Business Wire

QUECTEL-WIRELESS

1.9.2022 15:01:41 CEST | Business Wire | Press release

Share
Quectel announces advanced RM500Q 5G module powered by NVIDIA Jetson AGX Orin 32GB System-on-Module

Quectel Wireless Solutions has announced its advanced 5G modules — which securely and reliably connect devices and people to networks and services — are available now with the NVIDIA® Jetson AGX Orin™ 32GB system-on-module (SOM). With its Jetson edge AI platform, NVIDIA is accelerating the next wave of robotics, automation and artificial intelligence IoT. The platform’s power-efficient, compact and scalable capabilities include pre-trained AI models, software development kits and support for cloud-native technologies across the Jetson line-up.

As a global IoT solutions provider, Quectel’s products make life more convenient and efficient. Adding 5G modules to the Jetson ecosystem is set to make it easier for users to manage and build out deployments in smart cities, manufacturing, IoT, industrial applications and many other connected businesses and processes.

The latest NVIDIA Jetson offering, the Jetson AGX Orin 32GB SOM, has been integrated with the Quectel RM500Q series 5G sub-6GHz module. The most advanced module of its kind, it supports multiple concurrent AI application pipelines using an NVIDIA Ampere architecture GPU. With deep learning, vision accelerators, high-speed IO and fast memory bandwidth, the Orin enables complex AI models to solve problems such as natural language understanding, 3D perception and multi-sensor fusion. The Orin SOM delivers up to 275 TOPS of AI performance with power configurable between 15W and 60W. This provides more than eight times the performance of the Jetson AGX Xavier in the same compact form factor, which makes the Orin ideal for robotics and other autonomous machine use cases.

“We’re delighted to announce that our RM500Q series 5G module supports the NVIDIA Jetson AGX Orin platform,” said Norbert Muhrer, President & CSO, Quectel Wireless Solutions. “The combination of our ready-to-use Quectel 5G module and the Jetson AGX Orin platform helps simplify device development, improve product stability and accelerate time to market for customers’ terminals.”

Key features of the RM500Q series include LTE, in addition to 5G, as well as multi-constellation GNSS connectivity if desired. In addition, the module’s M.2 form factor and choice of USB 3.1 or PCIe 3.0 high-speed interfaces make it attractive to a wide range of device types and use cases. The module also offers optional voice over LTE (VoLTE) and Quectel’s Enhanced AT Commands.

About Quectel

Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of over 4,000 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth® modules, antennas and IoT connectivity. With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.

For more information: www.Quectel.com, LinkedIn, Facebook, and Twitter.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20220901005471/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release

Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye