IL-SELIG-GROUP
1.12.2021 14:47:12 CET | Business Wire | Press release
Selig Group (“Selig”), owned by CC Industries (“CCI”), announced today that it has acquired Manufacture Générale de Joints (“MGJ”). Founded in 1947 and headquartered near Lyon, France, MGJ is a leading supplier of foam-based liners worldwide. Through decades of investment, MGJ has developed differentiated foam-based products for an expansive range of applications. The combination provides Selig with highly complementary adjacent capabilities to serve its customers more broadly on a global basis and will accelerate the combined development of environmentally sustainable products. This is Selig’s second acquisition in the last year and reflects its strategy to augment growth and expand its business model via complementary solutions.
“MGJ is an excellent company and shares Selig’s passion for developing technically-differentiated solutions to customers' problems,” said Bill Crown, President and Chief Executive Officer of CCI. “We look forward to supporting Selig’s continued growth globally and welcome MGJ’s team into the Selig family.”
Steve Cassidy, President and Chief Executive Officer of Selig added, “MGJ’s team, products, markets and capabilities are extremely complementary to Selig and represent a significant growth opportunity for the combined organization. Our cultures are well-aligned and focused on developing unique and valuable solutions for customers' packaging issues.”
Stéphane Triquet, of MGJ, will become a Vice President within Selig’s European business unit. Mr. Triquet stated, “Selig is an ideal long-term home for MGJ’s employees and owner to support our operation in its next phase of growth. This is a highly strategic combination, enabling us to provide a more comprehensive solutions offering for customers globally. We will continue to focus on the innovative, high-quality products and the exemplary service our customers rely upon.”
As part of the acquisition, MGJ will adopt the Selig Group name to reflect one team and a focus on growing the combined business. The business will continue to operate from its primary facility in France.
About Selig Group (www.seligsealing.com )
Selig Group is a leading global provider of innovative packaging solutions. The company is the leading global supplier of innovative, technically differentiated container sealing and venting solutions for food, beverage, pharmaceutical, healthcare, personal care and industrial applications. Selig also manufactures a range of technical laminates and flexible packaging products in Europe for these applications. The company’s products are designed to serve customers’ needs for ensuring freshness, providing packaging integrity, extending shelf life, providing tamper evidence, expanding in e-commerce and protecting brand identity. Selig is headquartered in Naperville, Illinois, USA with manufacturing and distribution locations worldwide.
About MGJ (www.mgj.com )
MGJ is the technology leader in foam-based container sealing solutions worldwide. The company provides an expansive product range of closure liners for wine, spirits, pharmaceutical, personal care, food, household and industrial markets. Over its history, MGJ has grown by developing innovative product constructions and providing reliable and consistent quality and service to customers. The company serves a global customer base from operations in France, Canada and China.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211201005050/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release
Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th
Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release
Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv
Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release
Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te
Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release
Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i
SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days2.6.2026 00:35:00 CEST | Press release
CINDE Assortment and Space closes the loop between assortment, planogram, and in-store execution, proven across 500-plus global CPG deployments Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram execution, and in-store compliance, compressing the category review cycle from four to six weeks to a matter of days. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602137061/en/ The platform is underpinned by SymphonyAI's Transferable Demand AI, a model trained across 25 years of retail data a
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
