Business Wire

SAMSUNG-ELECTRONICS-CO.

Share
Samsung Announces Industry's First EUV DRAM with Shipment of First Million Modules

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully shipped one million of the industry's first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology. The new EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20200325005238/en/

"With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers,” said Jung-bae Lee, executive vice president of DRAM Product & Technology at Samsung Electronics. "This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market."

Samsung is the first to adopt EUV in DRAM production to overcome challenges in DRAM scaling. EUV technology reduces repetitive steps in multi-patterning and improves patterning accuracy, enabling enhanced performance and greater yields as well as shortened development time.

EUV will be fully deployed in Samsung's future generations of DRAM, starting with its fourth-generation 10nm-class (D1a) or the highly-advanced 14nm-class, DRAM. Samsung expects to begin volume production of D1a-based DDR5 and LPDDR5 next year, which would double manufacturing productivity of the 12-inch D1x wafers.

In line with the expansion of the DDR5/LPDDR5 market next year, the company will further strengthen its collaboration with leading IT customers and semiconductor vendors on optimizing standard specifications, as it accelerates the transition to DDR5/LPDDR5 throughout the memory market.

To better address the growing demand for next-generation premium DRAM, Samsung will start the operation of a second semiconductor fabrication line in Pyeongtaek, South Korea, within the second half of this year.

Timeline of Samsung DRAM Milestones

Date

Samsung DRAM Milestones

2021 (TBD)

4th-gen 10nm-class (1a) EUV-based

16Gb DDR5/LPDDR5 mass production

March 2020

4th-gen 10nm-class (1a) EUV-based DRAM development

September 2019

3rd-gen 10nm-class (1z) 8Gb DDR4 mass production

June 2019

2nd-gen 10nm-class (1y) 12Gb LPDDR5 mass production

March 2019

3rd-gen 10nm-class (1z) 8Gb DDR4 development

November 2017

2nd-gen 10nm-class (1y) 8Gb DDR4 mass production

September 2016

1st-gen 10nm-class (1x) 16Gb LPDDR4/4X mass production

February 2016

1st-gen 10nm-class (1x) 8Gb DDR4 mass production

October 2015

20nm (2z) 12Gb LPDDR4 mass production

December 2014

20nm (2z) 8Gb GDDR5 mass production

December 2014

20nm (2z) 8Gb LPDDR4 mass production

October 2014

20nm (2z) 8Gb DDR4 mass production

February 2014

20nm (2z) 4Gb DDR3 mass production

February 2014

20nm-class (2y) 8Gb LPDDR4 mass production

November 2013

20nm-class (2y) 6Gb LPDDR3 mass production

November 2012

20nm-class (2y) 4Gb DDR3 mass production

September 2011

20nm-class (2x) 2Gb DDR3 mass production

July 2010

30nm-class 2Gb DDR3 mass production

February 2010

40nm-class 4Gb DDR3 mass production

July 2009

40nm-class 2Gb DDR3 mass production

###

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com .

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

CSG Xponent Sweeps Up Top-Tier Analyst, Industry Recognition for Customer Journey Management, Analytics10.12.2025 14:30:00 CET | Press release

Independent evaluations from QKS Group, FinTech Futures and CMP Research validate CSG Xponent as a driver of real-time journey orchestration and analytics CSG® (NASDAQ: CSGS) today announced that its flagship customer engagement platform, CSG Xponent, has earned multiple honors for journey management, customer analytics and personalization. This third-party recognition underscores the strength of CSG Xponent as a full-service engagement platform – one that seamlessly combines in-depth journey analytics with real-time orchestration. In the past month alone, CSG Xponent has been named: A Leader in QKS Group’s SPARK Matrix™: Customer Journey Management, 2025. Winner for “Best Personalisation and User Experience Solution” in the FinTech Futures 2025 Banking Tech Awards. A Core Performing provider in CMP Research’s Prism for Customer Analytics. “CSG Xponent moves beyond broad segmentation to pinpoint each customer’s journey state, whether stalled, at-risk or ready to convert, and then quant

AI Power Surge and Energy Transition Push Global Project Finance into a New Era10.12.2025 14:30:00 CET | Press release

70% of finance professionals expect infrastructure to drive the strongest growth, followed by renewables (48%) and TMT (43%).53% now view private equity as a primary source of equity funding, signaling a major shift in capital dynamics.80% cite KYC requirements as the top execution challenge amid rising deal complexity. Global project finance is entering a transformative era, driven by soaring demand for energy capacity, accelerated digitalization and large-scale infrastructure upgrades, reshaping investment priorities worldwide. These insights come from new research commissioned by CSC, based on responses from 200 project finance professionals, revealing a market shifting toward more complex, capital-intensive projects and a greater reliance on private capital. CSC’s latest report, Project Finance at an Inflection Point: Adapting to New Realities1, reveals a sector that is rapidly expanding in both scale and complexity driven by capital increasingly targeting long-term, strategically

Kingswood Capital Management Enters Into a Definitive Agreement to Acquire Safran Passenger Innovations10.12.2025 14:00:00 CET | Press release

SPI is a leading global provider of in-flight entertainment and connectivity solutions for airlines and airplane manufacturers worldwide Kingswood Capital Management, LP (together with its affiliates, “Kingswood”) announced today that it has entered into a definitive agreement to acquire Safran Passenger Innovations (“SPI” or the “Company”) from Safran, an international high-tech company operating in the aviation, defense, and space markets. SPI is a leading global provider of in-flight entertainment and connectivity solutions for airlines and airplane manufacturers worldwide. Matt Smith will continue to serve as SPI’s CEO, and the entire SPI leadership team will remain in place. The transaction is expected to close early next year, subject to customary legal and regulatory requirements. Headquartered in Brea, California, SPI created and designed an award-winning in-flight entertainment and connectivity platform known as RAVE, recognized for its intuitive design, reliability, and innov

Armis Partners with KODE Labs and IntelliBuild to Streamline Security Operations Across the Building Management Lifecycle10.12.2025 14:00:00 CET | Press release

Integration secures smart building systems, empowering organizations to enhance their cyber resilience and make more informed decisions Armis, the cyber exposure management & security company, today announced a strategic partnership with KODE Labs and IntelliBuild to help organizations unify cybersecurity, operational intelligence and governance for building lifecycle management. The joint offering combines Armis’ continuous asset intelligence with KODE Labs’ performance trends and analytics, which are then operationalized by IntelliBuild’s governance and reporting. By translating accurate, verified intelligence into accountable action, organizations can streamline the operations of building management systems – from thermostats, lighting and badge readers to elevator controllers and security cameras – and proactively strengthen their cyber defenses. “To achieve real security in the new age of connected environments, you must have comprehensive, real-time protection across the entire a

FiRa Unveils New Membership Tier to Fuel Industry Growth10.12.2025 14:00:00 CET | Press release

New pricing model invites more companies to join FiRa’s collaborative ecosystem. FiRa® Consortium is expanding its membership structure with a new Associate tier that opens the door to broader industry involvement. With new revenue-based pricing, organizations of all sizes can now more easily help shape the future of precise, secure wireless experiences. By reducing cost-related barriers and expanding access to FiRa resources, this new tier opens the door for innovators, developers, and emerging players to contribute to the next generation of wireless capabilities. The updated structure gives companies a more flexible and accessible path to Associate membership: $7,500 USD for companies with annual revenue below $50 million USD $30,000 USD for companies with annual revenue above $50 million USD The refreshed Associate tier maintains all existing benefits, including participation in FiRa Working Groups, access to specifications, engagement in FiRa Plugfests, product certification opport

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye