SAMSUNG-ELECTRONICS
12.1.2021 16:07:33 CET | Business Wire | Press release
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the Exynos 2100 through its first virtual event, Exynos On 2021 (www.youtube.com/samsung ). The new mobile processor is the company’s first premium 5G-integrated mobile processor built on the most advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210112005748/en/
“Our Exynos team has been committed to creating premium mobile computing experiences by bringing innovations to processors that are at the heart of today’s smart devices,” said Inyup Kang, president of System LSI Business at Samsung Electronics. “Today we are delighted to introduce the Exynos 2100, our most advanced mobile processor yet. Armed with powerful processing technologies and an advanced 5G modem on a power-efficient 5nm process node, Exynos 2100 will set a new standard for tomorrow’s flagship mobile devices.”
“At Samsung Electronics, we are dedicated to providing innovative technologies and services with our flagship devices to deliver the ultimate mobile experience to our customers,” said Kyeongjun Kim, Executive Vice President and head of Mobile R&D Office at Mobile Communications Business, Samsung Electronics. “With powerful processing, fast 5G connectivity, and intelligent AI-acceleration, the Exynos 2100 offers the utmost performance that meets the stringent quality standards and requirements for our next generation smartphone.”
“The evolution of technologies such as 5G, advanced graphics and machine learning have been critical in enabling new mobile experiences,” said Paul Williamson, vice president and general manager, Client Line of Business at Arm. “Arm and Samsung have collaborated closely to incorporate Arm’s powerful next-generation compute and graphics platform, at the heart of the Samsung Exynos 2100. As a result of our partnership, we are able to maximize performance and make these experiences a reality in next-generation mobile devices while delivering exceptional battery life.”
The chip’s computation and graphic processing performance have been improved and refined to surpass the power user’s performance expectations. As Samsung’s first 5G-integrated flagship mobile processor, the Exynos 2100 is built on an advanced 5nm EUV process technology that allows up to 20-percent lower power consumption or 10-percent higher overall performance than the 7nm predecessor. For further enhancement, the chip offers improved cache memory utilization and a stronger scheduler. The octa-core CPU comes in an improved tri-cluster structure made up of a single powerful Arm® Cortex® -X1 core that runs at up to 2.9GHz, three high-performing Cortex-A78 cores and four power-efficient Cortex-A55 cores delivering more than 30-percent enhancement in multi-core performance than the predecessor.
The Arm Mali™ -G78, which supports the latest APIs such as Vulkan and OpenCL, improves graphic performance by more than 40-percent for visually stunning and seamless graphics, enabling the most immersive on-screen mobile experiences yet, including gaming and AR/VR or MR(Mixed Reality). The Exynos 2100 also integrates advanced multi-IP governor (AMIGO) technology, which overlooks and optimizes power usages of CPU, GPU, and other processes, allowing longer use time even with intense on-screen activities. With such comprehensive efforts to increase energy efficiency of its products across software and hardware technologies, Samsung also continues its strive to help minimize the carbon footprint of tomorrow’s mobile devices.
AI capabilities will also enjoy a significant boost with the Exynos 2100. The newly-designed tri-core NPU has architectural enhancements such as minimizing unnecessary operations for high effective utilization and support for feature-map and weight compression. Exynos 2100 can perform up to 26-trillion-operations-per-second (TOPS) with more than twice the power efficiency than the previous generation. With on-device AI processing and support for advanced neural networks, users will be able to enjoy more interactive and smart features as well as enhanced computer vision performance in applications such as imaging.
The Exynos 2100’s advanced image signal processor (ISP) supports camera resolutions of up to 200-megapixels (Mp). It can connect up to six individual sensors and is able to process four concurrently for richer multi-camera experiences. With a multi-camera and frame processor (MCFP), the ISP can combine feeds from multiple cameras to improve zoom performance, enhance image quality for ultra-wide shots and more. With AI acceleration, the ISP offers a content-aware feature that quickly and seamlessly recognizes scenes, faces and objects and optimally adjusts the camera settings to capture the image with fuller detail.
The Exynos 2100’s integrated 5G modem supports 5G’s sub-6GHz and mmWave spectrums from 2G GSM/CDMA, 3G WCDMA and 4G LTE, for strong network coverage and reliability. The modem delivers a maximum downlink speed of up to 5.1-gigabits per second (Gbps) in sub-6-gigahertz (GHz) and 7.35Gbps in mmWave, or up to 3.0Gbps in 4G networks with 1024 Quadrature Amplitude Modulation (QAM) support.
The Exynos 2100 is currently in mass production.
For more information about Samsung’s Exynos products, please visit http://www.samsung.com/exynos .
Process |
5nm |
AI |
26 TOPS |
Multi-core |
Octa-core |
CPU (Main) |
Arm Cortex-X1 (2.9GHz) |
CPU (Sub) |
Arm Cortex-A78 and Cortex-A55 |
GPU |
Arm Mali-G78 |
Connectivity |
5G (sub-6GHz/mmWave), 4G LTE (1024 QAM), 3G WCDMA, 2G GSM/CDMA |
Memory |
LPDDR5 (51.2GB/s) |
Storage |
UFS 3.1, UFS 2.1 |
Camera (Rear) |
200MP |
Video (Encoding) |
4K UHD 120fps |
Video (Decoding) |
8K 60fps |
# # #
* Editor's Note: Actual performance may vary depending on device and user environment.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20210112005748/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 01:00:00 CEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 01:00:00 CEST | Press release
Production planned at Fab2 of Kitakami Plant Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stac
Bending Spoons S.p.A. announces closing of initial public offering2.7.2026 20:35:00 CEST | Press release
Bending Spoons S.p.A. (“Bending Spoons”), a leading technology company, today announces the closing of its initial public offering of an aggregate of 57,971,015 of its ordinary shares, at an initial public offering price of $29.00 per share. The offering consisted of 34,398,640 shares sold by Bending Spoons and 23,572,375 shares sold by certain selling shareholders (the “Selling Shareholders”). The gross proceeds from the offering to Bending Spoons, before deducting underwriting discounts and commissions and other offering expenses, was approximately $953,917,285.50. Bending Spoons did not receive any proceeds from the sale of shares by the Selling Shareholders. Bending Spoons’ ordinary shares began trading on the Nasdaq Global Select Market on July 1, 2026 under the ticker symbol “BSP”. Goldman Sachs International, J.P. Morgan, and Allen & Company LLC are acting as joint lead book-running managers for the offering. Wells Fargo Securities, BofA Securities, Jefferies, Evercore ISI, BNP
Strategic Partnership Between Record Asset Management and Admicasa2.7.2026 19:00:00 CEST | Press release
RAM Swiss Holding AG announces a strategic partnership with Admicasa Holding AG (Admicasa). RAM Swiss Holding AG is a subsidiary of LSE-listed Record Financial Group (Record) and part of the Record Asset Management (RAM) group of companies. The partnership is a milestone in the growth of Admicasa and marks an important step in the continued expansion of Record’s private markets platform. Subject to regulatory approval, the agreement, signed on 1st July 2026, provides RAM Swiss Holding AG with a 50% participation in the Admicasa Fondsleitung AG, part of Admicasa, and establishes a long-term partnership to develop investment opportunities in the Swiss and Global real estate market with a plan to expand into other asset classes in the medium term. RAM is the European asset management arm of Record, the LSE-listed specialist investment group managing USD 115 billion of assets on behalf of institutional clients worldwide. Record's client base comprises pension funds, foundations, sovereign
IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange2.7.2026 16:47:00 CEST | Press release
IQM begins trading on Nasdaq Global Select Market under the ticker symbol “IQMX” Company enters next phase of growth as a publicly traded leader in full-stack superconducting quantum computing IQM maintains a strong pro forma cash position of EUR 337 million IQM Quantum Computers (Nasdaq: IQMX) (“IQM”, “IQM Quantum Computers” or the “Company”), a global leader in full-stack superconducting quantum computers, today became a publicly traded company following the completion of its business combination with Real Asset Acquisition Corp. (“RAAQ”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702960460/en/ IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange The company’s American Depositary Shares begin trading today on the Nasdaq Global Select Market under the ticker symbol “IQMX”. The listing marks a major milestone for IQM establishing the company as the first European quan
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
