IDEMIA
5.10.2020 11:05:07 CEST | Business Wire | Press release
In the context of a rapid transformation of the banking industry, IDEMIA, the global leader in Augmented Identity, supports FinTechs and neobanks with the launch of the Global Fintech Accelerator Card Program. This new program allows a rapid process from cardholder onboarding - to card issuance.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20201005005366/en/
IDEMIA’s leadership in card manufacturing, as the number 1 global FinTech card issuance partner, is based on a solid experience of a global dedicated FinTech team and a network of 30 Service Centers in 26 countries around the world. FinTechs can leverage the capability and know-how of IDEMIA to enable card issuance into the marketplace anywhere in the world.
Over the years, IDEMIA has built the largest world wide network of personalization centers designed to optimize responsiveness and proximity to the cardholder for fast delivery times. All of the 30 Service Centers are supported by a Common Personalization System (CPS) that allows card profile developments to be instantly and securely transferred and re-used in any one of them, helping globally aspiring Fintechs to expand rapidly. In addition to CPS, all IDEMIA sites are inter-connected via the IDEMIA Hub with a connection to almost all local and global card processors and BaaS providers so that services and solutions can be safely replicated, extended, shared and optimized across the world.
The IDEMIA FinTech Accelerator CardProgram benefits from dedicated local, regional and global FinTech teams that are trained to help to create a card product that will ensure FInTechs can fully differentiate their product in the marketplace. Before manufacturing the cards, the needs of various stakeholders within the FinTech’s organization are taken into consideration to guarantee an optimal start of the card issuing journey. IDEMIA provides advice on how to use innovative solutions to help FinTechs to further differentiate such as card packaging solutions, IDEMIA metal cards, biometric cards (F.CODE), cards with a dynamic security code (MOTION CODE) and recycled cards (GREENPAY).
With IDEMIA’s digital assets, customers will be able to blend the physical card with digital services. The FinTech Accelerator Card Program not only provides a seamless process for a successful card launch, but also it delivers additional digital services such as mobile identity proofing for customer on-boarding and IDEMIA Card Connect, a way to activate a card or provide secure customer authentication by tapping the contactless card on the phone. IDEMIA’s digital assets can also enable FinTechs to enrich their mobile banking apps with new payment features via digital cards, reinventing the customer journey for both proximity and remote payments.
“We recognize that the FinTech world needs innovative solutions and to move quickly. Our Accelerator Card Program does just that and ensures that we can help the processors, BaaS providers and FinTech customers get their products to market as quickly as possible and expand globally without the need to start a new project in each country”
Stuart Yaxley | Senior Vice President Global Accounts and FinTechs for Financial Institutions at IDEMIA
“IDEMIA’s FinTech accelerator card program and Hub have been strategic levers in creating an advanced interface and facilitating business for all of our existing and future global fintech customers, including providing a wide variety of valuable solutions such as metal cards, recycled plastic cards and digital solutions. The IDEMIA FinTech team are extremely knowledgeable in their field, and with our combined global reach, our partnership is a powerful force as we support our customer’s international growth journeys. Moreover, their global service delivery team have made sure that the interface that we have set up with them is designed to work with all of the needs and expectations of our customers.”
Neil Harris | Group Chief Commercial Officer of GPS - Global Processing Services.
“We at OneCard have set out to reimagine Credit Cards and have launched a Mobile First Metal Credit Card. We needed a partner who has the same philosophy and outlook of innovation and consumer first. The IDEMIA FinTech team was our partner of choice to create the stunning 16 g Metal OneCard. Their personalized Metal Card offering has helped differentiate OneCard. IDEMIA has been able to deliver the product for us in these challenging times also. ”
Vibhav Hathi, Cofounder & CMO, OneCard
About IDEMIA
IDEMIA, the global leader in Augmented Identity, provides a trusted environment enabling citizens and consumers alike to perform their daily critical activities (such as pay, connect and travel), in the physical as well as digital space.
Securing our identity has become mission critical in the world we live in today. By standing for Augmented Identity, an identity that ensures privacy and trust and guarantees secure, authenticated and verifiable transactions, we reinvent the way we think, produce, use and protect one of our greatest assets – our identity – whether for individuals or for objects, whenever and wherever security matters. We provide Augmented Identity for international clients from Financial, Telecom, Identity, Public Security and IoT sectors.
With close to 15,000 employees around the world, IDEMIA serves clients in 180 countries.
For more information, visit www.idemia.com / Follow @IDEMIAGroup on Twitter
View source version on businesswire.com: https://www.businesswire.com/news/home/20201005005366/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 02:30:00 CET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
