SAMSUNG-ELECTRONICS
24.8.2021 10:49:06 CEST | Business Wire | Press release
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today showcased its latest advancements with processing-in-memory (PIM) technology at Hot Chips 33 — a leading semiconductor conference where the most notable microprocessor and IC innovations are unveiled each year. Samsung’s revelations include the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system, and broadened PIM applications to embrace DRAM modules and mobile memory, in accelerating the move toward the convergence of memory and logic.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210824005418/en/
First integration of HBM-PIM into an AI accelerator
In February, Samsung introduced the industry's first HBM-PIM (Aquabolt-XL), which incorporates the AI processing function into Samsung's HBM2 Aquabolt, to enhance high-speed data processing in supercomputers and AI applications. The HBM-PIM has since been tested in the Xilinx Virtex Ultrascale+ (Alveo) AI accelerator, where it delivered an almost 2.5X system performance gain as well as more than a 60% cut in energy consumption.
"HBM-PIM is the industry's first AI-tailored memory solution being tested in customer AI-accelerator systems, demonstrating tremendous commercial potential," said Nam Sung Kim, senior vice president of DRAM Product & Technology at Samsung Electronics. "Through standardization of the technology, applications will become numerous, expanding into HBM3 for next-generation supercomputers and AI applications, and even into mobile memory for on-device AI as well as for memory modules used in data centers."
"Xilinx has been collaborating with Samsung Electronics to enable high-performance solutions for data center, networking and real-time signal processing applications starting with the Virtex UltraScale+ HBM family, and recently introduced our new and exciting Versal HBM series products,” said Arun Varadarajan Rajagopal, senior director, Product Planning at Xilinx, Inc. “We are delighted to continue this collaboration with Samsung as we help to evaluate HBM-PIM systems for their potential to achieve major performance and energy-efficiency gains in AI applications.”
DRAM modules powered by PIM
The Acceleration DIMM (AXDIMM) brings processing to the DRAM module itself, minimizing large data movement between the CPU and DRAM to boost the energy efficiency of AI accelerator systems. With an AI engine built inside the buffer chip, the AXDIMM can perform parallel processing of multiple memory ranks (sets of DRAM chips) instead of accessing just one rank at a time, greatly enhancing system performance and efficiency. Since the module can retain its traditional DIMM form factor, the AXDIMM facilitates drop-in replacement without requiring system modifications. Currently being tested on customer servers, the AXDIMM can offer approximately twice the performance in AI-based recommendation applications and a 40% decrease in system-wide energy usage.
"SAP has been continuously collaborating with Samsung on their new and emerging memory technologies to deliver optimal performance on SAP HANA and help database acceleration," said Oliver Rebholz, head of HANA core research & innovation at SAP. “Based on performance projections and potential integration scenarios, we expect significant performance improvements for in-memory database management system (IMDBMS) and higher energy efficiency via disaggregated computing on AXDIMM. SAP is looking to continue its collaboration with Samsung in this area.”
Mobile memory that brings AI from data center to device
Samsung's LPDDR5-PIM mobile memory technology can provide independent AI capabilities without data center connectivity. Simulation tests have shown that the LPDDR5-PIM can more than double performance while reducing energy usage by over 60% when used in applications such as voice recognition, translation and chatbot.
Energizing the ecosystem
Samsung plans to expand its AI memory portfolio by working with other industry leaders to complete standardization of the PIM platform in the first half of 2022. The company will also continue to foster a highly robust PIM ecosystem in assuring wide applicability across the memory market.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20210824005418/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IFF to Webcast Fireside Chat at Barclays Global Consumer Conference on Sept. 1018.8.2026 22:15:00 CEST | Press release
IFF (NYSE: IFF) today announced that Chief Executive Officer Erik Fyrwald will participate in a fireside chat at the Barclays Global Consumer Conference on Thursday, Sept. 10, 2026 at 945 a.m. ET. Investors may access the live webcast on the Company's website at ir.iff.com. For those unable to listen to the live webcast, a recorded version will be made available for replay. Welcome to IFF At IFF (NYSE: IFF), we make joy through science, creativity and heart. As the global leader in flavors, fragrances, and health and biosciences, we deliver groundbreaking, sustainable innovations that elevate everyday products—advancing wellness, delighting the senses and enhancing the human experience.Learn more at iff.com, LinkedIn, Instagram and Facebook. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818490253/en/
Lehman Brothers Treasury Announces the Successful Sale of its Remaining Intercompany Claim against Lehman Brothers Holdings Inc.18.8.2026 21:15:00 CEST | Press release
In connection with its previously announced final wind-down, Lehman Brothers Treasury Co. B.V. in liquidation (“LBT”), through its U.S. counsel Herbert Smith Freehills Kramer (US) LLP, announced that its placement agent, Seaport Loan Products LLC, successfully closed the sale of LBT’s remaining $19.6 billion Class 4A intercompany claim against Lehman Brothers Holdings Inc. The net proceeds of the sale, together with certain available cash (but after deducting various sale-related and other administrative costs and expenses), will be used to fund a final distribution to the holders of LBT’s existing notes, after which such existing notes will be canceled and LBT shall be fully wound down. As a result, LBT will cease to exist. LBT expects the final distribution to occur in the course of October 2026 and the wind down to have been completed before the end of 2026. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818004215/en/
GenBio AI Builds First World Model of the Human Cell18.8.2026 15:00:00 CEST | Press release
First-of-its-kind system simulates human cell behavior across the full biological hierarchy, from DNA and RNA through protein to the whole-cell level GenBio AI ('GenBio') is an AI for Science company co-founded by Nobel Laureate David Baker, leading AI scientist Eric Xing, and other prominent life science and artificial intelligence researchers from Stanford, Carnegie Mellon University, Mohamed Bin Zayed University of Artificial Intelligence, Harvard, Weizmann Institute, and other research institutions. Today, the company introduced AIDO Cell, its virtual cell world model — the first system capable of simulating a human cell, both in its natural state and in response to drugs and other interventions, across its full biological hierarchy, from DNA and RNA through protein to the whole-cell level. A Key First in Biological and Medical Sciences: Full-hierarchy virtual cell simulation has been widely identified as a key milestone in computational biology. Compared to the previous efforts by
Xsolla Partner Network Expands Verified Creator Partnerships and Unifies Campaign Management Ahead of gamescom 202618.8.2026 15:00:00 CEST | Press release
Developers Gain Vetted Creator Partnerships And A Single Campaign Workflow, Managed From The Publisher Account They Already Use Xsolla, a global video game commerce company, today announced an expansion of the Xsolla Partner Network ahead of gamescom 2026 in Cologne, giving game developers a simpler, more reliable way to grow their games through creators. The creator platform now lives within Xsolla Publisher Account, where developers already run their business, with verified creator onboarding and a redesigned and unified campaign workflow. Flat-fee campaigns, a new guaranteed payment option alongside revenue share, and data-driven creator recommendations are coming soon. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818140062/en/ Graphic: Xsolla Xsolla Partner Network gives developers one place to launch, manage, track, and report on creator campaigns while Xsolla handles payments, payouts, taxes, and compliance.Verifi
KOCCA to Showcase 13 Korean Game Companies at ‘Gamescom 2026’ with PC, Mobile, and VR Lineups18.8.2026 14:48:00 CEST | Press release
- Featuring a diverse lineup of roguelike deckbuilders, AI-powered rhythm education, and cooperative horror games - Ranging from new titles based on the popular animated IP ‘LARVA’ to real-time K-POP dance coaching content - Hands-on experience available August 26–28 at the Korea Joint Pavilion B2B Hall, Koelnmesse, Booth Hall 3.2 C-050g–D051g The Korea Creative Content Agency (KOCCA) announced that 13 Korean game companies will gather under one roof at Gamescom 2026, Europe’s largest game show, held in Cologne, Germany, from August 26 to 28 (B2B, 09:00~20:00). Located in Booth Hall 3.2 C-050g–D051g, the Korea Joint Pavilion offers visitors hands-on experiences with an expansive lineup of titles, ranging from PC and mobile games to VR-powered titles across diverse genres. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818271881/en/ KOCCA will bring 13 Korean game companies to Gamescom 2026 in Cologne, Germany (Image: KOCC
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
