Business Wire

MN-DIGI-INTERNATIONAL

19.1.2023 10:01:43 CET | Business Wire | Press release

Share
Digi International Launches Digi ConnectCore® Services, Offering Software Foundation that Enables Manageability and Security of Digi ConnectCore Family of SOMs

Digi International (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) solutions, connectivity products, and services, today launched two Digi ConnectCore® software service offerings – Digi ConnectCore® Cloud Services and Digi ConnectCore® Security Services. The offerings provide greater manageability and security for devices developed with Digi’s complete line of ConnectCore system-on-modules (SOMs).

Today’s OEMs – and their customers – need end-to-end hardware/software solutions to actively manage their device portfolios, gather data from devices in the field and deliver real-time updates and security patches as needed. Digi ConnectCore Cloud Services deliver the manageability they need to enable secure, over-the-air (OTA) software updates, access device data, and perform remote diagnostics, command and control. Digi ConnectCore Cloud Services also provide API access enabling custom applications and remote dashboards empowering OEMs to create innovative customer service plans.

Digi ConnectCore Security Services enable OEMs to maintain the security of products during their entire lifecycle and empower device makers to solve the ongoing challenge of keeping products secure after release. The services include the analysis and monitoring of a custom software bill of material (SBOM) and binary image running on Digi ConnectCore SOMs for security risks and vulnerabilities. To help remediate identified issues, the services provide a curated vulnerability report highlighting critical concerns, a security software layer including patches for common vulnerabilities, and consulting services.

Together, the two services provide a comprehensive software foundation that, in conjunction with Digi’s family of ConnectCore system-on-modules, enable OEMs to deliver highly secure, connected IoT products with increased product quality, improved technical support, and a stronger end-customer experience. Both Digi ConnectCore services support the entire family of Digi ConnectCore systems-on-modules.

Digi, an ST Authorized Partner, also announced the general availability of its Digi ConnectCore MP157 system-on-module (SOM), which leverages the STMicroelectronics STM32MP157C microprocessor and has a fully integrated dual-band Wi-Fi/BT interface. Now available in developer kits from Digi’s global channel partners, the tiny ConnectCore MP15 is ideal for handheld products with cameras and/or displays such as medical devices, environmental test equipment, industrial-grade human machine interfaces, or headless devices such as EV charging stations and renewable-energy controllers. By addressing the need to build intelligent, connected, and secure wireless products for healthcare, transportation, and industrial sectors, Digi ConnectCore MP1 SOMs offer unparalleled flexibility and scalability. The highly integrated solution includes a complete set of development tools, design support, software, and security building blocks to speed time to market.

“Digi ConnectCore Services continue our mission to reduce the complexity OEMs are facing with implementing full end-to-end industrial IoT solutions and simplify device security and management for our customers,” said Andreas Burghart, Senior Product Manager for Digi’s Embedded division. “The combination of innovative SOM hardware and software, cloud-based services, and comprehensive security improve our customers’ ability to deliver and manage secure, cost-effective solutions and extend our leadership in embedded systems.”

“Using the Digi ConnectCore MP1 SOM with integrated wireless capabilities reduces the design complexity significantly for OEMs, especially for companies that have designed products using the STM32 microcontroller portfolio,” said Jean-Philippe Moreno, Product Marketing Manager, STMicroelectronics. “For developers now moving into the higher performance microprocessor space, the Digi SOM solution reduces the risk significantly and helps to make this transition.”

For more information, visit Digi at the STMicroelectronics booth #447 at the IoT Solutions World Congress, Jan. 31–Feb. 2, 2023.

About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20230118005014/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Navan Drives Global Travel and Expense Efficiencies at Viessmann Generations Group23.6.2026 10:01:00 CEST | Press release

Global purpose-driven family company improves transparency, cost control and employee experience with Navan Navan (NASDAQ: NAVN), the global AI-powered business travel and expense platform, today announced its collaboration with Viessmann Generations Group, a global family company with 109 years of entrepreneurial heritage, guided by the purpose of co-creating living spheres for generations to come. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260623797613/en/ Global purpose-driven family company improves transparency, cost control and employee experience with Navan Since implementing Navan in 2023, Viessmann Generations Group has increased transparency, reduced manual effort and improved the employee experience across travel and expense. Before partnering with Navan, Viessmann Generations Group managed travel and expense processes across several tools and workflows. Employees faced long support wait times, while the finan

ISOPLUS Selects Navan to Consolidate Global Travel and Expense Operations23.6.2026 10:00:00 CEST | Press release

Leading manufacturer of pipe systems deploys AI-powered platform to establish policy control, eliminate manual accounting, and drive measurable cost savings Navan (NASDAQ: NAVN), the global AI-powered business travel and expense platform, today announced it has been selected by ISOPLUS, a leading manufacturer of pre-insulated pipe systems for district heating and cooling, to consolidate its global travel and expense program. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260623669736/en/ Leading manufacturer of pipe systems deploys AI-powered platform to establish policy control, eliminate manual accounting, and drive measurable cost savings Following the success of Navan’s partnership with the wider Viessmann Generations Group, ISOPLUS has chosen to consolidate its travel and expense operations with Navan – moving away from significant unmanaged travel and expense. “Navan automates that tedious work and gives us the real-ti

Infobip and Digitas Middle East Sign Expansion of Their Strategic Partnership to Power AI-Driven Customer Engagement for Global Brands23.6.2026 10:00:00 CEST | Press release

The global AI-first cloud communications platform Infobip, today announced a partnership with Digitas, the Marketing Transformation arm of the Publicis Groupe, the world's foremost communications agency holding group. Under the partnership, Infobip and Digitas ME will build a joint service practice around the Infobip AgentOS platform, bringing together Infobip's enterprise communications infrastructure and Publicis Groupe’s deep capabilities in data, AI, customer experience strategy, and media transformation. The partnership is supported by a global framework agreement with the roll out starting across MENA and APAC initially. The collaboration addresses a growing need: bringing together marketing transformation, AI-driven personalisation, and real-time business messaging into a single, coherent customer experience. Where Publicis Groupe shapes how global brands engage their customers, across media, data, loyalty, and commerce, Infobip provides the communication infrastructure to make

Hytera Launches W60 Wearable MCS Radio to Extend Mission-Critical Communication Beyond PMR Coverage23.6.2026 09:58:00 CEST | Press release

Hytera, a leading global provider of critical communications technologies and solutions, launched the W60 Wearable MCS Radio at Critical Communications World (CCW) 2026. Designed to complement existing PMR systems, the lightweight wearable device helps organizations maintain mission-critical communications beyond the coverage limits of traditional radio networks, supporting safer and more connected operations across public safety, transportation, energy, and industrial sectors. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260622677096/en/ W60 Wearable MCS Radio for connected operations beyond PMR coverage Extending Communication Beyond PMR Coverage Maintaining reliable communications in basements, tunnels, underground facilities, and other hard-to-cover environments remains a challenge for many organizations. Expanding PMR infrastructure in these locations often requires significant investment and deployment time. The W60

Samsung Unveils Industry's Fastest UFS 5.0 Solution for Next-Gen On-Device AI Applications23.6.2026 09:10:00 CEST | Press release

Samsung’s UFS 5.0 solution achieves industry's highest data transfer speed of 10.8GB/s, enabling faster storage and processing in mobile memoryEnhanced power efficiency and smaller package to provide optimal mobile AI experiences Samsung Electronics Co., Ltd., the world leader in advanced memory technology today announced that, for the first time in the industry, it has developed the industry's fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamless and highly efficient AI services on future mobile devices. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260623632789/en/ Samsung Unveils Industry's Fastest UFS 5.0 Solution for Next-Gen On-Device AI Applications The milestone sets a new benchmark for the next-generation mobile memory market as the enhanced performance is expected to allow mobile device users with significantly reduced latency and faster response times when running large language mode

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye