SAMSUNG-ELECTRONICS
Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled plans for continuous process technology migration to 3- and 2-nanometer (nm) based on the company’s Gate-All-Around (GAA) transistor structure at its 5th annual Samsung Foundry Forum (SFF) 2021.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211007005441/en/
With a theme of Adding One More Dimension , the multi-day virtual event is expected to draw over 2,000 global customers and partners. At this year’s event, Samsung will share its vision to bolster its leadership in the rapidly evolving foundry market by taking each respective part of foundry business to the next level: process technology, manufacturing operations, and foundry services.
“We will increase our overall production capacity and lead the most advanced technologies while taking silicon scaling a step further and continuing technological innovation by application,” said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. "Amid further digitalization prompted by the COVID-19 pandemic, our customers and partners will discover the limitless potential of silicon implementation for delivering the right technology at the right time."
GAA is ready for customers' adoption - 3nm MP in 2022, 2nm in 2025
With its enhanced power, performance and flexible design capability, Samsung’s unique GAA technology, Multi-Bridge-Channel FET (MBCFETTM ), is essential for continuing process migration. Samsung's first 3nm GAA process node utilizing MBCFET will allow up to 35 percent decrease in area, 30 percent higher performance or 50 percent lower power consumption compared to the 5nm process. In addition to power, performance, and area (PPA) improvements, as its process maturity has increased, 3nm’s logic yield is approaching a similar level to the 4nm process, which is currently in mass production.
Samsung is scheduled to start producing its customers' first 3nm-based chip designs in the first half of 2022, while its second generation of 3nm is expected in 2023. Newly added to Samsung’s technology roadmap, the 2nm process node with MBCFET is in the early stages of development with mass production in 2025.
FinFET for CIS, DDI, MCU - 17nm specialty process technology debuts
Samsung Foundry is continuously improving its FinFET process technology to support specialty products with cost-effective and application-specific competitiveness. A good example of this is the company’s 17nm FinFET process node. In addition to the intrinsic benefits afforded by FinFET, the process node has excellent performance and power efficiency leveraging a 3D transistor architecture. Consequently, Samsung’s 17nm FinFET provides up to 43 percent decrease in area, 39 percent higher performance, or a 49 percent increase in power efficiency compared to the 28nm process.
Additionally, Samsung is advancing its 14nm process in order to support 3.3V high voltage or flash-type embedded MRAM (eMRAM) which enables increased write speed and density. It will be a great option for applications such as micro controller units (MCUs), IoT and wearables. Samsung’s 8nm radio frequency (RF) platform is expected to expand the company’s leadership in the 5G semiconductor market from sub-6GHz to mmWave applications.
Looking ahead, in cooperation with its ecosystem partners, Samsung Foundry’s SAFE Forum will be held virtually in November 2021.
# # #
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20211007005441/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Helical Fusion Signs Japan’s First Power Purchase Agreement for Fusion Energy with Aoki Super8.12.2025 10:00:00 CET | Press release
Agreement signals growing market demand for stable, continuous, net-electricity fusion power based on the Helical Stellarator Helical Fusion Co., Ltd. (Headquarters: Tokyo, Japan; “Helical Fusion”), a company developing a commercially viable Helical Stellarator power plant under its “Helix Program”, has signed a Power Purchase Agreement (PPA) with Aoki Super Co., Ltd. (Headquarters: Aichi, Japan; “Aoki Super”), a major regional supermarket chain in central Japan. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251207372064/en/ Takaya Taguchi (left), CEO of Helical Fusion Co., Ltd. , and Masayuki Kono (right) Managing Director and Head of Administration Division of Aoki Super Co., Ltd. at the press conference held on December 8, 2025 This marks the first fusion-energy PPA ever signed in Japan, representing a concrete step forward in the real-world adoption of fusion energy and signaling growing demand-side engagement in the em
Tecnotree Mentioned in Various 2025 Gartner® Research8.12.2025 09:41:00 CET | Press release
Tecnotree is a 5G-ready digital Business Support System (BSS) provider with advanced AI/ML capabilities and multi-cloud extensibility. The company has been listed across thirteen 2025 Gartner research spanning Digital BSS, AI-driven monetization, digital marketplace enablement, and customer experience transformation. We believe these mentions reflects the continued relevance and strong applicability of Tecnotree’s solutions within the technology domains evaluated by Gartner. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251208688494/en/ Tecnotree Mentioned in Various 2025 Gartner® Research The research span Market Guides, Hype Cycles, Magic Quadrants, Critical Capabilities, and Competitive Landscape reports, which we think collectively provides an overview of how various technologies are evolving across the communications ecosystem. We believe that Tecnotree’s appearance across these research categories underscores what we
AI Won't Transform Mobility Without Unprecedented Collaboration, Study Reveals8.12.2025 09:25:00 CET | Press release
First comprehensive analysis of real-world AI applications exposes critical gap between technology's promise and scaled deployment, according to the MIT Mobility Initiative and Kearney Advanced Mobility Institute Artificial intelligence is quietly reshaping global transportation systems, but most deployments remain isolated pilots that haven't achieved scale – and the gap between AI's promise and its execution is widening, according to a landmark study launched today at CoMotion GLOBAL in Riyadh. The Envisioning the Future of Mobility Powered by AI report, developed by the MIT Mobility Initiative and Kearney Advanced Mobility Institute, analyzed input from 55 leading global organizations, including Google, Lyft, Uber Freight, Deutsche Bahn, and NEOM. The study mapped real-world AI applications across mobility systems in Europe, the Americas, APAC, and the Middle East – revealing both breakthrough potential and fundamental challenges in bringing AI-powered mobility to scale. The report
ATEC2025·Real-World Extreme Challenge Concludes with Zhejiang University Team Claiming $150,000 Prize for Breakthrough in Fully Autonomous Robotics8.12.2025 09:25:00 CET | Press release
Thirteen global teams push the boundaries of “no remote control” robotics, driving the evolution from teleoperated tools to autonomous agents The ATEC2025·Real-World Extreme Challenge successfully concluded on December 7 on the campus of The Chinese University of Hong Kong. A team from Zhejiang University emerged victorious from a field of 13 talented international squads by demonstrating exceptional fully autonomous embodied intelligence, securing the top prize of $150,000 USD. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251207877880/en/ A Zhejiang University team wins ATEC2025·Real-World Extreme Challenge Organized by the Chinese University of Hong Kong and co-hosted by Advanced Technology Exploration Community (ATEC), Peking University, Beijing Normal University, and Ant Group, ATEC2025·Real-World Extreme Challenge was the world’s first intelligent robotics challenge held entirely outdoors on natural terrain—featuring
SIAL Paris 2026 : The Entire Food Industry in One Place – An Unmissable Event for Professionals8.12.2025 09:00:00 CET | Press release
SIAL Paris 2026 is more than ever the world’s must-attend food industry event With less than a year to go, SIAL Parisonce again stands as a key international gathering for food industry professionals. With 85% of exhibition space already booked, the show demonstrates very strong momentum and appeal. SIAL Paris will welcome 295,000 professionals from 200 countries across a stunning 280,000 m² of exhibition space, covering all sectors of the food industry. Innovation at the core of global food transformation In a context marked by major demographic, environmental and geopolitical challenges, SIAL Paris stands as THE hub where innovation drives action, business, and transformation. It brings across all sectors’ ideas, projects, and solutions that address today’s challenges, all while inspiring food business around the world. As in every edition, the show will offer a unique immersive experience, facilitating meaningful meetings and business opportunities. SIAL Paris serves as the global i
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom