Business Wire

NJ-IEEE

Share
IEEE Announces Decision on Its Standards-related Patent Policy

The IEEE Standards Association Board of Governors (IEEE SA BOG) took action to update the Patent Policy for IEEE standards development, which will go into effect 01 January 2023.

These updates are intended to improve the clarity of IEEE’s standards processes related to patented technologies, while offering more options for stakeholders.

In accordance with IEEE SA’s policies and procedures, the following resolutions were approved by consensus without objections by the full IEEE SA BOG.

  • The IEEE SA BOG approved proposed updates to the IEEE SA Standards Board Bylaws, effective 01 January 2023.
  • The IEEE SA BOG approved proposed updates to the IEEE SA Letter of Assurance (LOA) form, effective 01 January 2023.
  • The IEEE SA BOG approved proposed updates to the patent policy FAQs, effective 01 January 2023.
  • For the same IEEE standard, in instances where there is one Submitter of an Accepted LOA under the 2015 policy and another Submitter of an Accepted LOA under a subsequent policy or using the Custom LOA Form Dated 13 June 2019 – Limited, the IEEE SA Board of Governors resolved that neither Submitter shall have a greater right to seek a Prohibitive Order against the other Party. In such instances, the least restrictive provisions regarding Prohibitive Orders shall apply to both Parties, except to the extent otherwise not permitted by law.
  • The IEEE SA BOG resolved that the Custom LOA Form Dated 13 June 2019 – Limited will no longer be accepted as of 01 January 2023.

About IEEE

IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, professional and educational activities, IEEE is the trusted voice in a wide variety of areas ranging from aerospace systems, computers, and telecommunications to biomedical engineering, electric power, and consumer electronics. Learn more at http://www.ieee.org

About the IEEE SA

IEEE Standards Association (IEEE SA) is a collaborative organization where innovators raise the world’s standards for technology. IEEE SA provides a globally open, consensus-building environment and platform that empowers people to work together in the development of leading-edge, market-relevant technology standards, and industry solutions shaping a better, safer, and sustainable world.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20220930005084/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Picsart and Zazzle Power the Creator-to-Commerce Evolution with Print-On-Demand Integration17.12.2025 20:47:00 CET | Press release

Partnership Gives Creators an End-to-End Solution to Create A Range of Products in the $205 Billion Creator Economy Picsart, the world’s leading digital creation platform with over two billion downloads and more than 100 million monthly active users, is partnering with Zazzle, the global leader in customized products and designs, to deliver an end-to-end printing solution for Picsart users. The new “vibe-design-to-print” integration works seamlessly with Picsart’s recently expanded suite of AI products, including AI Assistant and Flows, enabling creators to ideate, iterate, design, and bring their work to life as physical art and products. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251217882832/en/ Picsart and Zazzle Power the Creator-to-Commerce Evolution with Print-On-Demand Integration “At Picsart, our mission has always been to give creators the tools they need to bring their ideas to life,” said Hovhannes Avoyan, Fo

Inspiring Leadership Recognised: Anna Byrne Named Finalist at CIPD 2026 HR Awards17.12.2025 19:58:00 CET | Press release

ProAmpac, a global leader in flexible packaging and material science, is proud to announce that Anna Byrne has been selected as a finalist in the “Most Inspirational and Impactful Leader” category at the CIPD 2026 HR Awards in Ireland. This recognition highlights Anna’s exceptional leadership, her unwavering commitment to people-first practices, and her meaningful influence across the organisation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251217690526/en/ The CIPD HR Awards in Ireland The CIPD HR Awards highlight the people profession’s crucial role in driving strategy, leading transformation, and enabling organisations to thrive. Overseen by CIPD Ireland and supported by independent academic expertise, the awards celebrate innovation, integrity, and impact within modern HR practice. This year, the awards introduce four new categories, including the “Most Inspirational and Impactful Leader” award, reflecting the evolvi

GeologicAI Announces Acquisition of Lumo Analytics to Complete Its Integrated Sensor Suite Across Critical Minerals and Rare Earth Elements17.12.2025 17:53:00 CET | Press release

GeologicAI, the global leader in High-Resolution Decision Engineering for the critical minerals sector, today announced its acquisition of Lumo Analytics, a provider of the most compact and efficient Laser-Induced Breakdown Spectroscopy (LIBS) scanner in the market. LIBS is a rapid, non-destructive technique that uses a high-energy laser pulse to vaporize a tiny spot on a rock, creating a short-lived plasma which emits light unique to the elements present when it cools. This spectral “fingerprint” provides immediate chemical information about the material. For the mining sector, this means faster geochemical insights directly at the source, enabling more efficient exploration and resource evaluation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251217715846/en/ The transaction firmly cements GeologicAI’s position as the only truly comprehensive and integrated source of sensor data for the critical minerals industry. Buildi

Incyte Announces European Commission Approval of Minjuvi® (tafasitamab) for the Treatment of Relapsed or Refractory Follicular Lymphoma17.12.2025 17:20:00 CET | Press release

Minjuvi® (tafasitamab) in combination with lenalidomide and rituximab is the first CD19- and CD20-dual-targeted immunotherapy combination regimen approved for eligible patients in Europe with relapsed or refractory FLPatients with relapsed or refractory FL achieved significantly improved progression-free survival with Minjuvi in combination with rituximab and lenalidomide in the Phase 3 inMIND registration trialIn Western countries, including Europe, relapsed or refractory FL affects 2-4 out of every 100,000 people1 Incyte (Nasdaq:INCY) today announced that the European Commission (EC) has approved Minjuvi® (tafasitamab) in combination with lenalidomide and rituximab for the treatment of adult patients with relapsed or refractory follicular lymphoma (FL) (Grade 1-3a) after at least one line of systemic therapy. "The EC approval of Minjuvi addresses a critical need, bringing a new, first-of-its-kind, chemotherapy-free option to patients in Europe with relapsed or refractory FL,” said Bi

Rigaku Launches ONYX 3200, a Metrology Instrument for Semiconductor Manufacturing17.12.2025 16:00:00 CET | Press release

Enables complete metal inspection for all processes from chip wiring to advanced packaging on a single platform Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) announced the launch of the ONYX 3200, a new semiconductor metrology system to measure film thickness, composition and bump* structures for wafer-level processes. The system is engineered to help manufacturers stabilize quality and increase yield in the metal-wiring formation (back-end-of-line (BEOL)) and packaging processes of semiconductor chips. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251216597402/en/ ONYX 3200 Due to accelerating demands for AI, high-performance computing, data centers, mobile devices, and other devices, chip wiring and interconnect structures have grown increasingly delicate and complex. As a

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye