Technologies, the global leader in Payments as a Service (PaaS), today announced a strategic collaboration with Circle Internet Group, Inc. (NYSE: CRCL) (“Circle”), a leading internet financial platform company and the issuer of USDC1 through its regulated entities, to help financial institutions integrate stablecoin payment and settlement capabilities into their existing payment operations. Through the collaboration, Volante is bringing USDC workflows into its AI-powered Payments Platform, enabling financial institutions to evaluate how stablecoin activity can operate alongside existing payment rails, operational controls, and on- and off-ramp requirements - without requiring a separate digital asset stack. Volante clients, which include four of the top five global corporate banks and seven of the top 10 U.S. banks, will be able to evaluate key workflows, including mintin
Zayed Sustainability Prize Unveils 2027 Finalists Following Record-Breaking Global Entry28.9.2026 14:47:00 CEST | Press release
Record 10,233 submissions from 177 countries, up 32% year-on-yearFinalists are delivering practical, scalable solutions across health, food, energy, water and climate actionPrize has positively impacted more than 411 million lives worldwide From AI that can predict pregnancy complications months in advance and robots that navigate water networks, to new technologies restoring degraded soil and heat-resilient corals rebuilding reefs, the Zayed Sustainability Prize has unveiled its 2027 finalists following the most competitive cycle in its history. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260928805335/en/ Members of the Zayed Sustainability Prize Jury gathered in Abu Dhabi to determine the 2027 winners and finalists (Photo: AETOSWire) A record 10,233 submissions from 177 countries were received for the 2027 cycle, a 32% increase year-on-year, reflecting the growing global reach of the UAE’s pioneering award for innovativ
ZincFive Expands Nickel-Zinc Technology into In-Rack Backup and AI Dynamic Power Solutions28.9.2026 14:05:00 CEST | Press release
Applying proven high-rate nickel-zinc technology to in-rack backup and AI-driven transient power applications ZincFive®, the leader in nickel-zinc (NiZn) battery-based solutions for immediate power applications, today announced its expansion into in-rack energy storage with the development of Battery Backup Unit (BBU) and AI Dynamic Power Module (DPM) solutions designed to address the evolving energy storage requirements of AI data centers. As AI drives higher rack power densities and increasingly dynamic workloads, data center power architectures are evolving to manage both traditional backup requirements and rapid, repeated changes in power demand. These transient loads can place significant stress on electrical infrastructure, creating a growing need for power solutions closer to the rack that can respond quickly, safely, and reliably. Today’s rack-level technologies often require tradeoffs between energy capacity and dynamic power response. Traditional BBUs are primarily designed t
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom