SAMSUNG-ELECTRONICS
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced three of its latest automotive chip solutions; the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems, and the ASIL-B certified S2VPS01 power management IC (PMIC) for the Auto V series.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211130005513/en/
“Smarter and more connected automotive technologies for enriched in-vehicle experiences including entertainment, safety and comfort are becoming critical features on the road,” said Jaehong Park, Executive Vice President of System LSI Custom SOC Business at Samsung Electronics. “With an advanced 5G modem, an AI-enhanced multi-core processor, and a market-proven PMIC solution, Samsung is transfusing its expertise in mobile solutions into its automotive lineup and is positioned to expand its presence within the field.”
Exynos Auto T5123: The Industry’s First 5G Connectivity Solution for Automobiles
The Exynos Auto T5123 is a 3GPP Release 15 telematics control unit specifically designed to bring fast and seamless 5G connectivity in both standalone (SA) and non-standalone (NSA) mode to the next generation of connected cars. It delivers essential information to the vehicle in real-time via high-speed download of up to 5.1 gigabits per second (Gbps) and allows passengers to enjoy a host of new services such as high-definition content streaming and video calls on the go.
To efficiently process large amounts of data transmitted and received through the 5G modem, the Exynos Auto T5123 supports a high speed PCIe (PCI Express) interface and a low-power high-performance LPDDR4x mobile DRAM. In addition, the unit comes with two Cortex-A55 CPU cores and a built-in Global Navigation Satellite System (GNSS) to minimize the use of external ICs and help reduce product development time. The T5123 meets stringent requirements for automotive components and is Automotive Electronics Council-Q100 (AEC-Q100) qualified.
The Exynos Auto T5123 is currently in mass production and is delivering 5G-based vehicle communication capabilities for the first time in the industry.
Exynos Auto V7: A Powerful Processor for IVI Systems in Mid to High-end Vehicles
The Exynos Auto V7 is the newest addition to Samsung’s automotive-brand processor lineup and is designed for in-vehicle infotainment systems. For powerful processing performance, the V7 integrates eight 1.5-gigahertz (GHz) Arm Cortex-A76 CPU cores and 11 Arm Mali G76 GPU cores. The GPU comes in two separate groups, with three cores in the ‘small’ domain for cluster display and AR-HUD, and eight in the ‘big’ domain for central information display (CID) and others. Such physical separation allows the GPU to support multiple systems simultaneously and brings safer operation as it keeps one domain from interfering with another. In addition to its powerful CPU and GPU, the V7 is equipped with an NPU for convenient services such as virtual assistance that can process visual and audio data for face, speech or gesture recognition features.
For a safer and more enjoyable driving experience, the Exynos Auto V7 supports up to four displays and 12 camera inputs that provide information to assist drivers and passengers. The V7’s imaging system provides bad pixel correction, dynamic range compression and geometric distortion correction to provide noiseless and distortion-free images for features like surround view and parking assistance. For immersive in-car entertainment, the chip comes with three HiFi 4 audio processors that deliver excellent audio quality for songs, movies and even games on the go. To run all these features as smoothly as possible, the V7 has up to 32 gigabytes (GB) of LPDDR4x memory capacity that offers high bandwidth of up to 68.3 gigabytes per second (GB/s).
The Exynos Auto V7 also offers strong data protection through an isolated security processor for crypto operation and provides a hardware key using a one-time programmable (OTP) or physical unclonable function (PUF). Furthermore, for critical functional safety, the Exynos Auto V7 complies with ASIL-B requirements of safety support for a digital cluster and an embedded safety island that detect and manage faults to maintain a safe state with a fault management unit (FMU).
The Exynos Auto V7 is currently in mass production and is being used in Volkswagen’s latest In-Car Application-Server (ICAS) 3.1, developed by LG Electronics’ VS (Vehicle component Solutions) division, to power their next-generation in-vehicle infotainment system.
S2VPS01 – An ASIL-B Certified Power Management IC for the Exynos Auto V Series
The S2VPS01 is a PMIC specifically designed and developed for the Exynos Auto V9 and V7. It is Samsung’s first automotive solution produced under the ISO 26262 functional safety process certification that was acquired in 2019, and it also achieved an ASIL-B certification in 2021.
An Automotive Safety Integrity Level (ASIL), specified under ISO 26262, ranges from A to D, with D being the highest level. The Level is assigned by analyzing and assessing the severity, exposure and controllability of vehicle operations in a number of environments. To ensure the safety of vehicle systems, ASIL-B compliance is becoming a key requirement for automotive OEMs and their Tier 1 suppliers when selecting partners and solutions.
The S2VPS01 regulates and rectifies the flow of electrical power, allowing reliable and robust in-vehicle infotainment system performance. It is comprised of highly efficient triple/dual-phase buck converters, and integrates a low-dropout regulator (LDO) and real-time clock (RTC) within the package. For protection from harsh thermal and electrical conditions, the power IC comes with various protection functions including over voltage protection (OVP), under voltage protection (UVP), short circuit protection (SCP), over current protection (OCP), thermal shut down (TSD), clock monitoring, and output stuck checks.
For more information about Samsung’s Exynos products, please visit http://www.samsung.com/exynos .
# # #
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20211130005513/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Lenovo Group: Second Quarter Financial Results 2025/2620.11.2025 00:45:00 CET | Press release
Lenovo delivers record quarterly results, marking significant progress in hybrid AI Lenovo GroupLimited (HKSE: 992) (ADR: LNVGY), together with its subsidiaries (‘the Group’), today reported record results for the second quarter of fiscal year 2025/26, with overall group revenue reaching an all-time high of US$20.5 billion, up 15% year-on-year. Adjusted net income[1] grew 25% year-on-year to US$512 million, and adjusted net income margin expanded to 2.5%, driven by higher revenues. Together, these reflect the strength of the Group’s operational performance as they exclude the impact of non-cash fair value loss on warrants, notional interest on convertible bonds, and other non-cash items. The Group delivered double-digit year-on-year revenue growth across all main business groups and sales geographies. The AI-related revenue mix increased by 13 percentage points year-on-year, accounting for 30% of the Group’s total revenue this quarter. The growth was driven by high-double-digit revenue
OCP Announces Date of Third Quarter and Nine-Month 2025 Earnings19.11.2025 22:05:00 CET | Press release
OCP S.A. (“OCP” or the “Company”), a global leader in the fertilizer industry, will release its third quarter and nine-month 2025 results on Tuesday, November 25, 2025. The results will be available to holders of the Company’s bonds, qualified institutional buyers, securities analysts and market makers on the OCP Intralinks portal from 9:00 a.m. EDT, 3:00 p.m. Morocco (GMT+1), and 2:00 p.m. London time (GMT). OCP senior management will host a conference call to discuss third quarter and nine-month 2025 results at 10:00 a.m. EDT, 4:00 p.m. Morocco (GMT+1), and 3:00 p.m. London time (GMT) on Tuesday, November 25, 2025, for holders of the Company’s bonds, qualified institutional buyers, securities analysts and market makers. Eligible parties that have not already registered for access to the Intralinks portal may do so by contacting the Investor Relations Department by emailing g.laraki@ocpgroup.ma. About OCP OCP is a global leader in the fertilizer industry, backed by almost a century’s
Marquee Brands Broadens Global Portfolio with Strategic Acquisition of Stance19.11.2025 21:00:00 CET | Press release
Marquee’s 19th Brand Signals a Bold Expansion into Lifestyle and Performance Marquee Brands, the premier global brand accelerator, today announced the acquisition of Stance, the innovative lifestyle and performance sock brand. Founded in 2009 in San Clemente, California, Stance joins Marquee Brands’ renowned portfolio, home to some of the world’s most notable brands, including Martha Stewart, Laura Ashley, Sur La Table, BCBG, Ben Sherman, Body Glove and Dakine. The addition of Stance brings total retail sales across Marquee’s portfolio to $4.5 Billion USD. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251119216623/en/ Marquee also announces a new partnership with United Legwear and Apparel Co. (ULAC), which becomes the brand’s core global licensee, managing operations across all territories apart from China. With products sold in 42 countries through more than 1,100 U.S. wholesale accounts, e-commerce, international distrib
AWS and HUMAIN Expand Partnership with NVIDIA AI Infrastructure and AWS AI Chip Deal to Drive Global AI Innovation19.11.2025 19:38:00 CET | Press release
Expanded partnership includes deployment of up to 150,000 AI accelerators including the latest NVIDIA GB300s AI infrastructure and AWS’s Trainium chips.Amazon Bedrock will provide customers access to best-in-class foundation models optimized across diverse, high performance AI chip infrastructures.AWS becomes HUMAIN’s preferred AI partner with AWS and HUMAIN collaborating to bring AI compute and services to customers worldwide. Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), and HUMAIN, a Public Investment Fund (PIF) company delivering global full-stack AI solutions, announced today at the U.S.-Saudi Investment Forum their plans to provide, deploy and manage up to 150,000 AI accelerators in a data center facility known as an “AI Zone” in Riyadh. As part of the expanded partnership, AWS will become HUMAIN’s preferred AI partner globally, and the two companies will collaborate to bring AI compute and services from Saudi Arabia to customers worldwide. This pre
Luma AI Raises $900 Million Series C Led by HUMAIN And Partners on 2 Gigawatt AI Supercluster in Saudi Arabia19.11.2025 18:15:00 CET | Press release
New capital and compute infrastructure will accelerate Luma AI’s path towards Multimodal AGI – AI that can simulate reality and help humans in the physical world.HUMAIN to build Project Halo, one of the world’s largest AI compute clusters that will include the training of World Models, the next step in AI after LLMs - a potential trillion-dollar opportunity spanning entertainment, marketing/brands, education, world understanding, and robotics industries.Partnership includes HUMAIN Create, an initiative to build AI models trained on Arabic and regional data, helping enterprises and governments across MENA adopt culturally aligned AI. Luma AI, the frontier artificial intelligence company building multimodal AGI, today announced it has raised $900 million in Series C funding, led by HUMAIN, a PIF company delivering global full-stack AI solutions, with significant participation from AMD Ventures, and existing investors Andreessen Horowitz, Amplify Partners, and Matrix Partners. This press
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom