PMDTECHNOLOGIES-AG
27.10.2020 21:24:11 CET | Business Wire | Press release
Gaming, virtual e-Commerce, 3D online education: Augmented Reality (AR) applications with three-dimensional depth sensors link the real with the digital world and are strongly demanded. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and pmdtechnologies developed a 3D depth sensor based on the Time of Flight (ToF)-technology which outperforms other solutions in the market and aims for target applications that offer a wider spectrum of innovative consumer usability. The 3D sensor market in smartphones for rear side cameras is expected to grow up to more than 500 million units per year until 2024.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20201027006197/en/
“The latest 3D image sensor from Infineon and pmdtechnologies enables a new generation of applications”, says Philipp von Schierstaedt, Senior Vice President Infineon Technologies AG. “It aims to create most immersive and smarter AR experiences as well as better photography results with a faster autofocus in low-light conditions or more beautiful night mode portraits based on picture segmentation. This latest chip development is truly setting standards when it comes to improvements of the imager, the driver and processing as well as unprecedented ten meters long range capabilities at lowest power.”
The new chip allows the integration into miniaturized camera modules, accurately measuring depth in short and long range for AR while meeting low power consumption requirements with more than 40 percent power saving on the imager.
Extended photography features and AR usability on long range
Due to its flexible configurability the new REAL3™ ToF sensor enables differentiated camera performance in a wide variety of ranges, light conditions and use cases while saving battery’s life in mobile devices. For various applications, the new sensor provides techniques like real-time augmented reality, long range scanning, small object reconstruction, fast low power autofocus and picture segmentation. Effects such as background blur in videos and pictures from moving scenes are easily enabled without the need for post-photography processing and regardless of ambient light conditions.
Furthermore seamless augmented reality sensing experiences are being achieved, allowing for high quality 3D depth data capture up to a distance of ten meters, without losing resolution in the shorter range. Always-on applications such as mobile AR gaming can greatly benefit from the small power budget required by the new sensor, and provide users with longer playtime than ever. For applications such as the 3D scanning for room and object reconstruction or 3D mapping for furniture planning and other design applications the sensor allows to double the measuring range beyond the current solution in the market.
The volume delivery for this chip starts in Q2 2021, demo kits are already available.
Watch the recorded livestream from the official press event at: https://livestream.com/infineontechnologies/real3
About pmdtechnologies ag
pmdtechnologies ag, a fabless IC company headquartered in Siegen, Dresden and Ulm/Germany with subsidiaries in the USA, China and Korea, is the worldwide leading 3D Time-of-Flight CMOS-based digital imaging technology supplier. Started up in 2002, the company owns over 400 worldwide patents concerning pmd-based applications, the pmd measurement principle and its realization. Addressed markets for pmd's 3D sensors are industrial automation, automotive and the wide field of consumer applications like smartphones.
Further information is available at pmdtec.com .
About Infineon
Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2019 fiscal year (ending 30 September), the Company reported sales of €8.0 billion with around 41.400 employees worldwide. With the acquisition of US-based Cypress Semiconductor Corporation in April 2020, Infineon has become a global top 10 semiconductor company.
Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).
Further information is available at www.infineon.com
This press release is available online at www.infineon.com/press
View source version on businesswire.com: https://www.businesswire.com/news/home/20201027006197/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Klarna Partners With EuroParcs to Offer Flexible Payments for Holiday Park Stays Across Europe27.3.2026 15:04:00 CET | Press release
Klarna, the global digital bank and flexible payments provider, today announces a new partnership with EuroParcs, one of Europe's fastest-growing holiday park operators. The collaboration gives holidaymakers in Germany, the Netherlands, Belgium, and Austria more flexibility in how they pay for their getaway. Guests booking through EuroParcs can now choose from a range of Klarna payment options tailored to their market: Germany & Austria: Pay in Full, Pay in 30 Days, Pay in 3, and Financing Netherlands: Pay in Full, Pay in 30 Days, and Pay in 3 Belgium: Pay in Full and Pay in 30 Days Nicole Defren, Head of Europe at Klarna, says: "Booking a holiday should feel exciting, not complicated – and that includes how you pay for it. With Klarna, EuroParcs guests can choose the payment option that suits them best, whether that's paying upfront, in a few weeks, or spreading the cost over time. From a cosy chalet on the Veluwe to a luxury villa in the Austrian Alps, we're making it easier for fami
Askey and Canoga Perkins Announce Strategic Collaboration at MWC Barcelona to Deliver Rapid-Deploy 5G Critical Communications Solutions27.3.2026 12:00:00 CET | Press release
Askeyand Canoga Perkinsannounced at Mobile World Congress Barcelona a Global Partnership to Deliver SyncMetra® Network Connectivity Solution, combining Canoga Perkins’ software-defined, IT-operated private 5G network transport along with Askey’s carrier-grade 5G radio access technology. At MWC Barcelona 2026, Askey Computer Corporation and Canoga Perkins announced a strategic partnership to deploy Canoga Perkins' SyncMetra® Platform across enterprise and service provider markets with Askey. This partnership pairs Askey’s carrier-grade radio access capabilities with Canoga Perkins’ industry-leading time-sensitive networking (TSN) and synchronization technology, enabling customers to simplify deployment of ultra-low-latency, highly reliable network services for 5G, edge compute, industrial automation, and mission-critical enterprise applications. The partnership enables joint go-to-market efforts, integrated product offerings, and expanded access to SyncMetra through Askey’s sales channe
SBC Medical Announces Fourth Quarter and Full Year 2025 Financial Results27.3.2026 11:40:00 CET | Press release
Q4 EPS more than doubles to $0.14 as profitability improves significantly year over year SBC Medical Group Holdings Incorporated (Nasdaq: SBC) (“SBC Medical” or the “Company”), a Management Services Organization operating a wide range of franchise businesses across diverse medical fields, today announced its financial results for the fourth quarter of fiscal year 2025 (three months ended December 31, 2025) and for the full fiscal year 2025 (twelve months ended December 31, 2025). Fourth Quarter 2025 Highlights Total revenues were $40 million, representing an 11% year-over-year decrease. Net Income attributable to SBC Medical Group was $14 million, representing a 117% year-over-year increase. Earnings per share, which is defined as net income attributable to the Company divided by the weighted average number of outstanding shares, was $0.14 for the three months ended December 31, 2025, representing 133% year-over-year increase. EBITDA1, which is calculated by adding depreciation and amo
NIQ Redefines Packaging Intelligence with Monthly, Harmonized Global Performance Visibility27.3.2026 11:00:00 CET | Press release
NIQ’s new solution brings unprecedented clarity into package types, materials, and true consumption across markets, closing critical industry gaps NielsenIQ (NYSE: NIQ), a global leader in consumer intelligence, today announced the launch of its Packaging Strategic Planner Global (SPG) Solution, the first harmonized global platform to deliver monthly visibility into packaging performance across materials, formats, and pack configurations. As packaging innovation accelerates, many organizations continue to rely on fragmented or annual data to inform packaging decisions. The Packaging SPG Solution closes this gap by providing real-time data delivered monthly across regions, enabling brands and packaging partners to uncover trends, grow revenue, and strengthen relationships with CPG and retail partners. Key Highlights: New monthly global packaging tracking capability Coverage across 200+ categories Visibility into 30+ package types and 20 package materials 10+ markets at launch, expanding
European DataWarehouse Claims Its First “Fintech Provider of the Year” Award and a Sixth “Data Provider of the Year” Title at GlobalCapital’s 2026 European Securitisation Awards27.3.2026 08:47:00 CET | Press release
European DataWarehouse (EDW) is pleased to announce that it has been named both “Data Provider of the Year” and “Fintech Provider of the Year” at the 2026 GlobalCapital European Securitization Awards in London. The award ceremony recognises outstanding achievements in European structured finance, with winners selected by popular vote from across the industry. As defined by GlobalCapital, the programme celebrates “the very best in the market, as chosen by the market.” This latest recognition marks the sixth time that EDW has received the prestigious Data Provider of the Year award, having previously been honoured in 2019, 2022, 2023, 2024 and 2025, reaffirming its long-standing commitment to transparency, data quality and innovation in European securitisation. Prof. José Manuel González-Páramo, Chairman of EDW, later commented: “ Winning this award for the sixth time highlights the continued trust the European securitisation market places in EDW. Transparency, data quality and reliabili
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom