SAMSUNG-ELECTRONICS
6.5.2021 10:02:03 CEST | Business Wire | Press release
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210506005483/en/
Samsung’s I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.
Samsung’s new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.
“With the explosion of high-performance applications, it is essential to provide a total foundry solution with heterogeneous integration technology to improve the overall performance and power efficiency of chips,” said Moonsoo Kang, senior vice president of Foundry Market Strategy at Samsung Electronics. “With the mass-production experience amassed through I-Cube2 and the commercial breakthroughs of I-Cube4, Samsung will wholly support customers’ product implementations.”
In general, the silicon interposer area proportionally increases to accommodate more logic dies and HBMs. Since the silicon interposer in the I-Cube is thinner (around 100㎛ thick) than paper, the chances of bending or warping a larger interposer becomes higher, which negatively impacts product quality.
With strong expertise and knowledge on semiconductors, Samsung has studied how to control interposer warpage and thermal expansion through changes to material and thickness, succeeding in commercializing the I-Cube4 solution.
Additionally, Samsung has developed its own mold-free structure for I-Cube4 to efficiently remove heat and enhanced its yield by conducting a pre-screening test that can filter out defective products during the fabrication process. This approach provides additional benefits such as a reduction in the number of process steps, which result in cost savings and shorter turnaround time.
Since the launch of I-Cube2 in 2018 and eXtended-Cube (X-Cube) in 2020, Samsung’s heterogeneous integration technology has signaled a new era in the high-performance computing market. Samsung is currently developing more advanced packaging technologies to I-Cube6 and higher by using a combination of advanced process nodes, high speed interface IPs and advanced 2.5/3D packaging technologies, which will help customers design their products in the most effective way.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .
# # #
View source version on businesswire.com: https://www.businesswire.com/news/home/20210506005483/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Venture Global Announces New Long-Term LNG Partnership with Hanwha of Korea27.2.2026 01:00:00 CET | Press release
20-year sales and purchase agreement marks Venture Global’s first SPA with a Korean entity Today, Venture Global, Inc. (NYSE: VG) and Hanwha Aerospace Co., Ltd. announced the execution of a new Sales and Purchase Agreement (SPA) for the purchase of 1.5 million tonnes per annum (MTPA) of U.S. liquefied natural gas (LNG) from Venture Global for twenty years starting in 2030. This agreement brings Venture Global’s long-term contracted portfolio to over 46 MTPA. “Venture Global is thrilled to announce our first long-term supply deal in Korea through a new partnership with Hanwha Aerospace which marks another important step in expanding reliable, long-term LNG supply to our partners in Asia,” said Mike Sabel, CEO of Venture Global. “We are proud to support growing global energy needs with low-cost, secure American LNG while strengthening the strategic energy partnership between the United States and South Korea to support long-term industrial and economic growth.” About Venture Global Ventu
Hydnum Steel Secures 500 MW of Electrical Power, a Key Step Forward in the Construction of Its Clean Steel Plant in Spain27.2.2026 00:00:00 CET | Press release
The company will produce flat steel, a product for which the EU has an annual deficit of almost 11 million tons Hydnum Steel has taken a decisive step towards constructing Spain’s first clean steel plant after being granted access to the electricity grid at the Brazatortas node in the province of Ciudad Real. The company has been granted an electricity capacity of 500 MW, as published in the Official State Gazette, which should be enough to guarantee supply to its electric arc furnace. This concession marks a significant milestone for a pioneering project in the Iberian Peninsula. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260225309290/en/ Image recreating the steel plant that Hydnum Steel will build in Puertollano, Spain Hydnum Steel is consolidating its position as a reliable supplier of clean European steel. The fully digitally integrated plant will produce hot-rolled steel coils efficiently and sustainably, with bene
1089 Inc. Partners with Price Forbes and Oka-Lloyd's Syndicate 1922 to Launch Market-Defining First: Carbon Asset Insurance Framework for Transportation and Energy Sectors26.2.2026 23:01:00 CET | Press release
New program introduces dedicated insurance safeguards and immutable transfer infrastructure to advance fiscal maturation of global carbon markets, enabling scaled participation across world's highest-emitting sectors, Transportation and Energy. 1089 Inc., in collaboration with Price Forbes and Oka, The Carbon Insurance Company, announce launch of an insured carbon asset designed to bring institutional safeguards, disciplined financial architecture, and verifiable data integrity to carbon markets. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260226012782/en/ 1089 Inc. is Advancing Carbon™, focused on evolving global carbon markets and decarbonizing the highest-emitting sectors on the planet: Transportation and Energy. The framework provides defined risk coverage for 1089’s CX89 Advanced Fuels Carbon Assets, underwritten by Lloyd’s Syndicate 1922 and placed with the support of Price Forbes and Oka. The program introduces ins
Sun Nuclear QADS 2026 Event Combines Clinical Insight and New Innovations for Advancing Radiation Therapy QA26.2.2026 23:00:00 CET | Press release
15th QA & Dosimetry Symposium convenes medical physics and radiation therapy community in RomeTwo days of sessions span diverse topics from 24 clinical practitioners and thought leadersEvent introduces new Daily QA™ 4 Pro device and features expansion of AI-enabled solutions Sun Nuclear, a Mirion Medical company, today opened the QA & Dosimetry Symposium (QADS), taking place over the next two days in Rome, Italy. The 15th installment brings together more than 230 clinical physicists and radiation medicine professionals from nearly 40 countries. Participants from diverse clinical environments will earn continuing education credits while sharing practical insights, emerging approaches, and real-world experiences shaping the future of quality and patient safety in cancer care. Building on its legacy as a peer-driven forum with practical applications, QADS 2026 features sessions delivered by 24 speakers spanning: Future Directions in Machine and Patient QA and In-vivo Dosimetry Stereotacti
Lattice to Highlight Low Power, Edge-Ready Programmable Solutions at embedded world 202626.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced its exhibition plan for embedded world 2026, where it will demonstrate how its low power, small form factor FPGA innovations help engineers accelerate intelligent, scalable designs from cloud to sensor. At the event, Lattice will participate in expert panel discussions, lead conference sessions, and host an interactive booth experience filled with real-world solutions for the Automotive, Industrial, and Security markets from Lattice and its innovation partners. Who: Lattice Semiconductor What / When: Lattice Booth and Demo Showcase: March 10 – 12, Hall 4, Booth #528 Expert Panel featuring Lattice Chief Strategy and Marketing Officer Esam Elashmawi March 10 at 1:30 p.m. GMT+1, Hall 3, Booth #611 Conference Sessions March 10 at 5 p.m. GMT+1 Safety & Security: “Trusted Resilience Edge – Unified FPGA-TPM for Post-Quantum Cryptography RED & Cyber Resilience Act” March 11 at 10:30 a.m. GMT+1 IoT & Connec
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom