MN-DIGI-INTERNATIONAL
19.1.2023 10:01:43 CET | Business Wire | Press release
Digi International (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) solutions, connectivity products, and services, today launched two Digi ConnectCore® software service offerings – Digi ConnectCore® Cloud Services and Digi ConnectCore® Security Services. The offerings provide greater manageability and security for devices developed with Digi’s complete line of ConnectCore system-on-modules (SOMs).
Today’s OEMs – and their customers – need end-to-end hardware/software solutions to actively manage their device portfolios, gather data from devices in the field and deliver real-time updates and security patches as needed. Digi ConnectCore Cloud Services deliver the manageability they need to enable secure, over-the-air (OTA) software updates, access device data, and perform remote diagnostics, command and control. Digi ConnectCore Cloud Services also provide API access enabling custom applications and remote dashboards empowering OEMs to create innovative customer service plans.
Digi ConnectCore Security Services enable OEMs to maintain the security of products during their entire lifecycle and empower device makers to solve the ongoing challenge of keeping products secure after release. The services include the analysis and monitoring of a custom software bill of material (SBOM) and binary image running on Digi ConnectCore SOMs for security risks and vulnerabilities. To help remediate identified issues, the services provide a curated vulnerability report highlighting critical concerns, a security software layer including patches for common vulnerabilities, and consulting services.
Together, the two services provide a comprehensive software foundation that, in conjunction with Digi’s family of ConnectCore system-on-modules, enable OEMs to deliver highly secure, connected IoT products with increased product quality, improved technical support, and a stronger end-customer experience. Both Digi ConnectCore services support the entire family of Digi ConnectCore systems-on-modules.
Digi, an ST Authorized Partner, also announced the general availability of its Digi ConnectCore MP157 system-on-module (SOM), which leverages the STMicroelectronics STM32MP157C microprocessor and has a fully integrated dual-band Wi-Fi/BT interface. Now available in developer kits from Digi’s global channel partners, the tiny ConnectCore MP15 is ideal for handheld products with cameras and/or displays such as medical devices, environmental test equipment, industrial-grade human machine interfaces, or headless devices such as EV charging stations and renewable-energy controllers. By addressing the need to build intelligent, connected, and secure wireless products for healthcare, transportation, and industrial sectors, Digi ConnectCore MP1 SOMs offer unparalleled flexibility and scalability. The highly integrated solution includes a complete set of development tools, design support, software, and security building blocks to speed time to market.
“Digi ConnectCore Services continue our mission to reduce the complexity OEMs are facing with implementing full end-to-end industrial IoT solutions and simplify device security and management for our customers,” said Andreas Burghart, Senior Product Manager for Digi’s Embedded division. “The combination of innovative SOM hardware and software, cloud-based services, and comprehensive security improve our customers’ ability to deliver and manage secure, cost-effective solutions and extend our leadership in embedded systems.”
“Using the Digi ConnectCore MP1 SOM with integrated wireless capabilities reduces the design complexity significantly for OEMs, especially for companies that have designed products using the STM32 microcontroller portfolio,” said Jean-Philippe Moreno, Product Marketing Manager, STMicroelectronics. “For developers now moving into the higher performance microprocessor space, the Digi SOM solution reduces the risk significantly and helps to make this transition.”
For more information, visit Digi at the STMicroelectronics booth #447 at the IoT Solutions World Congress, Jan. 31–Feb. 2, 2023.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230118005014/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Adtran sets intra-data center benchmark with all-new ultra-low-power LiteWave800™ LPO module10.3.2026 14:00:00 CET | Press release
News summary: AI clusters and GPU fabrics demand massive capacity, yet traditional 800G optics increase energy consumption, heat and cost burdens Adtran’s LiteWave800™ introduces a new class of ultra-low-power, low-latency DR8 LPO modules built on a fully re-engineered design Breakthrough energy efficiency of 1pJ/bit enables greener, scalable intra-data center links for next-generation AI and cloud workloads Adtran today launched LiteWave800™, an ultra‑low‑power 800Gbit/s DR8 linear pluggable optics (LPO) module engineered to help data centers address the power, latency, thermal and bandwidth demands of modern AI and machine-learning (ML) workloads. As GPU clusters grow and short-reach links scale across dense server racks, operators need 800Gbit/s optics that deliver higher capacity within strict power and cooling limits. LiteWave800™ answers this challenge with a fully re-engineered architecture that significantly reduces energy consumption. Operating at just 1pJ/bit and consuming on
Hyperice Introduces Hypervolt 3 Line: More Powerful, Quieter, and Longer-Lasting Percussion Massage Devices10.3.2026 14:00:00 CET | Press release
Upgraded Line Includes Redesigned Head Attachments and New Carry Case for an Enhanced Warm-Up and Recovery Experience Hyperice, a high-performance wellness brand, today announced the global launch of the Hypervolt 3 line, its most advanced percussion massage technology to date. The three-device line features the Hypervolt Go 3 ($149), the Hypervolt 3 ($249), and the Hypervolt 3 Pro ($349) — achieving significant performance upgrades across the board at more accessible price points than industry competitors. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310934508/en/ The Hypervolt 3 line enables users to massage away stress and tension, loosen muscle knots, maintain flexibility and range of motion, accelerate warm-up before workouts, and recover quickly after activity. Hyperice has built its reputation over the last 15 years on one guiding principle: elite-level recovery technology designed to help everyone perform and mo
Verifone and Thales Unlock Seamless Global Connectivity for Payment Terminals10.3.2026 14:00:00 CET | Press release
Thales today announced a partnership with Verifone, a global leader in payment terminal solutions, to connect Verifone’s next-generation point-of-sale (POS) terminals using Thales eSIM technology. The collaboration aims to simplify device deployment and enable secure, flexible connectivity for payment terminals worldwide; as connectivity can be provisioned, managed and updated remotely throughout the device lifecycle. By using Thales eSIM management platform, Verifone removes the need for removable SIM cards and country-specific hardware versions, significantly reducing operational complexity for manufacturers and service providers alike. At the core of this partnership is Thales’s leadership in eSIM management for large-scale connected devices, enabling remote connectivity provisioning and management, in line with the latest GSMA SGP.32 IoT specifications. These standards support secure and interoperable management of connectivity profiles, making it possible to deploy devices globall
Nexthop AI Unveils Transformative, industry-leading Scale-out and Scale-across Switches engineered for Hyperscalers & NeoClouds10.3.2026 13:45:00 CET | Press release
Underlines focus on power efficient solutions, deployment velocity and open networking Nexthop AI, the leading pioneer of highly efficient AI Networking, today launched a range of products for scale-out, scale-across and front-end applications for cloud and AI datacenters. The launch portfolio sets new standards for performance, power efficiency, and deployment speed - very critical metrics in AI infrastructure. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310990709/en/ Nexthop AI's highly efficient scale-out and scale-across AI networking portfolio Nexthop also unveiled the Disaggregated Spine architecture - a new, highly efficient, scale-across network design developed in collaboration with a large hyperscaler. This innovative architecture decomposes the traditional monolithic chassis running proprietary software into independent, optimized, functional tiers. It features a scale-across leaf tier (data center fabric fa
Nexthop AI Accelerates Into Hypergrowth With Oversubscribed $500M Series B Funding, Catapulting the Company’s Valuation to $4.2 Billion10.3.2026 13:45:00 CET | Press release
New Tier-1 Investors, Led by Lightspeed Venture Partners, Join to Fuel Development of Highly Efficient, Next-Generation AI and Cloud Networking Solutions Nexthop AI, the leading pioneer of highly efficient AI Networking, today announced successful closure of an oversubscribed $500 Million Series B funding round, catapulting the company’s valuation to $4.2 Billion. This round was spearheaded by Lightspeed Venture Partners, with Andreessen Horowitz joining as a major investor, and participation from Altimeter and all existing investors. “The rapid growth of AI is forcing a fundamental rethink of data center network architecture — and that creates one of the largest infrastructure market opportunities we’ve seen in a generation, with the potential to build a $100B+ company. That conviction led us to invest in Nexthop AI from Day One,” said Guru Chahal, Partner at Lightspeed Venture Partners. “Nexthop is uniquely positioned to become the next great networking vendor by combining hyperscale
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
