SAMSUNG-ELECTRONICS
6.5.2021 10:02:03 CEST | Business Wire | Press release
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210506005483/en/
Samsung’s I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.
Samsung’s new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.
“With the explosion of high-performance applications, it is essential to provide a total foundry solution with heterogeneous integration technology to improve the overall performance and power efficiency of chips,” said Moonsoo Kang, senior vice president of Foundry Market Strategy at Samsung Electronics. “With the mass-production experience amassed through I-Cube2 and the commercial breakthroughs of I-Cube4, Samsung will wholly support customers’ product implementations.”
In general, the silicon interposer area proportionally increases to accommodate more logic dies and HBMs. Since the silicon interposer in the I-Cube is thinner (around 100㎛ thick) than paper, the chances of bending or warping a larger interposer becomes higher, which negatively impacts product quality.
With strong expertise and knowledge on semiconductors, Samsung has studied how to control interposer warpage and thermal expansion through changes to material and thickness, succeeding in commercializing the I-Cube4 solution.
Additionally, Samsung has developed its own mold-free structure for I-Cube4 to efficiently remove heat and enhanced its yield by conducting a pre-screening test that can filter out defective products during the fabrication process. This approach provides additional benefits such as a reduction in the number of process steps, which result in cost savings and shorter turnaround time.
Since the launch of I-Cube2 in 2018 and eXtended-Cube (X-Cube) in 2020, Samsung’s heterogeneous integration technology has signaled a new era in the high-performance computing market. Samsung is currently developing more advanced packaging technologies to I-Cube6 and higher by using a combination of advanced process nodes, high speed interface IPs and advanced 2.5/3D packaging technologies, which will help customers design their products in the most effective way.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .
# # #
View source version on businesswire.com: https://www.businesswire.com/news/home/20210506005483/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Rubedo’s RLS-1496 Reduces Actinic Keratosis Pre-Cancerous Skin Lesions by 46% at Four Weeks with Minimal Irritation in Preliminary Results of Phase 1b/2a Study28.5.2026 14:30:00 CEST | Press release
RLS-1496 is an investigational, first-in-class, disease-modifying, selective glutathione peroxidase 4 (GPX4) modulator that targets pathologic senescent and other stressed, aging cells that drive chronic, age-dependent diseases, such as AK, and represents a novel drug category — Adaptive SenoTherapeutics In recognition of May as Skin Cancer Awareness Month, Rubedo is calling attention to the myths and facts surrounding AKs — and to the urgent need for a new generation of treatments that are effective without the side-effect burden of today's options Rubedo Life Sciences, Inc. (Rubedo), an AI-driven, clinical-stage biotech focused on selective cellular rejuvenation medicines targeting aging cells, today announced preliminary results from a Phase 1b/2a study of RLS-1496 in patients with actinic keratosis (AK), a common age-related condition resulting in precancerous skin lesions, that is most commonly seen after age 65.1 The open-label multi-center trial, conducted in the United States,
ExaGrid Wins 5 Industry Awards at Network Computing Awards 202628.5.2026 14:00:00 CEST | Press release
ExaGrid named “Company of the Year” for seventh year in a row ExaGrid®, the world’s largest independent backup storage vendor providing Tiered Backup Storage with the most Comprehensive Security and AI-Powered Retention Time-Lock for Ransomware Recovery, today announced that company was honored with five industry awards, including Air-gapped Ransomware Recovery Product of the Year, Bench Tested Product of the Year, Company of the Year, Data Protection Product of the Year, and the Storage Product of the Year during the Network Computing Awards ceremony, held in London on May 21, 2026. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260528849813/en/ The ExaGrid team headed to the stage five times throughout the Network Computing Awards ceremony in London to accept awards for ExaGrid Tiered Backup Storage. Photo courtesy of Network Computing Awards. The Network Computing Awards are determined by public vote. The 2026 awards mark
Ardoq Launches AI-First Enterprise Architecture Platform28.5.2026 14:00:00 CEST | Press release
Custom Agents, Omnipresent AI Assistant, and AI Import Builder Automate an Estimated 40% of Routine EA Work; Tenneco Already Achieving 292% ROI on Ardoq AI Ardoq, named a 5x Leader in the Gartner® Magic Quadrant™ for Enterprise Architecture Tools, today launched its AI-first enterprise architecture (EA) platform. The release grounds every Ardoq AI output in customers' live architecture data and introduces a new generation of AI agents capable of automating an estimated 40% of routine EA work. Architects today are being asked to defend decisions that generic AI is generating in seconds. Application rationalization choices. ERP transformation roadmaps. AI governance reviews. The questions land on the architect's desk, but the analysis underneath increasingly comes from AI assistants that do not know the architecture. Generic agents reason on whatever document is in front of them, not on the live relationships between applications, dependencies, capabilities, and risks. Ask a generic LLM
European DataWarehouse Launches DealDox®, a Next-Generation Virtual Data Room Built specifically for the Securitisation Market28.5.2026 14:00:00 CEST | Press release
European DataWarehouse (EDW) announced today the launch of DealDox®, a secure virtual data room uniquely tailored to the needs of the securitisation and structured finance market. Developed in response to long‑standing challenges around transaction data and document management, DealDox provides a single, secure environment where all parties throughout the deal lifecycle can collaborate efficiently while maintaining high standards of security, governance, and regulatory alignment. DealDox enables the centralised management of transaction data and documentation, offering robust security, granular access controls, and clear audit trails. The platform integrates seamlessly with EDW’s existing regulatory reporting ecosystem, supporting smoother workflows from deal preparation through to disclosure and compliance. “As a market infrastructure, our role is to reduce complexity and make processes simpler and more transparent for all participants,” said Dr. Christian Thun, CEO of European DataWa
SLB and Vår Energi Expand Digital Collaboration to Scale Well and Integrated Field Development Planning28.5.2026 13:47:00 CEST | Press release
Agreement supports Vår Energi’s ambition to reduce time to first oil, building on multi-discipline, collaborative well planning workflows that reduce cycle times from months to days Global energy technology company SLB (NYSE: SLB) today announced an expanded collaboration with Vår Energi to scale well planning and integrated field development planning across its Norwegian Continental Shelf operations. With collaborative well planning already reducing cycle times from months to days and integrated field development planning expected to support similar benefits, the expanded deployment is designed to support faster, more consistent decision-making as operators work to sustain production from mature offshore assets while managing increasing development complexity. As part of the expanded collaboration, Vår Energi is deploying the Delfi™ digital platform to connect exploration, subsurface evaluation, well planning, subsea design, field development planning, and production in a cloud-native
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom