MA-EXAGRID
16.5.2019 16:02:06 CEST | Business Wire | Press release
ExaGrid ®, a leading provider of intelligent hyperconverged storage for backup, today announced that it has been nominated in six categories for Storage Magazine’s annual awards ceremony The Storries XVI . ExaGrid has become a finalist for Enterprise Backup Hardware Product of the Year, Storage Innovators of the Year, Hyper-convergence Vendor of the Year, Storage Performance Optimisation Product of the Year, Storage Product of the Year and Storage Company of the Year. Voting to determine the winner in each category is underway now and closes on June 3. The results will be revealed at the evening awards ceremony in London on June 13.
ExaGrid’s EX Series backup storage appliance with data deduplication is nominated in three categories. One of ExaGrid’s key architectural differentiators is its unique Landing Zone that stores the most recent backups in their full undeduplicated form for restore, recovery, and VM boot performance. Each appliance provides Landing Zone storage, deduplicated repository storage, processor, memory, and network ports. As data volumes double, triple, etc., ExaGrid doubles, triples, etc. all required resources to maintain a fixed-length backup window. If the backup window is six hours at 100TB, it is still six hours at 300TB, 500TB, 800TB, etc. Expensive forklift upgrades are avoided, and the aggravation of chasing a growing backup window is eliminated.
“We believe these nominations reflects ExaGrid’s position as the only backup storage vendor that has architected a solution with data deduplication that takes into consideration the price, performance and scalability issues of today,” said Bill Andrews, CEO and President of ExaGrid. “ExaGrid’s innovative approach to data deduplication not only minimizes the amount of data stored, but its unique architecture offers a landing zone for fast backups and restores. ExaGrid’s scale-out architecture keeps the backup window fixed-length as data grows and eliminates expensive, disruptive forklift upgrades and forced product obsolescence.”
ExaGrid also uses Adaptive Deduplication to deduplicate and replicate data to the disaster recovery (DR) site during the backup window, in parallel with backups, instead of the traditional inline approach, between the backup application and the disk. This unique combination of a landing zone with adaptive deduplication provides for the fastest backup performance, resulting in the shortest backup window as well as a strong disaster recovery point (RPO). Finally, ExaGrid provides an assigned level 2 support technician knowledgeable in specific backup applications and an evergreen model of supporting all appliances at standard maintenance and support rates.
About ExaGrid
ExaGrid provides intelligent hyperconverged storage for backup with data deduplication, a unique landing zone, and scale-out architecture. ExaGrid’s landing zone provides for the fastest backups, restores, and instant VM recoveries. Its scale-out architecture includes full appliances in a scale-out system and ensures a fixed-length backup window as data grows, eliminating expensive forklift upgrades. Visit us at exagrid.com or connect with us on LinkedIn . See what our customers have to say about their own ExaGrid experiences and why they now spend significantly less time on backup in our customer success stories .
ExaGrid is a registered trademark of ExaGrid Systems, Inc. All other trademarks are the property of their respective holders.
View source version on businesswire.com: https://www.businesswire.com/news/home/20190516005674/en/
Contact:
Stacey Foster ExaGrid sfoster@exagrid.com 508-898-2872 x0248
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom