QUECTEL-WIRELESS
15.3.2023 09:01:42 CET | Business Wire | Press release
Quectel Wireless Solutions, a global IoT solutions provider, today announces the launch of its FGH100M Wi-Fi HaLow module, providing long range data transmission, low power consumption, less complexity as well as improved penetration through walls and other obstructions for a wide range of IoT applications.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230315005141/en/
Quectel launches Wi-Fi HaLow module to address extensive indoor and outdoor IoT applications (Photo: Business Wire)
Adopting IEEE 802.11ah wireless networking protocol, also known as Wi-Fi HaLow, operating in the license-exempt Sub-1 GHz range, the FGH100M module meets the unique requirements of the Internet of Things (IoT) with its Sub-1 GHz signal coverage, allowing users to control IoT devices in one kilometer radius. It provides ten times the range of traditional Wi-Fi, making it suited for both indoor and outdoor IoT scenarios such as home and industrial automation, smart agriculture, smart city, smart building, warehouse, retail store, campus and more.
“Integrating the game-changing Wi-Fi HaLow technology, our FGH100M module will deliver long range and robust Wi-Fi connections without having to sacrifice simplicity and efficiency,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “It is a very powerful complement to our already extensive range of Wi-Fi modules delivering functionality across Wi-Fi 4, Wi-Fi 5, Wi-Fi 6, and Wi-Fi 6E.”
Based on Morse Micro’s MM6108 Wi-Fi HaLow SoC, the FGH100M is compliant with IEEE 802.11ah Wi-Fi standard and operates in 850–950 MHz bands with 1/2/4/8 MHz channel width. It features 21 dBm maximum output power and 32.5 Mbps maximum transmission rate.
The FGH100M Wi-Fi HaLow module enables lower power connectivity than previous Wi-Fi technologies and is able to support coin cell battery devices operating for months or years, which is critical for use cases such as smart sensors and condition monitor. Unlike similar IoT technologies, Wi-Fi HaLow supports native IP and does not require proprietary gateways, controllers, or hubs, which greatly streamlines the installation and reduces operating costs.
With its ultra-compact size of 13.0 mm × 13.0 mm × 2.2 mm, the FGH100M effectively optimizes end-product size and design cost, and fully meets the demands of size-sensitive applications. Additionally, the module provides a wide range of interfaces including UART, SPI, I2C, SDIO 2.0, and PWM.
The FGH100M satisfies the latest Wi-Fi requirements for authentication and encryption including WPA3 and AES for over-the-air (OTA) traffic. It also supports SHA-256, SHA-384, SHA-512 encryption algorithms to better protect transmission data.
Engineering samples of the FGH100M Wi-Fi HaLow module are available now. To learn more about Quectel’s FGH100M, please visit Quectel at Embedded World 2023, Hall 3, Booth 318.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of over 4,000 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules, antennas and IoT connectivity.
With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information: www.quectel.com, LinkedIn, Facebook, and Twitter.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230315005141/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
Toshiba Showcases End-to-End Innovations Shaping What’s Next in Retail at EuroShop 202617.2.2026 15:45:00 CET | Press release
At EuroShop, Toshiba showcases intelligent, scalable solutions that combine AI, computer vision, and energy-efficient design to transform the future of retail. At EuroShop 2026, Toshiba Global Commerce Solutions will showcase how retailers across Europe are using scalable, sustainable innovation to address today’s challenges and build what’s next. Exhibiting in Hall 6, Booth C41 from the 22nd to 26th February, Toshiba will demonstrate technologies designed to evolve with retailers, empowering flexibility, resilience, and long-term growth, and prepare them for what’s next. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260216755053/en/ At EuroShop, we’re showing how Toshiba empowers retailers across all segments to transform with confidence by scaling intelligent solutions to deliver lasting impact. “Retailers are under pressure to move faster, operate more efficiently, and deliver better experiences than ever before. At Euro
Andersen Consulting Expands Executive Talent Capabilities With Lansdowne Executive Search17.2.2026 15:30:00 CET | Press release
Andersen Consulting strengthens its human capital practice through a Collaboration Agreement with Lansdowne Executive Search, a Dublin-based firm specializing in executive search, interim management and board level appointments. Founded in 2015, Lansdowne Executive Search is an Irish-owned firm, delivering C-level executive search, fractional executives, and board placement services. As a partner-led, boutique practice, Lansdowne is known for the deep involvement of senior leadership in all client engagements. Lansdowne helps clients navigate complex leadership transitions and growth strategies across a wide range of sectors including financial services, construction, nonprofit, agriculture, higher education, public sector, and TMT. “Great leadership is contextual and getting it right means understanding far more than just a resume,” said Tom Keane, partner at Lansdowne Executive Search. “Collaborating with Andersen Consulting gives us the scale and access to expertise we need to conti
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom