ROBOSENSE
29.8.2022 16:49:11 CEST | Business Wire | Press release
RoboSense, a world-leading provider of Smart LiDAR Sensor Systems today announced that it will provide LiDAR for Great Wall Motor WEY Mocha DHT-PHEV LiDAR Edition. On the same day, WEY Mocha DHT-PHEV LiDAR Edition was officially launched at the 25th Chengdu International Auto Show.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20220826005302/en/
Great Wall Motor WEY Mocha SUV equipped with two RS-LiDAR-M1
Based on WEY’s Mocha DHT-PHEV LiDAR Edition, RoboSense, together with Haomo.AI and Qualcomm, jointly created the urban driving assistance solution NOH for WEY. In particular, RoboSense second-generation smart solid-state LiDAR (RS-LiDAR-M1) are deployed under the headlights on both sides of the vehicle, one on each side, which give Mocha DHT-PHEV accurate perception capabilities and provide an extra level of perception safety redundancy. Adopting the perception-focused technology path, Mocha DHT-PHEV can perceive, think and make decisions like a human being, and full coverage of China’s high-speed and urban road commuting scenes is realized - smarter intelligence for driving assistance; safer and cozier driving experience for consumers.
With the large-scale application of intelligent driving technologies, the increasingly more complex application scenarios put higher automotive-grade reliability requirements for LiDAR on the front side of the vehicle body. Mocha DHT-PHEV’s intelligent driving application scenarios cover all kinds of high-speed and urban road conditions. Complex road conditions will bring various challenges to LiDAR.
RS-LiDAR-M1 adopts highly-integrated design, and has passed a series of reliability tests in accordance with strict passenger vehicle standards, including mechanical shock, random vibration, high-pressure water impact, high and low temperature operation, high and low temperature damp heat, solar radiation, EMC, chemical anti-corrosion, salt spray and other tests. It fully meets the safety, reliability and service life requirements of Mocha DHT-PHEV in complex high-speed and urban road scenarios.
Meanwhile, thanks to the revolutionary 2D MEMS LiDAR technology platform, M1’s unique smart “GAZE” function can dynamically switch scanning modes according to different scenarios such as high-speed railways and urban areas, giving urban NOH ADAS solution the differentiated scenario perception capability, safeguarding and ensuring the smart driving experience of Mocha DHT-PHEV LiDAR Edition.
With its leading technological strengths in the field of LiDAR, RoboSense has obtained design wins for more than 50 models from companies including Great Wall Motor, BYD, FAW Hongqi, GAC AION, ZEEKR, WM Motor, Lotus Cars, Lucid Motors, Inceptio Technology and Zhito Technology. RoboSense will always pursue technological innovation and keep promoting the large-scale production of smart vehicles.
About RoboSense
RoboSense is a world-leading provider of Smart LiDAR Sensor Systems. With a complete portfolio of LiDAR sensors, AI perception and IC chipsets, RoboSense transforms conventional 3D LiDAR sensors with comprehensive data analysis and interpretation systems. Its mission is to innovate outstanding hardware and AI capabilities to create smart solutions that enable robots, including autonomous vehicles, to have perception capabilities superior to humans.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220826005302/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom