SAMSUNG
11.11.2021 10:02:08 CET | Business Wire | Press release
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211111005553/en/
"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies,” said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."
“In today’s environment where system integration is increasingly required and substrate supplies are constrained, Samsung Foundry and Amkor Technology have successfully co-developed H-Cube to overcome these challenges,” said JinYoung Kim, senior vice president of Global R&D Center at Amkor Technology. “This development lowers barriers to entry in the HPC/AI market and demonstrates successful collaboration and partnership between the foundry and outsourced semiconductor assembly and test (OSAT) company.”
H-Cube Structure and Features
2.5D packaging enables logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a small form factor. Samsung’s H-Cube technology features a hybrid substrate combined with a fine-pitch substrate which is capable of fine bump connection, and a High-Density Interconnection (HDI) substrate, to implement large sizes into 2.5D packaging.
With the recent increase in specifications required in the HPC, AI, and networking application market segments, large-area packaging is becoming important as the number and size of chips mounted in one package increases or high-bandwidth communication is required. For attachment and connection of silicon dies including the interposer, fine-pitch substrates is essential but prices rise significantly following an increase in size.
When integrating six or more HBMs, the difficulty in manufacturing the large-area substrate increases rapidly, resulting in decreased efficiency. Samsung solved this problem by applying a hybrid substrate structure in which HDI substrates that are easy to implement in large-area is overlapped under a high-end fine-pitch substrate.
By decreasing the pitch of solder ball, which electrically connects the chip and the substrate, by 35% compared to the conventional ball pitch, the size of fine-pitch substrate can be minimized, while adding HDI substrate (module PCB) under the fine-pitch substrate to secure connectivity with the system board.
In addition, to enhance the reliability of the H-Cube solution, Samsung applied its proprietary signal/power integrity analysis technology that can stably supply power while minimizing the signal loss or distortion when stacking multiple logic chips and HBMs.
Looking ahead, in cooperation with its ecosystem partners, Samsung will hold its 3rd Annual ‘Samsung Advanced Foundry Ecosystem (SAFETM ) Forum' virtually on November 17 (PST).
For pre-registration on the SAFE forum, please visit https://www.samsungfoundry.com
# # #
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20211111005553/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Thales Builds Cryptographic Security for the Age of AI and Post-Quantum Computing14.9.2026 09:00:00 CEST | Press release
Thales launches Luna 8, a new hardware security module (HSM) to provide future-ready, quantum resistant security to protect critical data and applications Powered by a Thales designed cryptographic processor, it delivers unparalleled performance, enhanced protection and the flexibility to adapt to new security needs Drawing on decades of cryptographic expertise, Luna 8 combines trusted security with support for emerging technologies, including post quantum cryptography According to the 2026 Thales Data Threat Report, the threat of Harvest Now, Decrypt Later (HNDL) attacks was the top-cited risk, with 59% of organizations reporting that they are prototyping and evaluating post-quantum cryptography (PQC) algorithms to prepare for the quantum era. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804748922/en/ ©Thales To help organizations turn this readiness into deployment,Thales, a global leader in advanced technologies, tod
U.S. FDA Accepts New Drug Application Under Priority Review for Takeda’s Zasocitinib in Moderate-to-Severe Plaque Psoriasis, with Potential to Redefine Oral Treatment Expectations14.9.2026 09:00:00 CEST | Press release
Acceptance is based on pivotal Phase 3 data demonstrating rapid, durable and consistent skin clearance, including in high-impact sites, in a convenient once-daily pill Results from nearly 3,000 patients support potential for next-generation TYK2 inhibitor to redefine oral treatment expectations in psoriasis The Prescription Drug User Fee Act (PDUFA) target action date is in the first quarter of calendar year 2027 Takeda (TSE:4502/NYSE:TAK) announced that the U.S. Food and Drug Administration (FDA) accepted its New Drug Application (NDA) under Priority Review for zasocitinib (TAK-279) for the treatment of adults with moderate-to-severe plaque psoriasis. Zasocitinib is an investigational, next-generation, highly selective and potent oral tyrosine kinase 2 (TYK2) inhibitor, which demonstrated rapid, durable and consistent skin clearance in Phase 3 plaque psoriasis studies.1-3 Addressing unmet needs in psoriasis treatment “Despite progress in psoriasis care, there remains a need for highly
SWISSto12 and Mitsubishi Electric Corporation Announce Strategic Partnership14.9.2026 09:00:00 CEST | Press release
The Memorandum of Understanding (MoU) and additional contract signal a new phase of collaboration on market development in the Asia Pacific (APAC) region SWISSto12 today announced a memorandum of understanding (MoU) with Mitsubishi Electric Corporation (MELCO) (TOKYO: 6503) to pursue joint opportunities on advanced payloads, radio frequency (RF) products, and market development in Japan and the APAC region. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260914982179/en/ Masahiko Arai, Executive Officer and Group President, Defense & Space Systems, Mitsubishi Electric, and Dr. Emile de Rijk, Chief Executive Officer, SWISSto12 Joint opportunities will leverage MELCO’s extensive satellite system expertise and integration capabilities together with SWISSto12’s proprietary 3D-printing designs and processes that form the foundation of its next-generation payloads—smaller, lighter, highly performant, yet built in materially shorter
Focused Support Launches Cavok STRIKE to Expand Link-16 Participation Across the Joint Force14.9.2026 07:00:00 CEST | Press release
Extending Link-16 interoperability without platform-level hardware integration Focused Support LLC today announced the launch of Cavok STRIKE, an integrated software capability that expands the Link-16 tactical battlespace picture by enabling additional operational platforms to participate in the Link-16 network. Modern battlefields have increasing numbers of unmanned systems, sensors, and supporting platforms operating throughout the joint battlespace. The rapid proliferation of Group 1, 2, and 3 UAS, including both expendable and recoverable systems, has created a growing need to integrate these assets into the broader tactical network. Many of these platforms provide operationally relevant information but have historically remained outside the Link-16 network due to limitations in size, weight, power, platform integration complexity, or acquisition cost. Cavok STRIKE addresses this gap by enabling platforms to participate in the Link-16 network as non-command-and-control participant
Fujirebio Expands Access to Blood-based Neurology Testing in Brazil with ANVISA Market Authorization for Lumipulse® G NfL Blood and Lumipulse G pTau 217 Plasma14.9.2026 07:00:00 CEST | Press release
H.U. Group Holdings Inc. and its wholly owned subsidiary Fujirebio today announced that the Brazilian Health Regulatory Agency (ANVISA) has granted market authorization for the Lumipulse G NfL Blood and Lumipulse G pTau 217 Plasma assays for use on the fully automated LUMIPULSE® G immunoassay platform in Brazil. “ANVISA authorization of the Lumipulse G NfL Blood and Lumipulse G pTau 217 Plasma assays marks another important step in our mission to expand access to reliable, clinically meaningful blood-based biomarkers for clinicians and patients worldwide,” said Christiaan De Wilde, CEO of Fujirebio Europe N.V. “By making both neurological biomarker assays available to laboratories on a single, fully automated platform, we are helping support more informed clinical decision-making across a broad range of neurological conditions and throughout the diagnostic pathway.” The Brazilian ANVISA authorizations are based on the already CE marked in vitro diagnostics (IVD) approvals of these two
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom