MITSUI-MINING-&-SMELTING
25.1.2021 07:02:07 CET | Business Wire | Press release
For the commercialization of HRDP®1 , a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210124005060/en/
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP® , a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2 .
HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3 , the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less4 . Currently, over 20 customers are evaluating HRDP® for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5 , and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms
1
Abbreviation of High Resolution De-bondable Panel
2
Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3
Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4
L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.
5
Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6
High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference
"Development of HRDP®
Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package" (Release as of January 25, 2018)
https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP®
https://www.youtube.com/watch?v=vHhng-NV9QA
View source version on businesswire.com: https://www.businesswire.com/news/home/20210124005060/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
C.H. Robinson Launches World's First AI Technology That Continually Assesses, Improves and Operates Global Supply Chains3.6.2026 18:00:00 CEST | Press release
The newest innovation for Managed Solutions, the Lean AI Engineer, is the brain of the system As the global leader in Lean AI supply chains, C.H. Robinson has built the first AI technology designed to both operate a shipper’s global supply chain and also continuously assess and improve its performance. Now serving the company’s 4PL Managed Solutions customers, a new Lean AI Engineer works in concert with the Lean AI Planner introduced last year to create one connected system that uniquely enhances a supply chain as it runs. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260520874794/en/ The Lean AI Engineer can assess an entire supply chain in 25 to 30 minutes and determine improvements before performance is impacted – compared to supply chain assessments that typically take up to four weeks and look backward at what has happened instead of what should happen. While the Lean AI Engineer delivers intel, the Lean AI Planner ma
Leading Global Brain Science Conference OHBM 2028 to Be Held in Yokohama3.6.2026 17:00:00 CEST | Press release
Yokohama has won the bid to host the 2028 Annual Meeting of the Organization for Human Brain Mapping (OHBM 2028), one of the world’s premier international conferences in brain science, further elevating the city’s presence as a global hub for international conventions and academic exchange. The meeting will take place at PACIFICO Yokohama from June 18–22 and will mark only the second time the meeting has been held in Japan. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260603787692/en/ YOKOHAMA JAPAN'S FIRST PORT OF CALL OHBM is a leading international academic society in the fields of brain imaging, neuroscience, and neurological-disease research. Its annual meeting attracts around 3,000 researchers, healthcare professionals, and industry representatives from around the world. OHBM 2028 will be organized in collaboration with the Japan Human Brain Mapping Society (JHBM, President: Yoshikazu Ugawa and Tetsuya Matsuda). The
Almarai Launches the 2026 Cycle of the World’s Largest Award for Food Security Research in Dryland Regions3.6.2026 16:31:00 CEST | Press release
The Almarai Prize - the international track of the Almarai Prize for Scientific Creativity - invites leading global research institutions and PhD‑holding scientists to nominate standout research that advances food security in dryland regions. Self‑nominations are not allowed; only PhD‑level nominators may submit, and institutions may nominate up to three projects. The prize totals USD 500,000 (SAR 1,875,000), awarded to one winning research project or institution. The 2026 cycle of the Almarai Prize, international track of the Almarai Prize for Scientific Creativity, has officially opened, calling on leading research institutions, distinguished scientists, and global experts to nominate pioneering research that advances food security in the world’s driest regions. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260603753914/en/ Almarai Launches the 2026 Cycle of the World’s Largest Award for Food Security Research in Dryland
Stabilizing Grids and Cutting Costs in Half: Europe Is Banking on Grid-Relevant Storage Systems3.6.2026 15:50:00 CEST | Press release
The European battery market is scaling up at record speed: According to the latest Solar+ Report from SolarPower Europe, at the end of 2025, the installed storage fleet in the EU had reached a total capacity of 40 gigawatts (GW) and a storage capacity of 77 gigawatt hours (GWh). This is an increase of over 45 percent compared to the previous year. By 2030, the study’s Solar+ scenario forecasts that capacity will quadruple to 171 GW, while storage capacity will increase eightfold to 598 GWh. As growing solar and wind capacities place increasing demands on European grids, storage systems will need to shift electricity over many hours. As a result, the average storage duration will go up from 1.9 to 3.5 hours. This represents a technological leap that underscores the need to establish more grid-relevant storage systems. Taking place in Munich from June 23–25, ees Europe will showcase how the industry is meeting this enormous demand. As Europe’s largest exhibition for batteries and energy
2026 World Cup Triggers Corporate Travel Boom in Canada and U.S.3.6.2026 15:00:00 CEST | Press release
Navan data reveals Canadian business bookings have tripled, while U.S. hotel prices spike 30% as global enterprises lock in client entertainment Navan (NASDAQ: NAVN), the global AI-powered business travel and expense management platform, today released year-over-year data revealing global enterprises are leaning in heavily to the upcoming 2026 World Cup, with hotel and flight bookings for business travel to World Cup host cities up 46% to the U.S. and a massive 295% to Canada. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602020779/en/ Navan data reveals Canadian business bookings have tripled, while U.S. hotel prices spike 30% as global enterprises lock in client entertainment “While headlines right now are focusing on softer-than-expected tourism demand and lagging leisure hotel bookings, our corporate data tells a different story,” said Dane Molter, SVP, Navan Group Travel Marketplace. “Companies are embracing the Wor
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom