SAMSUNG-ELECTRONICS
7.10.2019 11:02:09 CEST | Business Wire | Press release
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20191007005298/en/
Samsung's new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.
The thickness of the package (720㎛) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity without having to change their system configuration designs.
In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.
“Packaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications, such as artificial intelligence (AI) and High Power Computing (HPC)," said Hong-Joo Baek, executive vice president of TSP (Test & System Package) at Samsung Electronics.
"As Moore's law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology."
Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed.
Also, by increasing the number of stacked layers from eight to 12, Samsung will soon be able to mass produce 24-gigabyte (GB)* High Bandwidth Memory, which provides three times the capacity of 8GB high bandwidth memory on the market today.
Samsung will be able to meet the rapidly growing market demand for high-capacity HBM solutions with its cutting-edge 12-layer 3D TSV technology and it hopes to solidify its leadership in the premium semiconductor market.
###
*8GB mass-production product= 8Gb x 8 layers, 24GB developed product= 16Gb x 12 layers
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20191007005298/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
The Open Group Launches the Open Footprint® Standard, Edition 1.0 to Streamline Scope 1, 2, and 3 Emissions Management2.6.2026 09:00:00 CEST | Press release
The Open Group, the vendor-neutral technology and standards organization, today announced the release of the Open Footprint® Standard, Edition 1.0, that will help organizations streamline scope 1, 2, and 3 emissions reporting. The new standard is the first open emissions data model to address all three scopes, providing a comprehensive framework that enables organizations to collect and standardize data from their value chain and report across multiple jurisdictions. “There is an urgent need to streamline emissions data management and reduce the manual effort required to capture data within supply chains, perform data conversion, and report out to various regulators,” said Steve Nunn, President and CEO of The Open Group. “The Open Footprint Standard removes friction and lowers cost, helping organizations identify emissions reduction opportunities.” Key features of the model include: Standardized emissions data definitions and relationships Simplified emissions data sharing and interope
Thredd Renews and Expands Partnership with Caxton2.6.2026 09:00:00 CEST | Press release
Five-year renewal and strategic expansion strengthens travel, corporate, and parent-child card innovation Thredd, the AI-first issuer processing platform, today announced a five-year renewal and strategic programme expansion with Caxton, the leading payments solutions provider, reinforcing Thredd’s role as the company’s primary issuer-processor across consumer and corporate cards. Caxton, a leading UK payments provider, has partnered with Thredd since 2020 to power its multi-currency prepaid travel and expense cards. Customers can hold up to 15 currencies on a single card. As part of the renewed agreement, Thredd will bring Caxton’s parent-child card programme, nimbl, onto the Thredd platform. All nimbl customers will be re-carded as the programme is launched using Thredd’s infrastructure, with completion targeted before the end of the year. nimbl is a financial education-focused debit card designed for children aged 6–16, enabling parents to manage allowances and teach money managemen
Medscape Brings AI to the Hematology Frontline at EHA 20262.6.2026 08:00:00 CEST | Press release
Landmark symposium to equip clinicians with practical, ethical AI frameworks, chaired by a lead author of Europe's ESMO EBAI and ELCAP oncology guidelines. Medscape Education will launch Future-Ready Hematologists: Practical and Ethical Use of AI in Hematology and Oncology at EHA 2026 on June 11, where leading experts will convene to explore responsible AI in one of medicine's most complex, rapidly evolving specialties. Registration is free for all EHA delegates. Reserve your seat here. The session is chaired by Prof. Jakob N. Kather, MD, MSc, Else Kroener Fresenius Center for Digital Health, Technical University Dresden, and NCT, University Hospital Heidelberg. He is joined by Prof. Chan Cheah, MBBS, DMSc, Consultant Hematologist, Sir Charles Gairdner Hospital, Perth, Australia; and Prof. Matthew Lunning, DO, FACP, Chief of Hematology and Assistant Vice Chancellor of Research, University of Nebraska Medical Center. Hematology moves faster than any clinician can track alone. AI can clo
Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release
Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th
Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release
Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom