NV-NTT
8.1.2021 07:06:30 CET | Business Wire | Press release
NTT Corporation (NTT)(TOKYO:9432) will exhibit at CES 2021, the world’s most influential tech event, which will be held online from Monday, January 11 to Thursday, January 14, 2021(EST). This is the second attendance at the CES for NTT following last year. Through presentations and videos, NTT will showcase as follows:
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210107005949/en/
Spotlight Session [Live]:
“NTT vision for moving IOWN forward”
Jun Sawada, President and Chief Executive Officer, NTT
Jan 12, 10:15–10:45am (EST) / Jan 13, 0:15–0:45am (JST)
Jun Sawada talks about how NTT is moving the IOWN initiative forward and its future prospects, hosted by top NTT INDYCAR SERIES driver Takuma Sato.
The IOWN initiative introduces photonics-electronics convergence technology into devices like LSI, silicon chipsets, as well as networks to achieve faster information processing and ultra-low energy consumption.
As a result, it is expected to develop a more flexible computing and communications infrastructure, and make more accurate predictions about the future by cyber physical interaction.
Exhibitor Presentation [On-demand]:
“The IOWN initiative for smart world in the future”
Katsuhiko Kawazoe, Executive Vice President, Head of Research and Development Planning, NTT
Katsuhiko Kawazoe presents how breakthrough innovation in optical technologies help make IOWN a reality, utilizing three key platform technologies and five use case scenarios.
Showcase Gallery [On-demand]:
Video presenting IOWN-related examples
NTT will showcase IOWN Use-case in the area of Healthcare, Environment and Energy, Agriculture, Sports & Entertainment, Mobility by short movies.
NTT will also launch “NTT R&D CES 2021 Special Room” on the “DOOR”, its 3D typed owned media that showcases IOWN-related videos and introduction video of the “DOOR”. The “DOOR” can be available through VR devices, smart phones and PCs. NTT’s contents of CES 2021 will be accessible on the “DOOR” after the middle of February, 2021.
Reference:
CES Official Website https://www.ces.tech/
NTT CES 2021 Special Website https://www.ntt.co.jp/activity/en/ces/
NTT R&D CES 2021 Special Room https://door.ntt/web/rooms/ces_room.html
1 IOWN (Innovative Optical and Wireless Network) is a future communication infrastructure that uses leading-edge optical and information processing technologies to create a smart world.
About NTT
NTT believes in resolving social issues through our business operations by applying technology for good. We help clients accelerate growth and innovate for current and new business models. Our services include digital business consulting, technology and managed services for cybersecurity, applications, workplace, cloud, datacenter and networks all supported by our deep industry expertise and innovation. As a top 5 global technology and business solutions provider, our diverse teams operate in 80+ countries and regions and deliver services to over 190 of them. We serve over 80% of Fortune Global 100 companies and thousands of other clients and communities around the world. For more information on NTT, visit www.global.ntt/
.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210107005949/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom