OR-LATTICE-SEMICONDUCTOR
23.6.2021 18:02:13 CEST | Business Wire | Press release
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today launched the Lattice CertusPro™-NX general purpose FPGA family. As the fourth device family based on the Lattice Nexus™ platform to be launched in just 18 months, CertusPro-NX continues Lattice’s commitment to FPGA innovation with leadership power efficiency, the highest bandwidth in the smallest form factor in comparison to similar devices, and as the only FPGAs in their class with support for LPDDR4 external memory. With advanced performance capabilities and the highest logic density currently available on a Nexus-based device, CertusPro-NX FPGAs are designed to accelerate application development for the Communications, Compute, Industrial, Automotive, and Consumer markets.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210623005270/en/
“Many Edge devices require low power consumption for better thermal management, high system bandwidth for fast chip-to-chip communication, components with small form factors for compact device designs, robust memory resources to support data processing, and high reliability for mission-critical applications,” said Linley Gwennap, Principal Analyst at The Linley Group. “Lattice’s CertusPro-NX FPGAs address all of these factors; in particular, they far exceed the competition in mean time between failures (MTBF) and offer the lowest power in their class.”
“At Lattice, we are constantly looking for ways to innovate and design products based on the needs of our customers, and Lattice CertusPro-NX FPGAs are the latest example of how we’re delivering on this commitment,” said Gordon Hands, Senior Director of Product Marketing, Lattice Semiconductor. “The performance and differentiated features we’ve designed into CertusPro-NX deliver capabilities that were previously unavailable in low power FPGAs to support the next generation of Edge applications that OEMs are eager to provide to customers.”
CertusPro-NX FPGAs are designed to enable customer innovation in a wide range of applications, including data co-processing in intelligent systems, high-bandwidth signal bridging in 5G communications infrastructure, and sensor interface bridging in ADAS systems. Key features of the Lattice CertusPro-NX FPGA family include:
- Class-leading power efficiency – By leveraging Lattice’s innovations in FPGA fabric architecture and a low power FD-SOI manufacturing process, CertusPro-NX devices deliver exceptional performance while consuming up to four times less power than competing FPGAs of a similar class.
- Best-in-class system bandwidth – With support for up to eight programmable SERDES lanes capable of speeds up to 10.3 Gbps, CertusPro-NX FPGAs deliver the highest system bandwidth in their class to enable popular communication and display interfaces like 10 Gigabit Ethernet, PCI Express, SLVS-EC, CoaXPress, and DisplayPort.
- Optimized Edge processing – To meet demand for robust data co-processing in Edge AI and ML applications, CertusPro-NX FPGAs feature up to 65 percent more available on-chip memory than other similar FPGAs. CertusPro-NX devices are the only low power FPGAs currently supporting the LPDDR4 DRAM memory standard, which is preferred due to its projected long-term availability.
- High logic density - With support for up to 100k logic cells, CertusPro-NX FPGAs currently offer the highest logic density of any Nexus-based FPGA.
- Industry-leading reliability – Mission-critical automotive, industrial, and communications applications must deliver high availability to enable predictable performance and keep users safe. Thanks to innovations in the Lattice Nexus platform, CertusPro-NX devices are up to 100 times more resistant to soft errors.
- Smallest-in-class form factor – With a design footprint of 81 mm2 , CertusPro-NX FPGAs are up to 6.5 times smaller than competing devices. Small form factor is a key design consideration for developers of industrial cameras or the SFP modules used in communication systems.
CertusPro-NX is compatible with the latest version of the Lattice Radiant® design software also announced today. Lattice has already shipped CertusPro-NX samples to select customers. For more information about the technologies mentioned above, please visit:
- www.latticesemi.com/CertusPro-NX
- www.latticesemi.com/LatticeNexus
- www.latticesemi.com/LatticeRadiant
About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing Communications, Computing, Industrial, Automotive, and Consumer markets. Our technology, long-standing relationships, and commitment to world-class support let our customers quickly and easily unleash their innovation to create a smart, secure, and connected world.
For more information about Lattice, please visit www.latticesemi.com . You can also follow us via LinkedIn , Twitter , Facebook , YouTube , WeChat , Weibo , or Youku .
Lattice Semiconductor Corporation, Lattice Semiconductor (& design), and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. The use of the word “partner” does not imply a legal partnership between Lattice and any other entity.
GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210623005270/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
New Esri Press Book Empowers Users to Unlock the Potential of AI with the Power of Geography4.8.2026 16:35:00 CEST | Press release
Exploring GeoAI: Tools and Workflows Offers Cutting-Edge Geospatial AI Models and Step-By-Step Tutorials Using ArcGIS Esri has released Exploring GeoAI: Tools and Workflows, a practical guide for applying geospatial AI using ArcGIS. Designed for GIS professionals, analysts, and data scientists, the workbook supports real-world spatial analysis through hands-on GeoAI workflows. The book addresses the growing importance of GeoAI by guiding readers through data preparation, model training, evaluation, and deployment. Step-by-step tutorials use real-world datasets to demonstrate deep learning, object detection, lidar classification, transfer learning, and predictive spatial analysis in ArcGIS. Esri has released Exploring GeoAI: Tools and Workflows, a practical guide to applying geospatial artificial intelligence (GeoAI) using ArcGIS. Designed for GIS professionals, analysts, and data scientists, this hands-on workbook provides the knowledge and tools needed to integrate advanced AI workflo
Rehlko Defines What It Takes to Build AI-Ready Power Infrastructure as Data Center Energy Demands Evolve4.8.2026 15:15:00 CEST | Press release
New eBook highlights how increasingly dynamic AI workloads are reshaping critical power requirements and explores strategies for building resilient, scalable energy infrastructure Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today released new insights on the power infrastructure requirements emerging from the rapid growth of large language models and artificial intelligence. In its latest eBook, AI Readiness Starts with Power: Designing for Real-World Load Conditions, Rehlko examines how increasingly dynamic AI workloads are reshaping expectations for data center power systems and highlights key infrastructure considerations for operators seeking to scale AI capacity reliably and efficiently. As the eBook outlines, AI readiness is increasingly defined not by installed capacity, but by how systems perform under highly variable real-world load conditions. The AI Power Challen
HappyRobot Raises $150 Million Series C to Build Enterprise Superintelligence4.8.2026 14:30:00 CEST | Press release
New funding led by Prysm Capital and co-led by Eurazeo will accelerate global growth as HappyRobot expands its engineering, deployment and go-to-market teams HappyRobot, the company putting AI agents to work across complex enterprise operations, today announced it has raised $150 million in Series C funding led by Prysm Capital and co-led by Eurazeo. Existing investors a16z, Base10, Y Combinator are doubling down with participation from strategics like Koch Disruptive Technologies (KDT), Orange, and T.Capital (Deutsche Telekom), Bankinter, Endeavor Catalyst, Kfund and Wave-X. The round values the company at $1.2 billion post-money, bringing total funding to around $200 million and marking a new stage of growth as enterprises deploy AI agents across mission-critical work. HappyRobot works with more than 150+ enterprise customers, including DHL, Kuehne + Nagel, Naturgy, Repsol, and Uber, and has grown 5x since raising its Series B late last year. After first proving its platform in logis
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND4.8.2026 14:30:00 CEST | Press release
10th-generation QLC 3D flash memory represents a major leap forward for AI storage architectures, cloud platforms, and data‑intensive innovations Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804147821/en/ Leveraging the companies’ revolutionary CMOS directly Bonded to Array (CBA) technology2 which fabricates CMOS logic and the memory array on separate wafers before bonding them together with high-precision wafer-to-wafer alignment, the new generation improves read and write bandwidth c
Altasciences Completes Expansion of Research and Development Laboratory in Harleysville, Pennsylvania4.8.2026 14:00:00 CEST | Press release
Altasciences is excited to share it has expanded the R&D laboratory at its drug product formulation and manufacturing services facility in Harleysville, Pennsylvania, adding approximately 768 square feet of new laboratory space. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804164599/en/ From left to right: Nasir Egal (General Manager, CDMO Services); Marie-Hélène Raigneau (Chief Executive Officer); Anuji Abraham (Senior Director, Pharmaceutical Development, CDMO Services); Robert Sabelli (Co-Chief Operating Officer); Cathy Konidas (Chief Administrative Officer) The expansion brings together formulation development and analytical testing within a single laboratory. This integrated setup is designed to accelerate decision-making, streamline workflows, and strengthen collaboration across scientific disciplines. “With this expansion, we are strengthening our focus on early-stage integration, bringing our CDMO capabilities t
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
