LEMAN-MICRO-DEVICES
6.1.2022 20:18:09 CET | Business Wire | Press release
Leman Micro Devices’ e-Checkup system has successfully completed a world-first clinical trial and proven it is the only completely cuffless and calibration-free sensor and app capable of measuring blood pressure with the accuracy demanded for medical use.
Hypertension (high blood pressure) kills over 10 million people per year. Many people do not know they have it because diagnosis and monitoring require an expensive and cumbersome automatic cuff or repeated checks by a doctor. e-Checkup and its small V-Sensor, which costs only a few dollars, have been developed and industrialised by LMD to be built into a mobile phone or into a wearable or a pocket monitor connected to a phone by Bluetooth and the app on the phone analyses the measurements from the sensor to deliver a clinically-accurate personal blood pressure measurement in under 60 seconds.
The clinical trial was conducted by SVS Medical College in Mahabubnagar, India, a country with a high incidence of hypertension and a large rural population with limited access to a doctor. The trial adhered to the internationally recognised ISO 81060-2 standard that sets the requirements for automatic blood pressure monitors used by hospitals, doctors and consumers. It found that e-Checkup fully complied with all the criteria of the standard.
Dr K. Saumya, Principal Investigator for the trial, said “This device will be a real life-saver in India. It is small and affordable and will alert people to the need to consult a doctor about their blood pressure before they have symptoms and before it gives rise to awful consequences such as stroke, kidney damage, heart attack or blindness”.
Mark-Eric Jones, CEO of LMD added: “We would like to thank SVS for its careful and professional conduct of this trial which will underpin our work to bring this accessible and affordable medical device to global markets. This landmark trial proves that our patented, unique technology makes accurate, life-saving measurements. No other portable device in the world can measure blood pressure without a cuff, either to make the measurement or to calibrate the device frequently.”
View source version on businesswire.com: https://www.businesswire.com/news/home/20220106005802/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Medscape Brings AI to the Hematology Frontline at EHA 20262.6.2026 08:00:00 CEST | Press release
Landmark symposium to equip clinicians with practical, ethical AI frameworks, chaired by a lead author of Europe's ESMO EBAI and ELCAP oncology guidelines. Medscape Education will launch Future-Ready Hematologists: Practical and Ethical Use of AI in Hematology and Oncology at EHA 2026 on June 11, where leading experts will convene to explore responsible AI in one of medicine's most complex, rapidly evolving specialties. Registration is free for all EHA delegates. Reserve your seat here. The session is chaired by Prof. Jakob N. Kather, MD, MSc, Else Kroener Fresenius Center for Digital Health, Technical University Dresden, and NCT, University Hospital Heidelberg. He is joined by Prof. Chan Cheah, MBBS, DMSc, Consultant Hematologist, Sir Charles Gairdner Hospital, Perth, Australia; and Prof. Matthew Lunning, DO, FACP, Chief of Hematology and Assistant Vice Chancellor of Research, University of Nebraska Medical Center. Hematology moves faster than any clinician can track alone. AI can clo
Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release
Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th
Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release
Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv
Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release
Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te
Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release
Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom