Business Wire

OR-CXL-CONSORTIUM

2.8.2022 15:02:07 CEST | Business Wire | Press release

Share
CXL Consortium Releases Compute Express Link 3.0 Specification to Expand Fabric Capabilities and Management

The CXL Consortium, an industry standards body dedicated to advancing Compute Express Link™ (CXL™) technology, today announced the release of the CXL 3.0 specification. The CXL 3.0 specification expands on previous technology generations to increase scalability and to optimize system level flows with advanced switching and fabric capabilities, efficient peer-to-peer communications, and fine-grained resource sharing across multiple compute domains.

“Modern datacenters require heterogenous and composable architectures to support compute intensive workloads for applications such as Artificial Intelligence and Machine Learning – and we continue to evolve CXL technology to meet industry requirements,” said Siamak Tavallaei, president, CXL Consortium. “Developed by our dedicated technical workgroup members, the CXL 3.0 specification will enable new usage models in composable disaggregated infrastructure.”

Highlights of the CXL 3.0 specification:

  • Fabric capabilities
    • Multi-headed and Fabric Attached Devices
    • Enhanced Fabric Management
    • Composable disaggregated infrastructure
  • Better scalability and improved resource utilization
    • Enhanced memory pooling
    • Multi-level switching
    • New enhanced coherency capabilities
    • Improved software capabilities
  • Doubles the bandwidth to 64GTs
  • Zero added latency over CXL 2.0
  • Full backward compatibility with CXL 2.0, CXL 1.1, and CXL 1.0

“CXL 3.0 is a significant step forward in enabling heterogeneous computing,” said Kevin Krewell, principal analyst, TIRIAS Research. “With its expanded features for coherent memory sharing and new fabric capabilities, CXL 3.0 adds new levels of flexibility and composability required by present day and future data centers. The CXL Consortium has made exceptionally fast progress in delivering this important spec to the industry.”

CXL Consortium Presentations at Flash Memory Summit (FMS)

The CXL Consortium will introduce the new CXL 3.0 features at FMS, taking place August 2-4 at the Santa Clara Convention Center. View the FMS agenda for detailed information on the CXL presentations.

To schedule a meeting with a CXL representative during FMS, contact press@computeexpresslink.org .

Resources:

About the CXL™ Consortium

The CXL Consortium is an industry standards body dedicated to advancing Compute Express Link™ (CXL™) technology. CXL is a high-speed interconnect offering coherency and memory semantics using high-bandwidth, low-latency connectivity between the host processor and devices such as accelerators, memory buffers, and smart I/O devices. For more information or to join, visit www.computeexpresslink.org .

Compute Express Link and CXL are trademarks of the CXL Consortium. All other trademarks are the property of their respective owners.

Link:

ClickThru

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release

Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th

Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release

Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv

Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release

Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te

Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release

Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i

SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days2.6.2026 00:35:00 CEST | Press release

CINDE Assortment and Space closes the loop between assortment, planogram, and in-store execution, proven across 500-plus global CPG deployments Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram execution, and in-store compliance, compressing the category review cycle from four to six weeks to a matter of days. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602137061/en/ The platform is underpinned by SymphonyAI's Transferable Demand AI, a model trained across 25 years of retail data a

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye