MITSUI-MINING-&-SMELTING
For the commercialization of HRDP®1 , a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210124005060/en/
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP® , a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2 .
HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3 , the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less4 . Currently, over 20 customers are evaluating HRDP® for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5 , and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms
1
Abbreviation of High Resolution De-bondable Panel
2
Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3
Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4
L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.
5
Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6
High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference
"Development of HRDP®
Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package" (Release as of January 25, 2018)
https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP®
https://www.youtube.com/watch?v=vHhng-NV9QA
View source version on businesswire.com: https://www.businesswire.com/news/home/20210124005060/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
KAYTUS Introduces One-Stop End-to-End Liquid-Cooled Datacenter Solution Targeting AI Market13.1.2026 09:02:00 CET | Press release
- Enhances competitiveness with 30% reduction in cooling energy consumption - Supports high-density, high-efficiency, and eco-friendly data center construction through 4D differentiation strategy KAYTUS, a leading provider of end-to-end AI and liquid cooling solutions, has introduced its One-Stop End-to-End Liquid-Cooled Data Center Solution in response to the surging demand for AI adoption and energy efficiency. The solution is designed with the concepts of modularization, prefabrication, and safety, supporting up to 15 kW per node and 130 kW per cabinet, with a PUE below 1.1. It provides an end-to-end liquid cooling solution covering design, development, deployment, and operation, addressing the complexity and high entry barriers of large-scale liquid-cooled deployment while supporting eco-friendly data center operations aligned with the government’s carbon neutrality initiatives. Rapid Growth of Domestic AI Market Highlights Urgent Need for Energy Efficiency The AI industry is rapid
The Blind Sailor Takes the Stage at WEF: "HIRO’s CHOICE" Project to Set Sail13.1.2026 05:00:00 CET | Press release
A Solo, Non-Stop Crossing of the Pacific Ocean “Blind Sailor Single-Handed Pacific Crossing Project 2027” is a world-first initiative in which Mitsuhiro Iwamoto, a completely blind Japanese yachtsman (blind sailor) based in San Diego, will attempt a solo, non-stop trans-Pacific crossing in the spring of 2027. Sailing a 28-foot yacht single-handedly, he aims to cross the Pacific Ocean from San Diego on the U.S. West Coast to Amakusa, Kumamoto Prefecture, Japan, without making port. Iwamoto will speak about this project at the World Economic Forum Annual Meeting 2026, to be held in January 2026. Project URL: https://hiros-choice.com/ This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260108087321/en/ Hiro Iwamoto / Global Keynote Speaker, First Totally Blind Sailor to Cross the Pacific The message he most wishes to convey at the WEF is the power of choice. He lost his sight at the age of sixteen—a moment when he nearly gave up on
MarkLines Gen-AI Beta Version Released for Automotive Industry13.1.2026 01:00:00 CET | Press release
MarkLines Co., Ltd. (Headquarters: Minato-ku, Tokyo; President & CEO: Makoto Sakai; TYO:3901) announced its launch of the "MarkLines Gen-AI Beta Version," the new feature for B2B users in the automotive industry. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260112383839/en/ "MarkLines Gen-AI Beta Version" can take questions in natural language and instantly give highly reliable, relevant data drawn from MarkLines’ extensive automotive database (Image: MarkLines Co., Ltd.) This AI-powered feature enables users to ask questions in natural language and instantly receive highly reliable, relevant data drawn from MarkLines’ extensive automotive database. Moreover, the system analyzes this information by leveraging the rich content across its platform and delivers clear, concise, text-based insights. By combining trusted data with advanced analytical capabilities through generative AI, this service represents a first-of-its-kind
Australian Defence Force Secures Satellite Communications on SES IS-2212.1.2026 22:30:00 CET | Press release
New agreement for uninterrupted UHF connectivity for Australian Defence Force through 2033, With Options Extending to 2041 Satellite communications solutions provider SES will provide secure uninterrupted satellite communications to the Australian Defence Force (ADF) for a minimum of 16 years thanks to a new extended agreement. The service will be provided via the SES Intelsat 22 satellite and an ultra-high frequency (UHF) military communications payload. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260112137182/en/ Assistant Secretary Space Systems Branch, Michael Hunt, formalizes contract negotiations for the through-life support of the IS-22 satellite with Rory Welch, senior vice-president of service delivery at SES Space and Defense. Photos: Corporal Annika Smit Under the renewed arrangement, SES will reposition the IS-22 satellite to a new orbital slot specified by the ADF, continuing a mission that has been the corne
NetApp Appoints Paul Fipps to the Board of Directors12.1.2026 22:05:00 CET | Press release
NetApp® (NASDAQ: NTAP), the intelligent data infrastructure company, today announced that Paul Fipps, President of Global Customer Operations at ServiceNow, has joined its Board of Directors. The board now has ten directors, nine of whom are independent, and 50% of whom have been appointed within the last five years. Fipps brings more than 20 years of experience driving technology-enabled growth and customer transformation. At ServiceNow, he currently leads global sales, customer success, partner ecosystems, and field operations. He previously served as EVP of Worldwide Sales at ServiceNow and as President of Under Armour Connected Fitness and Chief Experience Officer at Under Armour, overseeing global direct-to-consumer, connected fitness, and digital experiences. He also previously served on the advisory board of Quantum Metric. Fipps holds a B.S. in Information Systems, an MBA from the University of Baltimore, and is a graduate of The Wharton School’s Advanced Management Program. “P
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom