Business Wire

LDRA

11.5.2021 14:02:16 CEST | Business Wire | Press release

Share
Embedded Safety & Security Summit (ESSS) 2021 Announces Speaker Line-up for Virtual Conference

The Embedded Safety & Security Summit (ESSS) today announced its first set of speakers for the inaugural virtual event, scheduled for June 17, 2021. Based on LDRA’s long-running annual conference, ESSS brings together embedded technology enthusiasts, industry thought leaders and regulators worldwide to share emerging trends, best practices, technical deep dive, and practical examples on empowering the development of safe and secure embedded systems.

In addition to Ian Hennell, Operations Director of LDRA, confirmed speakers and their presentations include:

Technical Panel : Next-gen Technologies: Safety and Security Implications

Dr Nigel Tracey, Vice President – RTA Solutions, ETAS, Germany
Suresh Kumar R, CTO CCS India & Digital Incubators, GE-Healthcare, India
Bill. St. Clair, Director – US Operations, LDRA, USA
Shinto Joseph, Director – South East Asia Operations, LDRA, India

Industrial Cybersecurity System (ICS) defenses what is next?

Felipe Sabino Costa, LATAM Industrial Cybersecurity (IACS) Expert, Brazil

MISRA C in the ISO 26262 Context

Andrew Banks, Chairman of the MISRA C Working Group, Technical Specialist, LDRA, UK

UNECE WP.29 Regulations for Automotive Security – A View from India

Khushwant Pawar, Head, Cybersecurity Solutions – Mobility, ETAS, India

Balancing the Load of a Safety Critical Multi Core System

Mohamed Zuhair, Electronics Engineer, TASKING, India

Challenges in Testing & Certification of AI-ML based systems in Aerospace

Shashi Kumar P, Principal Engineer – Certification, Honeywell Aerospace, India
Koilpillai George, Chief Engineers – Software, Honeywell Aerospace, India

Do All Your Build Tools Need To Be Qualified?

Chris Tapp, Chairman of the MISRA C++ Working Group, Technical Specialist, LDRA, UK

Hardware Enablers for Security in Industrial IoT

Mini TT, Principal Engineer, ABB, India

FACE Standard Verification and Validation for Safety Environments

Ehsan Salehi, Field Application Manager & FACE™ VA, LDRA, USA

System Safety Enhancement using Fault Tolerant Design

Manju Maheve, System Safety Engineer, Collins Aerospace, India
Priya Peter, System Safety and Reliability Engineer, Collins Aerospace, India

Verification Activities to be Considered for Achieving IEC 62304 Compliance

Anil Kumar N.G, Sr. Technical Manager, LDRA, India

“The deep-dive technical sessions from industry experts across the aerospace & defence, automotive, industrial, and medical domain offer an ideal mix of insights into the growing significance of implementing safe and secure practices and technologies in embedded systems,” Hennell said. “While we’ll miss being in-person this year, we expect even more within the embedded community will benefit from these valuable virtual sessions and the networking opportunities that everyone has grown to expect at ESSS.”

The virtual conference platform will offer industry-focused tracks and allow myriad networking opportunities for attendees and speakers with chat room features and live Q&As. For more information and to register for free, please visit https://www.embedded-safety-security.com/ .

Link:

ClickThru

Social Media:

https://www.facebook.com/ldratechnology

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

HAZAMA ANDO Becomes an Official Partner in Helical Fusion’s Commercial Fusion Initiative and Signs MoU Toward Construction of the Fusion Pilot Plant6.7.2026 08:40:00 CEST | Press release

A long-established Japanese general contractor will contribute construction expertise to advance Fusion Pilot Plant development toward commercially viable fusion power. Helical Fusion Co., Ltd. (“Helical Fusion”), a Japan-based fusion energy startup developing fusion power plants, and HAZAMA ANDO CORPORATION (“HAZAMA ANDO”), a long-established Japanese general contractor, today announced that HAZAMA ANDO has become an Official Partner in the Helix Program, Helical Fusion’s commercial fusion initiative. The two companies have also signed a memorandum of understanding (“MoU”) to collaborate toward the construction of Helix KANATA, Helical Fusion’s Fusion Pilot Plant targeted for the 2030s. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260706176052/en/ (L-R) Kazuhiko Kuniya (Representative Director and President, HAZAMA ANDO CORPORATION) and Takaya Taguchi (Co-Founder and CEO, Helical Fusion Co., Ltd.) at a press conference in

Sofinnova Partners Announces Myricx Bio Agrees to Be Acquired by Novartis6.7.2026 07:15:00 CEST | Press release

Sofinnova Partners co-led the seed investment in 2019 and has supported the company from founding through to exitThe proposed acquisition combines the oncology expertise of Novartis with Myricx Bio’s novel ADC assets and platform having broad potential across multiple solid tumor typesMyricx Bio's first-in-class NMTi payload platform is designed to improve the therapeutic index of ADCs, offering the potential for more effective and better-tolerated treatment options for cancer patientsThe transaction valued at up to $1.5 billion including $1.1 billion cash upfront Sofinnova Partners, a leading European life sciences venture capital firm, today announced that its portfolio company Myricx Bio (“Myricx”) has reached agreement to be acquired by Novartis, for up to $1.5 billion including $1.1 billion cash upfront plus potential milestone payments. This marks Sofinnova Partners' seventh exit in three years. Myricx Bio is a UK-headquartered transatlantic biotech company focused on the discove

Global New Material International Wins Technology Innovation Best Practice Award at Sino-European ESG Conference6.7.2026 05:59:00 CEST | Press release

Global New Material International Holdings Ltd. has received the Technology Innovation Best Practice Award at the Third Sino-European Corporate ESG Best Practice Conference recently in Mainz, Germany, in recognition of its efforts to advance sustainable development through material innovation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260705533555/en/ Thorsten Giehler (L), Director of the Economic, Social Development and Employment Division of The German Society for International Cooperation (GIZ), delivered the award to Zhou Fangchao, Executive Director and Vice President of Global New Material International. The annual conference, initiated by the Chinese Consulate General in Frankfurt and jointly organized with Chinese and European partners, recognizes corporate best practices in environmental, social and governance (ESG) performance. This year's event brought together government officials, business leaders and exper

Access Advance Welcomes Samsung and Sharp to the VVC Advance Patent Pool6.7.2026 02:00:00 CEST | Press release

Access Advance LLC today announced significant additions to the VVC Advance Patent Pool, including Samsung Electronics and Sharp Corporation joining as both Licensors and Licensees. The additions strengthen Access Advance's position in VVC licensing, bringing two of the world's largest video codec patent holders into the program on both sides of the license. "The growth we are seeing in VVC Advance reflects the broad range of industries and companies that are moving toward VVC as the next standard for video delivery," said Peter Moller, CEO of Access Advance. "Samsung and Sharp joining as both Licensors and Licensees is significant, but so is the participation of leading smartphone brands and the range of consumer electronics and technology companies now executing licenses. We are building a program that reflects where the video market is actually heading." The following companies have joined the VVC Advance Patent Pool as Licensees since the beginning of 2026: American Future Technolo

Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products atKitakami Plant Fab23.7.2026 12:19:00 CEST | Press release

Companies Showcase Ongoing Buildout of Manufacturing Infrastructure at K2 to Address Growing Demand for NAND Flash Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye