SAMSUNG-ELECTRONICS
6.5.2021 10:02:03 CEST | Business Wire | Press release
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210506005483/en/
Samsung’s I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.
Samsung’s new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.
“With the explosion of high-performance applications, it is essential to provide a total foundry solution with heterogeneous integration technology to improve the overall performance and power efficiency of chips,” said Moonsoo Kang, senior vice president of Foundry Market Strategy at Samsung Electronics. “With the mass-production experience amassed through I-Cube2 and the commercial breakthroughs of I-Cube4, Samsung will wholly support customers’ product implementations.”
In general, the silicon interposer area proportionally increases to accommodate more logic dies and HBMs. Since the silicon interposer in the I-Cube is thinner (around 100㎛ thick) than paper, the chances of bending or warping a larger interposer becomes higher, which negatively impacts product quality.
With strong expertise and knowledge on semiconductors, Samsung has studied how to control interposer warpage and thermal expansion through changes to material and thickness, succeeding in commercializing the I-Cube4 solution.
Additionally, Samsung has developed its own mold-free structure for I-Cube4 to efficiently remove heat and enhanced its yield by conducting a pre-screening test that can filter out defective products during the fabrication process. This approach provides additional benefits such as a reduction in the number of process steps, which result in cost savings and shorter turnaround time.
Since the launch of I-Cube2 in 2018 and eXtended-Cube (X-Cube) in 2020, Samsung’s heterogeneous integration technology has signaled a new era in the high-performance computing market. Samsung is currently developing more advanced packaging technologies to I-Cube6 and higher by using a combination of advanced process nodes, high speed interface IPs and advanced 2.5/3D packaging technologies, which will help customers design their products in the most effective way.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .
# # #
View source version on businesswire.com: https://www.businesswire.com/news/home/20210506005483/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Reply Signs Strategic Collaboration Agreement with AWS to Accelerate AI-Driven Cloud Transformation2.4.2026 10:00:00 CEST | Press release
Reply [EXM, STAR: REY] announced today that it has signed a strategic collaboration agreement (SCA) with Amazon Web Services (AWS) to accelerate the adoption of cloud and artificial intelligence solutions across key international markets. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260402597802/en/ This strategic collaboration agreement further reinforces Reply’s commitment to enable organizations across industries to harness the full potential of cloud and artificial intelligence technologies. At the core of the SCA is a strong focus on Artificial Intelligence and Generative AI. Leveraging the deep expertise of its specialized companies - Comsysto Reply, Data Reply, Sense Reply, and Storm Reply - Reply supports organizations in designing and deploying enterprise-grade GenAI solutions, including agentic AI systems for autonomous workflows, domain-specialized models for vertical industries, and governance frameworks aligne
Bending Spoons renews tech scholarship for women with €100,000 commitment2.4.2026 09:11:00 CEST | Press release
Bending Spoons today opened applications for the 2026 edition of its Women in Computer Science Scholarship. The program offers twenty scholarships, each worth €5,000, to university students pursuing technology degrees across Europe and the United Kingdom. This year’s recipients will also be invited to a two-day networking event in Milan in October, fully covered by the company. The initiative is part of a broader set of programs Bending Spoons runs to recognize and support the next generation of technology talent, including merit-based scholarships, networking events, and student competitions. "The students of computer science today will define what the field looks like in the years ahead," said Eva Milenkovska, talent manager at Bending Spoons and lead of the scholarship initiative. "This scholarship is about recognizing the women who are pushing themselves to excel and to help shape the future of the industry." This is the fourth time Bending Spoons has offered this specific scholars
SecurityTech on the Rise: G+D Reports Strong Order Intake and High Resilience in 20252.4.2026 08:30:00 CEST | Press release
In fiscal year 2025, Giesecke+Devrient (G+D) reaffirmed its position as global leader in SecurityTech for mission-critical infrastructure. In a market where security is becoming essential for technological and societal stability, G+D demonstrates strong growth prospects. In 2025, G+D achieved a record order intake of €3.6 billion (+8%). Revenue increased to €3.2 billion (+1%), although exchange rate effects dampened growth. The key figures underscore the company's strong operational performance and profitability: Adjusted EBIT reached a new high of €211 million. The substantial free cash flow of €119 million provides additional leeway for future investments. With its equally strong segments – Digital Security, Financial Platforms and Currency Technology – G+D boasts a resilient portfolio that effectively cushions market volatility. The company's success reflects this strategic strength, combining technological depth, a global presence and operational reliability. G+D is making targeted
Bona Releases 2025 Sustainability Report2.4.2026 08:05:00 CEST | Press release
Bona®, a global, family-owned company that supplies products for installing, renovating, maintaining, and restoring premium floors, has published its 2025 Sustainability Report. The report outlines progress across Bona’s three sustainability pillars – Respect our Planet, Care for People, and Trusted Business – and highlights the continued integration of sustainability into all aspects of its operations. “Our business is built on extending the life of existing flooring materials and reducing the need for replacement,” says Lidija Broström, Interim Chief Executive Officer at Bona. “At Bona, we are making steady progress in reducing our impact while building a stronger foundation for the future. By working closely with our partners, we aim to drive meaningful change across our value chain and contribute to a more sustainable future.” In 2025, Bona reduced total Scope 1 and 2 greenhouse gas emissions (market-based) by 46% compared to its 2022 baseline, reaching 1,338 tonnes of CO₂—surpassi
The Estée Lauder Companies Fully Establishes Its “One ELC” Operating Model and Reaches Milestone in Its Profit Recovery and Growth Plan1.4.2026 23:00:00 CEST | Press release
WPP Appointed First-Ever Global Media Partner, Unifying Media Execution Worldwide“One ELC” Operating Model Is Transforming How the Company Operates at Scale The Estée Lauder Companies Inc. (NYSE: EL) today announced WPP as its first-ever global media partner, marking a significant advancement of its One ELC operating model, a scalable system designed to operate faster, execute with greater discipline, and drive growth. In fully establishing One ELC, the Company also reached a significant milestone in its Profit Recovery and Growth Plan’s (PRGP) Restructuring Program — a key action plan priority of Beauty Reimagined. Stéphane de La Faverie, President and Chief Executive Officer, The Estée Lauder Companies, said, “With the appointment of WPP as our first-ever global media partner, our One ELC operating model is now fully established. This more unified and scalable system will enable us to be faster, more agile and efficient, and support unlocking additional growth. Together with our exec
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom