MN-DIGI-INTERNATIONAL
13.3.2023 08:01:43 CET | Business Wire | Press release
Digi International, (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) solutions, connectivity products and services, is proud to announce the launch and immediate availability of the wireless and highly power-efficient Digi ConnectCore® 93 system-on-module (SOM) platform — designed for a wide range of medical, industrial, smart energy, transportation and Internet of Things (IoT) applications.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230313005120/en/
Digi ConnectCore 93 System-on-Module Unveiled at Embedded World 2023 (Graphic: Business Wire)
Based on the new NXP® i.MX 93 processor, Digi ConnectCore 93 is an integrated SOM platform for industrial and commercial applications, designed to simplify the development of embedded products by incorporating the latest technology as well as complete lifecycle management with Digi ConnectCore Cloud Services. Features such as integrated memory, superior power management, wireless connectivity, advanced security, and the open-source software platform, Digi Embedded Yocto Linux® — enable manufacturers to introduce their products to market faster with minimized expenses and risks using pre-approved wireless connectivity, remote management and cloud integration.
"We are delighted to further expand the Digi ConnectCore® product line," said Steve Ericson, Vice President, OEM Solutions at Digi International. "The launch of Digi ConnectCore 93 underlines our continued commitment to providing advanced solutions that make it easier for original equipment manufacturers to develop secure and connected products, while also reducing the cost of prototyping and development."
Featuring up to two versatile and power-efficient Arm® Cortex®-A55 cores, with a Cortex-M33 core, AI/ML Arm Ethos U65 neural processing unit (NPU) and NXP PMIC for maximum power efficiency, Digi ConnectCore 93 offers flexible connectivity with integrated 802.11ax dual-band Wi-Fi 6 and Bluetooth® 5.2. The Digi SMTplus® form factor (40mm x 45mm) and industrial rating delivers outstanding reliability for a wide range of IoT applications.
With a strong focus on ensuring both security and long-term durability, Digi ConnectCore 93 also features the Digi TrustFence® security framework, enabling OEM developers to incorporate important security and data privacy functions into their products. Furthermore, the i.MX 93 processor has been designed for industrial applications and is backed by NXP's Product Longevity Program, ensuring it will remain accessible for a decade or more, delivering extended assistance and reassurance to its users.
For more information about Digi ConnectCore 93 including a full list of features, please visit https://www.digi.com/products/embedded-systems/digi-connectcore/system-on-modules/digi-connectcore-93.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230313005120/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
David Hagan, Dean and Pegasus Professor at CREOL, The College of Optics and Photonics, Will Serve as Vice President of SPIE26.8.2026 05:00:00 CEST | Press release
Newly elected SPIE board members bring distinct backgrounds to optics and photonics community David Hagan has been elected to serve as the 2027 Vice President of SPIE, the international society for optics and photonics. He will serve as President-Elect in 2028, and as the Society’s President in 2029. The SPIE Board of Directors is influential in the scientific community, establishing policy and strategy and conducting activities of interest to SPIE Members. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825934622/en/ Top row, from left to right: David Hagan, Jim McNally, Mark Clampin. Bottom row, from left to right: Marla Dowell, Jana Kainerstorfer, Katie Schwertz The 2026 SPIE President, Julie Bentley, professor of optics at the University of Rochester, made the new electees announcement at the Annual General Meeting of the Society on 25 August during SPIE Optics + Photonics. Terms begin on 1 January 2027. In addition to
FORTÉ Acquires Vega Global, APAC's Largest Systems Integrator, Expanding Global Reach26.8.2026 03:00:00 CEST | Press release
With new presence in Asia, FORTÉ serves customers in more than 70 cities worldwide – the largest global footprint in the industry FORTÉ, the leader in communication and collaboration solutions designed for the modern workplace, today announced its acquisition of Vega Global, APAC’s largest systems integrator and a leading provider of workplace technology and audiovisual solutions serving corporate, education, government and other market segments. With this acquisition, FORTÉ adds to its international presence, including established office locations in Hong Kong, Mainland China, India, Japan, Taiwan, Thailand, Singapore, Korea, Vietnam, Australia, Philippines, Malaysia, Macau, New Zealand, Indonesia, and United Arab Emirates. With its headquarters in Minneapolis, Minn., FORTÉ also has operations in the U.S., Ireland, Germany, Sweden, the United Kingdom, and Mexico. “Multinational organizations need strategic partners who can deliver consistent communication and collaboration experiences
Access Advance Launches Exploration Phase for an AV1/AV2 Device and Software Patent Pool, Invites Participation of Potential Licensors26.8.2026 02:00:00 CEST | Press release
Access Advance LLC announced today that in conjunction with the recent release of the AV2 video codec specification, it has launched the exploratory phase for a new patent pool covering devices and software implementing the AV2 video codec, as well as its predecessor AV1. During this exploratory phase, Access Advance will engage with market participants to seek their input, including holding pool formation discussions with potential licensors to gather their feedback on the scope, structure, and terms of a prospective program. All patent owners with a good-faith belief that they own or control AV1 and/or AV2 essential patents are invited to participate in the pool formation discussions. AV1 adoption is being driven largely by members of the Alliance for Open Media (“AOM”). AOM members such as Google, Meta, and Netflix increasingly utilize AV1 to deliver video, and adoption now spans smart TVs, streaming media players, mobile devices, web browsers, and chipsets. AV2, AOM’s successor to
Lattice to Showcase Industrial FPGA Innovations at FPGAWorld Conference 202625.8.2026 22:00:00 CEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming FPGAWorld Conference 2026, taking place on Sept. 8, 2026, in Stockholm, Sweden. As part of the event, Lattice will deliver technical presentations and host a demo showcase focused on how its low power FPGA solutions are advancing Industrial IoT and sensor bridging applications. Who: Lattice Semiconductor What / When (GMT+2): Tuesday, Sept. 8, 2026 Lattice Demo Showcase Presentations (Track: 12:20 – 13:35, Room Brave 05) “Solving Your Power Puzzle: Lattice FPGAs’ Path to Uncompromised Low Power” “Practical Security Fundamentals for FPGA Engineers” Where: AFRY, Frösundaleden 2A, 169 70 Solna, Sweden The FPGAWorld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational and industrial cases,
France Becomes First Official Participant at Expo 2030 Riyadh25.8.2026 19:40:00 CEST | Press release
France is the first country to officially sign its Participation Contract for Expo 2030 Riyadh, a major milestone in its preparations and growing international momentum. The signing took place on the sidelines of the visit to France by His Royal Highness Prince Mohammed bin Salman bin Abdulaziz Al Saud, Crown Prince and Prime Minister. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825634516/en/ The ceremony in Paris was attended by H.H. Prince Faisal bin Farhan Al Saud, Minister of Foreign Affairs of the Kingdom of Saudi Arabia, and Dimitri S. Kerkentzes, Secretary General of the BIE. The Participation Contract was signed by Talal Al-Marri, Chief Executive Officer of Expo 2030 Riyadh, and Jacques Maire, Chairman of the Compagnie Française des Expositions (COFREX). The agreement formally establishes France’s participation in Expo 2030 Riyadh, providing the framework for its presence throughout the six-month event. It spec
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom