QUECTEL-WIRELESS
21.6.2022 11:02:13 CEST | Business Wire | Press release
Quectel Wireless Solutions has launched the new BG773A-GL ultra-compact LTE Cat M1, NB1 and NB2 module which offers integrated SIM (iSIM) support. The iSIM capability of this new module provides huge flexibility and simplicity for integrators and IoT service providers because, in essence, it enables a device with a single stock-keeping unit (SKU) number to have the right connectivity to support its needs globally. Ultimately, this provides a simpler way for integrators to adopt cellular connectivity, removing the needs for country-specific SIM cards and simplifying the logistics of traditional, plastic SIM deployments by eradicating the need for on-site or in-country adaptations.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20220621005267/en/
Quectel has been at the forefront of making the promise of iSIM a reality and has been working to tightly align module performance with the new wave of embedded and integrated SIM features that are revolutionizing what is possible in IoT connectivity.
The BG773A-GL module also features ultra-low power consumption implemented by the MIPS 5150 processor and integrated RAM and flash, which help reduce current consumption to low levels in various modes, including power saving mode (PSM) and extended discontinuous reception (eDRX). Importantly, the BG773A-GL boasts a comprehensive hardware-based security feature - Integrated Security Elements (ISE). This is essential because iSIM relies on having a robust secure element to enable it to connect to the best available connectivity at the point of deployment. The module will be commercially available from mid July 2022.
“We’re delighted to have launched the Quectel BG773A-GL module which brings iSIM-enabled connectivity to the global marketplace,” says Richard Hart, Director of Global Connectivity, Quectel Connectivity Solutions . “By enabling integrators to create a single global product with one SKU, logistics and supply chain issues are eliminated and IoT organizations can simply deploy their products anywhere safe in the knowledge that they will be able to access secure, high-quality connectivity with no need for localization and different variants to be manufactured for different markets. This is a giant leap forward for simplifying IoT and one of the key steps needed to build a smarter world.”
The module offers an ultra-compact SMT form factor of 14.9 mm × 12.9 mm × 1.9 mm and enables integrators and developers to design applications easily taking advantage of its low power consumption and compact design structure. The BG773A-GL’s industry-standard interfaces and abundant functionalities extend the suitability of the module to a wide range of IoT applications, such as wireless POS, smart metering, tracking, wearable devices, and many others.
Quectel has collaborated with Kigen , the iSIM pioneer and global security leader to enable the iSIM functionality on BG773A-GL. Kigen’s industry-leading iSIM OS and key insertion services bring a wide selection of networks that augment Quectel connectivity for OEMs to meet their market needs.
“Quectel’s adoption of Kigen iSIM as a pre-packaged solution in the BG773A-GL is a testimony to the maturity of iSIM technology and our ecosystem,” said Vincent Korstanje, CEO of Kigen. “Quectel is a market leader in high-volume manufacturing, and this collaboration will enable OEMs who want to move quickly from pure embedded play to offering full IoT solutions for global markets.”
For a live demonstration of the Quectel iSIM, visit Quectel on Booth No 171, Hall 5 at Embedded World Nuremberg, June 21- 23 2022.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of over 4,000 professionals sets the pace for innovation in cellular, GNSS and WiFi/BT modules, antennas and IoT connectivity. Listed on the Shanghai Stock Exchange (603236.SS), our international leadership is devoted to advancing IoT across the globe.
For more information: www.quectel.com , LinkedIn , Facebook and Twitter .
View source version on businesswire.com: https://www.businesswire.com/news/home/20220621005267/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products atKitakami Plant Fab23.7.2026 12:19:00 CEST | Press release
Companies Showcase Ongoing Buildout of Manufacturing Infrastructure at K2 to Address Growing Demand for NAND Flash Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their
VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 12:02:00 CEST | Press release
Enhancing image quality and visual perception for moving-camera systems VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adj
Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 11:11:00 CEST | Press release
Acquisition of WKS Group strengthens Messer’s Southeast Asia presence Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expert
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 01:00:00 CEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 01:00:00 CEST | Press release
Production planned at Fab2 of Kitakami Plant Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stac
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom