SAMSUNG-ELECTRONICS
7.10.2019 11:02:09 CEST | Business Wire | Press release
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20191007005298/en/
Samsung's new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.
The thickness of the package (720㎛) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity without having to change their system configuration designs.
In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.
“Packaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications, such as artificial intelligence (AI) and High Power Computing (HPC)," said Hong-Joo Baek, executive vice president of TSP (Test & System Package) at Samsung Electronics.
"As Moore's law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology."
Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed.
Also, by increasing the number of stacked layers from eight to 12, Samsung will soon be able to mass produce 24-gigabyte (GB)* High Bandwidth Memory, which provides three times the capacity of 8GB high bandwidth memory on the market today.
Samsung will be able to meet the rapidly growing market demand for high-capacity HBM solutions with its cutting-edge 12-layer 3D TSV technology and it hopes to solidify its leadership in the premium semiconductor market.
###
*8GB mass-production product= 8Gb x 8 layers, 24GB developed product= 16Gb x 12 layers
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20191007005298/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
NetApp and Cisco Accelerate and Secure AI Innovation3.6.2026 14:00:00 CEST | Press release
New FlexPod solutions deliver proven performance, security, and unified management for AI NetApp® (NASDAQ: NTAP), the Intelligent Data Infrastructure company, and Cisco (NASDAQ: CSCO) today announced that they have collaborated to offer new validated solutions for secure, scalable, and simplified AI. Expanding the proven success of FlexPod, the new solutions provide a simple, reliable path for enterprises to address the specific challenges AI workloads place on compute, network, and storage infrastructure. “As IT teams are tasked with delivering reliable, consistent performance across environments, AI workloads are placing increasing demands on their data infrastructure,” said Dallas Olson, Chief Commercial Officer at NetApp. “NetApp and Cisco’s longstanding partnership on FlexPod has already proven effective, saving customers up to 20 percent of their time in infrastructure management and maintenance. Now, we are applying our combined expertise to modern challenges to accelerate AI ad
New Evidence Offers Hope for Ketogenic Therapy in Treatment of Anorexia Nervosa3.6.2026 14:00:00 CEST | Press release
Peer-reviewed feasibility pilot trial reports reduced eating disorder and depressive symptoms in difficult-to-treat psychiatric condition A pilot study published today in Communications Medicine demonstrates the potential of a new approach to treating anorexia nervosa — a disorder for which effective treatments have been significantly limited. The research from UC San Diego School of Medicine reports that a ketogenic nutritional intervention — a high-fat, low-carbohydrate, moderate-protein diet — was feasible and safe for patients with weight-normalized and mildly underweight anorexia nervosa. The ketogenic intervention was well-tolerated by participants, with high adherence rates and no significant weight loss observed throughout the program. Furthermore, significant improvements were observed in eating disorder symptoms, with nearly 3 in 4 of study completers in the recovered range at study end, no longer meeting criteria for an anorexia nervosa diagnosis, and all completers experien
NetApp and Cisco Collaboration Strengthens Defense-in-Depth for Enterprise Cyber Resilience3.6.2026 14:00:00 CEST | Press release
New NetApp Splunk SOAR playbook helps contain ransomware attacks and limit data loss NetApp® (NASDAQ: NTAP), the Intelligent Data Infrastructure company, and Cisco (NASDAQ: CSCO), today announced an expansion of their collaboration to help customers strengthen defense-in-depth strategies for customers. Combining Intelligent Data Infrastructure with advanced analytics and observability capabilities, NetApp and Splunk have delivered deep, real-time visibility into storage and infrastructure health. Together, they are helping customers turn operational data into actionable insights that improve reliability, security, and business outcomes. By expanding their collaboration with the new NetApp Splunk Security Orchestration, Automation, and Response (SOAR) playbook, NetApp and Splunk are helping joint customers contain ransomware attacks and limit data loss at the storage layer, enhancing the containment of the blast radius of cyberattacks while increasing the speed and reducing the cost of
NIQ Named 2026 Retail & Consumer Goods Snowflake Product Partner of the Year3.6.2026 13:00:00 CEST | Press release
Award recognizes NIQ’s scalable commerce intelligence, data enrichment, and measurement solutions built on Snowflake’s AI Data Cloud NielsenIQ (NYSE:NIQ) today announced that it has been named the 2026 Retail & Consumer Goods Snowflake Product Partner of the Year award recipient by Snowflake, the AI Data Cloud company. NIQ was recognized for its achievements at Snowflake’s annual user conference, Snowflake Summit 26, for delivering scalable, cloud-native solutions on Snowflake that enable retailers, brands, and media partners to securely enrich data, measure performance, and unlock more precise, actionable commerce intelligence. Through Snowflake’s AI Data Cloud, NIQ helps joint customers collaborate across organizations, activate high-value data assets, and power advanced measurement while maintaining strong governance and data privacy controls. By embedding NIQ’s AI-driven data, models, and harmonization capabilities within Snowflake, customers can unify fragmented datasets into a tr
Aircall Acquires Piper AI to Turn Customer Conversations Into Revenue Action3.6.2026 12:03:00 CEST | Press release
The acquisition extends Aircall from AI-powered customer communications into multi-channel agentic revenue execution—automating follow-ups with prospects, CRM updates, deal scoring, and next steps after every customer interaction. Aircall, the AI-powered customer communications platform trusted by more than 23,000 businesses worldwide, today announced the acquisition of Piper AI, a revenue intelligence and agentic sales orchestration company. With Piper, Aircall extends its platform beyond the conversation itself—giving sales teams the tools to automatically act on every interaction, across every channel, from first touch to closed deal. Aircall already powers the conversations that drive revenue. Its platform unifies voice, SMS, and WhatsApp into a single workspace, with its AI Assist suite guiding sales reps before each call with account briefs, coaching them live with real-time playbooks and objection prompts, and automatically logging calls, generating summaries, and drafting follo
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom