Business Wire

LDRA

11.5.2021 14:02:16 CEST | Business Wire | Press release

Share
Embedded Safety & Security Summit (ESSS) 2021 Announces Speaker Line-up for Virtual Conference

The Embedded Safety & Security Summit (ESSS) today announced its first set of speakers for the inaugural virtual event, scheduled for June 17, 2021. Based on LDRA’s long-running annual conference, ESSS brings together embedded technology enthusiasts, industry thought leaders and regulators worldwide to share emerging trends, best practices, technical deep dive, and practical examples on empowering the development of safe and secure embedded systems.

In addition to Ian Hennell, Operations Director of LDRA, confirmed speakers and their presentations include:

Technical Panel : Next-gen Technologies: Safety and Security Implications

Dr Nigel Tracey, Vice President – RTA Solutions, ETAS, Germany
Suresh Kumar R, CTO CCS India & Digital Incubators, GE-Healthcare, India
Bill. St. Clair, Director – US Operations, LDRA, USA
Shinto Joseph, Director – South East Asia Operations, LDRA, India

Industrial Cybersecurity System (ICS) defenses what is next?

Felipe Sabino Costa, LATAM Industrial Cybersecurity (IACS) Expert, Brazil

MISRA C in the ISO 26262 Context

Andrew Banks, Chairman of the MISRA C Working Group, Technical Specialist, LDRA, UK

UNECE WP.29 Regulations for Automotive Security – A View from India

Khushwant Pawar, Head, Cybersecurity Solutions – Mobility, ETAS, India

Balancing the Load of a Safety Critical Multi Core System

Mohamed Zuhair, Electronics Engineer, TASKING, India

Challenges in Testing & Certification of AI-ML based systems in Aerospace

Shashi Kumar P, Principal Engineer – Certification, Honeywell Aerospace, India
Koilpillai George, Chief Engineers – Software, Honeywell Aerospace, India

Do All Your Build Tools Need To Be Qualified?

Chris Tapp, Chairman of the MISRA C++ Working Group, Technical Specialist, LDRA, UK

Hardware Enablers for Security in Industrial IoT

Mini TT, Principal Engineer, ABB, India

FACE Standard Verification and Validation for Safety Environments

Ehsan Salehi, Field Application Manager & FACE™ VA, LDRA, USA

System Safety Enhancement using Fault Tolerant Design

Manju Maheve, System Safety Engineer, Collins Aerospace, India
Priya Peter, System Safety and Reliability Engineer, Collins Aerospace, India

Verification Activities to be Considered for Achieving IEC 62304 Compliance

Anil Kumar N.G, Sr. Technical Manager, LDRA, India

“The deep-dive technical sessions from industry experts across the aerospace & defence, automotive, industrial, and medical domain offer an ideal mix of insights into the growing significance of implementing safe and secure practices and technologies in embedded systems,” Hennell said. “While we’ll miss being in-person this year, we expect even more within the embedded community will benefit from these valuable virtual sessions and the networking opportunities that everyone has grown to expect at ESSS.”

The virtual conference platform will offer industry-focused tracks and allow myriad networking opportunities for attendees and speakers with chat room features and live Q&As. For more information and to register for free, please visit https://www.embedded-safety-security.com/ .

Link:

ClickThru

Social Media:

https://www.facebook.com/ldratechnology

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release

Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv

Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release

Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te

Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release

Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i

SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days2.6.2026 00:35:00 CEST | Press release

CINDE Assortment and Space closes the loop between assortment, planogram, and in-store execution, proven across 500-plus global CPG deployments Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram execution, and in-store compliance, compressing the category review cycle from four to six weeks to a matter of days. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602137061/en/ The platform is underpinned by SymphonyAI's Transferable Demand AI, a model trained across 25 years of retail data a

SymphonyAI Launches CINDE Retail Media Intelligence to Connect Merchandising and Media for Mid-to-Large Grocers2.6.2026 00:05:00 CEST | Press release

CINDE RMI connects merchandising and retail media in a single closed-loop platform — without replacing your existing retail media stack Retail media has become the fastest-growing profit line in grocery, yet the billions of dollars CPG advertisers invest in it every year flow through a system where media buyers and merchants never see the same data. Merchants plan assortments, negotiate trade spend, and execute resets with no visibility into which CPG media investments are driving category velocity, while CPG advertisers renew or walk based on incrementality proof that most retailers cannot provide. To solve for this, SymphonyAI, a global leader in Vertical AI, today announced the general availability of CINDE Retail Media Intelligence (RMI), an AI platform that connects merchandising, media, and shopper intelligence into a single closed-loop system, giving retailers and CPG partners shared visibility into how every media dollar moves category turns, trade spend ROI, and gross margin a

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye