MITSUI-MINING-&-SMELTING
25.1.2021 07:02:07 CET | Business Wire | Press release
For the commercialization of HRDP®1 , a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210124005060/en/
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP® , a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2 .
HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3 , the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less4 . Currently, over 20 customers are evaluating HRDP® for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5 , and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms
1
Abbreviation of High Resolution De-bondable Panel
2
Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3
Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4
L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.
5
Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6
High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference
"Development of HRDP®
Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package" (Release as of January 25, 2018)
https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP®
https://www.youtube.com/watch?v=vHhng-NV9QA
View source version on businesswire.com: https://www.businesswire.com/news/home/20210124005060/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Sinopec Receives CSR Award at Sino-European ESG Conference in Germany1.7.2026 15:38:00 CEST | Press release
China Petroleum & Chemical Corp. (Sinopec) has received the Corporate Social Responsibility Best Practice Award at the 3rd Sino-European Corporate ESG Best Practice Conference in Mainz, Germany, for its case study on carbon footprint management and low-carbon development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260701696760/en/ Huang Yiyang (L), Chinese Consul General in Frankfurt, presents the award to a representative of Sinopec. The conference jury said Sinopec has developed a carbon management framework centered on product carbon footprint management, covering the full product life cycle while aligning with both Chinese and European standards. It cited the company’s work with German chemical producer BASF to achieve mutual recognition of carbon footprint accounting methodologies as a milestone that could support greener cooperation across international industrial supply chains. According to the jury, Sinopec’s eff
Vercel and Mercedes-AMG PETRONAS Formula One Team Announce Multi-Year Strategic Partnership1.7.2026 15:30:00 CEST | Press release
The agentic infrastructure platform known for speed is joining forces with one of the world's fastest Formula One teams Today Vercel, the agentic infrastructure company, announced a new multi-year deal with the Mercedes-AMG PETRONAS Formula One Team. Starting with the British Grand Prix July 2 – 5 2026, Vercel branding will appear on the Mercedes-AMG PETRONAS Formula One Team race cars as the partnership begins its first chapter, before expanding significantly across the team ecosystem from 2027 onward. The partnership includes global branding rights, premium hospitality experiences, customer engagement, content creation, and technical collaborations, including plans to evolve the team’s digital platforms to Vercel. “Formula One is where every millisecond matters, every decision counts, and continuous innovation is fundamental to success. Vercel shares that same philosophy,” said Richard Sanders, Chief Commercial Officer, Mercedes-AMG PETRONAS Formula One Team. “The Vercel platform is
OXMIQ Raises $35 Million to Scale OxCore™ Architecture1.7.2026 15:15:00 CEST | Press release
OXMIQ Labs Inc., a unified GPU and AI architecture company founded by Raja Koduri, today closed its $35 million Series A financing, bringing the company’s total capital raised to $60 million. The funding will scale OxCore™, OXMIQ’s licensable GPU architecture that allows semiconductor companies and AI system builders to build custom AI silicon without a full chip program. The round was co-led by Fundomo and Samsung Catalyst Fund, with participation from MediaTek, AM Intelligence Labs, Pegatron Venture Capital, CDIB-TEN, Darwin Ventures, and Morgan Creek Digital, among other financial and strategic investors. OXMIQ’s expertise spans the full AI stack, from renewable power and data center infrastructure to silicon IP, electron-to-token machines (ETMs™), along with the software that runs AI factories and agents. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260701241910/en/ OXMIQ Funding raised to date of $60M after current $3
SamanTree Medical’s Histolog® Scanner Technology Featured in 13 Publications in Special BJU International Issue on Confocal Microscopy in Urology1.7.2026 15:01:00 CEST | Press release
Papers highlight clinical research on use of confocal microscopy for real-time tissue assessment in various urologic procedures SamanTree Medical, a global leader in surgical imaging innovation, today announced that Histolog Scanner confocal microscopy technology has been featured in 13 peer-reviewed clinical papers in a special issue of BJU International, one of the world’s leading journals in urology. The special edition focuses on a growing body of evidence of the role of confocal microscopy in urologic surgery. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260701425845/en/ SamanTree Medical announces that Histolog® Scanner confocal microscopy technology is featured in 13 peer-reviewed clinical papers in a special issue of BJU International. “The special issue represents increasing momentum behind confocal microscopy in urologic surgery,” said Professor Greg Shaw, consultant urologic surgeon at University College London
Regnology to Acquire Fed Reporter, Accelerating U.S. Leadership and Advancing Regulatory Modernization1.7.2026 15:00:00 CEST | Press release
Deal establishes Regnology as a central partner in U.S. regulatory modernization, extending reach to over 4,000 financial institutions Regnology, a leading provider at the intersection of regulatory, risk, and supervisory technology, today announced it has entered into a definitive agreement to acquire Fed Reporter, the market-leading U.S. provider of regulatory reporting solutions for financial institutions of all sizes, including banks, credit unions, and bank holding companies. The acquisition marks a pivotal milestone in Regnology’s U.S. expansion, creating the most comprehensive regulatory reporting coverage across the American financial landscape and extending its reach to more than 4,000 institutions from global banks to community lenders. By combining a proven, cloud-first, agentic-first technology foundation with deeply embedded local expertise, Regnology is uniquely positioned to support more efficient, transparent, and data-driven reporting, while strengthening alignment bet
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom