QUECTEL-WIRELESS
14.11.2022 09:01:38 CET | Business Wire | Press release
Quectel Wireless Solutions, a global IoT solutions provider, today announces its expanded Wi-Fi module portfolio with the launch of the FC6xE series of Wi-Fi/Bluetooth modules, based on Qualcomm’s QCA206x Wi-Fi 6E chip. Designed to deliver faster, more secure, and more robust Wi-Fi experiences than ever before, the FC6xE also features Bluetooth audio functionality.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20221113005138/en/
Quectel announces extended Wi-Fi 6/6E module portfolio to address home and commercial environments (Photo: Business Wire)
Supporting 2 × 2 MIMO and DBS, the FC6xE family provides a maximum data rate up to 3000 Mbps. With a compact and unified form factor of 19.9 mm × 18.0 mm × 2.1 mm, the FC6xE modules are the optimal Wi-Fi/Bluetooth solution for size-sensitive applications and can help customers reduce product size and optimize application design cost.
“Targeting the nascent Wi-Fi 6/6E market, the FC62E, FC64E, FC65E and FC66E all offer superior Wi-Fi 6/6E performance,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. "When used in combination with Quectel 5G modules, they also deliver best-in-class 5G functionality, guaranteeing ultra-reliable connections for a wide range of multi-user scenarios including smart homes, shopping malls, schools and factories.”
The modules join an already extensive range of Wi-Fi/Bluetooth modules delivering functionality across Wi-Fi 4, Wi-Fi 5, Wi-Fi 6, and Wi-Fi 6E.
RF Wi-Fi/Bluetooth modules
- FC20/21 - typically used in connecting with different Linux/Android application processors, the compact form factor, low power consumption, extended temperature range and stable SDIO interface allow this module to serve a wide range of IoT applications including consumer, safety, industrial, mobile hotspots and healthcare.
- FC80A - a high-performance Wi-Fi 5 module, supporting 2.4GHz and 5GHz RSDB (Real simultaneous dual band) and Bluetooth 5.1, the FC80A can meet the Wi-Fi & Bluetooth application design requirements expected across consumer fields including set top boxes and VR.
- FC909A - with a reliable SDIO 2.0 interface enabling WLAN capability, the FC909A also provides BT functions with low power consumption, making it ideal for mobile devices requiring battery powered and compact size.
MCU Wi-Fi/Bluetooth Modules
- FC41D - Based on a standalone Wi-Fi & Bluetooth chip, the FC41D can offer diversified applications for customers. Combined with its ultra-compact size, low power consumption, ultra-wide temperature range and high reliability, FC41D can meet the requirements of low flow control and data acquisition applications such as smart homes and industrial control.
The hosted range of Wi-Fi/Bluetooth modules are ideal for both home and commercial applications including set top boxes, smart TVs, and smart speakers in the home and POS, scanner, and printer applications in a business environment. The hosted range is also appropriate for a wide range of telematics applications. The MCU Wi-Fi/Bluetooth module is typically used as a connectivity link between IoT devices and public or private cloud.
Complementing the FC6xE modules are a range of antennas across the 2.4Ghz and 6Ghz spectrum including the YF0026AA FPC, YF0027AA FPC, YF0023AA FR4 and YEWT004AA while additional antennas can support 5Ghz spectrum.
For more information on the Quectel range of Wi-Fi/Bluetooth modules, head over to our website: https://www.quectel.com/wifi-iot-modules
For more information on Quectel antennas: https://www.quectel.com/product-category/antennas
Download our Wi-Fi 6 white paper: https://www.quectel.com/library/wifi-6-white-paper
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of over 4,000 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth® modules, antennas and IoT connectivity. With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information: www.quectel.com, LinkedIn, Facebook, and Twitter.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20221113005138/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Biocytogen Announces Clinical Milestone with First Patient Dosed in Phase 1 Trial of IDEAYA’s First-in-Class B7H3/PTK7 Bispecific TOP1 ADC IDE03428.2.2026 01:00:00 CET | Press release
IDE034 is a B7H3/PTK7 bispecific TOP1 ADC designed to target tumor cells expressing both B7H3 and PTK7 preferentially, and is being evaluated as monotherapy and in combination with IDEAYA’s PARG inhibitor IDE161. IDEAYA has dosed the first patient in its Phase 1 trial of IDE034, initially evaluating safety, tolerability, and PK. First dosing triggers a $5 million milestone payment to Biocytogen under the companies’ option and license agreement. Biocytogen Pharmaceuticals (Beijing) Co., Ltd. (Biocytogen, SSE: 688796; HKEX: 02315), a global biotechnology company that drives the research and development of novel antibody-based drugs with innovative technologies, today announced that its partner IDEAYA Biosciences, Inc. (“IDEAYA”; Nasdaq: IDYA) has dosed the first patient in IDEAYA’s Phase 1 dose-escalation/expansion clinical trial of IDE034, an investigational B7H3/PTK7 bispecific TOP1 ADC. Pursuant to the companies’ option and license agreement, first patient dosing triggers a $5 million
IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 13:00:00 CET | Press release
IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p
HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 12:00:00 CET | Press release
HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP)Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 ConstraintsNot Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. Cha
Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 09:15:00 CET | Press release
Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char
DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 08:18:00 CET | Press release
Will accelerate the development and mass production of EUV lithography photomasks Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers co
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
