HUAWEI
24.3.2023 05:15:29 CET | Business Wire | Press release
Huawei recently held the Top 10 Trends of Data Center Facilities conference, themed "Smart DC, Building the Green Future". Fei Zhenfu, President of Huawei Data Center Facility Domain, released a white paper outlining Huawei's insights on data center facility trends that aim to promote sustainable development in the data center industry.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230323005815/en/
Fei Zhenfu, President of Huawei Data Center Facility Domain, shared Huawei's insights on the top 10 data center facility trends. (Photo: Business Wire)
According to Mr. Fei, as global computing demand continues to grow exponentially in the digital intelligence era, there will be a surge in data center construction. To achieve carbon neutrality, the industry must prioritize energy conservation, carbon emission reduction, and green transformation. This presents both challenges and opportunities. Drawing from its experience and industry insights, Huawei has identified the following 10 trends:
Trend 1: Low Carbon
Data centers will adopt green, low-carbon solutions and utilize clean energy sources like PV, wind, and hydropower to minimize their carbon footprint. By 2027, green power utilization is expected to exceed 50%. Advanced energy conservation solutions and technologies, such as waste heat recovery, will be implemented to improve data center energy efficiency and recovery rates.
Trend 2: Sustainability
New sustainability indicators for data centers will be introduced, including renewable energy utilization, water usage effectiveness (WUE), carbon usage effectiveness (CUE), space usage effectiveness (SUE), grid usage effectiveness (GUE), material recovery rate, and lifetime contaminant emissions, in addition to the existing power usage effectiveness (PUE).
Trend 3: Fast Deployment
Data centers must be rapidly deployed to meet skyrocketing computing demands, with construction periods decreasing from 12 months to six months or less.
Trend 4: High Density
As chip performance and power consumption improve, the demand for high-density data centers will increase. Cloud data centers will become mainstream, and diversified computing collaboration will become the norm. Standard power density per IT rack will increase from 6–8 kW to 12–15 kW by 2027. Power density in supercomputing and intelligent computing centers will reach 30 kW or higher.
Trend 5: Elasticity
Future data centers will be more flexible regarding upgrades, with one generation of facilities supporting power evolution over two to three generations of IT equipment. A standard design will facilitate on-demand deployment and elastic capacity expansion.
Trend 6: Prefabrication
The prefabricated and simple architecture will tackle challenges like long construction periods and complex O&M faced by traditional data centers. In the future, a data center building will house over 1000 racks, and a campus will accommodate over 10,000 racks. The prefabricated design will shorten the construction period for a 1000-rack data center from 12 months to 6 months, enabling rapid delivery and on-demand deployment.
Trend 7: Storage and Backup Integration
Renewable energy and energy storage will be necessary for power-hungry data centers. Energy storage systems (ESSs) deployments in data centers will integrate short-term backup power systems to participate in frequency regulation and peak shaving, enhancing power grid stability. Peak shaving will also improve the grid usage effectiveness (GUE) so that more IT racks can be deployed to increase revenue.
Trend 8: Distributed Cooling
A distributed cooling system uses cooling sources for each data hall and adopts a redundancy configuration as required. In the future, distributed cooling systems will gradually replace centralized cooling as the preferred solution for large data centers due to their flexible architecture and high reliability.
Trend 9: Smart O&M
Smart O&M is crucial for enhancing data center resource utilization and reliability. Intelligent operations will automatically determine data center asset statuses to maximize asset value. Intelligent maintenance will identify faults and optimize energy conservation in real time to improve O&M efficiency, achieving predictive maintenance and optimal energy efficiency.
Trend 10: Security & Trustworthiness
As digitalization and intelligence advance, data centers will strengthen their hardware reliability, software security, system resilience, safety, privacy, and availability. AI technologies will implement predictive maintenance on components, devices, and systems at the hardware level. The hierarchical defense will be provided at the software level. A combination of software and hardware measures will boost data center reliability.
Moving forward, Huawei will strengthen technological innovation to lead industry development and offer more competitive products and solutions to build a solid digital foundation for a greener, low-carbon future for the data center industry.
For more information, please download the White Paper on the Top 10 Trends of Data Center Facilities at https://digitalpower.huawei.com/attachments/index/06be6a70172444d1a84f88b8e0db5c29.pdf
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230323005815/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Quectel Unveils Versatile Pi Series SBCs to Power Developer Innovation10.3.2026 09:00:00 CET | Press release
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of its range of Quectel Pi series of single-board computers (SBCs), designed for a broad range of industrial use cases. The portfolio currently includes three compact development platforms - the Quectel Pi M1, L1, and H1 boards - engineered for low power consumption, cost efficiency, and full-stack software support. Designed to accelerate prototyping and product development, they are well suited for embedded applications, IoT solutions, robotics projects, and edge computing deployments. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310949640/en/ Quectel unveils versatile Pi series SBCs to power developer innovation “We’re delighted to launch the affordable, versatile, open source Quectel Pi series of SBCs to help developers of real IoT projects in areas such as home automation, robotics, sensors and edge computing to achiev
Expereo Appoints Kevin Brown as Chief Operating Officer to Drive Operational Excellence and Customer-Focused Growth10.3.2026 09:00:00 CET | Press release
Expereo, the world-leading Managed Network as a Service (NaaS) provider, today announces the appointment of Kevin Brown as Chief Operating Officer (COO), reinforcing the company’s focus on operational integration, efficiency, and scaling its customer and supplier-facing functions globally. Brown will assume overall accountability for operational strategy, transformation delivery, and performance across all customer and supplier-facing functions, while working in close partnership with the Digital Office, to deliver on our digital transformation. He brings extensive global operational leadership experience across Telco, Cybersecurity, and SaaS, most recently serving as Global COO of NCC Group, where he built and scaled operating models to drive customer experience, efficiency, and growth. Earlier in his career, Brown led the cybersecurity business at BT, establishing a strong track record of transforming operations into engines of value creation at scale. Kevin Brown, Chief Operating Of
Cooler Master Earns Four iF Design Awards 2026 for PC Design Innovation10.3.2026 08:07:00 CET | Press release
COSMOS Alpha, MasterFrame 360 Panorama, Custom GPU Fan Cooling Kit, and MasterFan A120 Recognized for Outstanding Product Design Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced that four of its products have received the iF DESIGN AWARD 2026, one of the world’s most respected design honors presented annually by iF Design in Hamburg, Germany. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310659475/en/ Cooler Master's winning iF designs: MasterFan A120, MasterFrame 360 Panorama, COSMOS Alpha and Custom GPU Fan Cooling Kit. The award recognizes outstanding achievement in product design, innovation, and user experience. For Cooler Master, the recognition highlights a design philosophy that combines engineering performance with builder-focused creativity. The award-winning products include the COSMOS Alpha, MasterFrame 360 Panorama, Custom GPU Fan Cooling Kit, and MasterFan A120,
GigaDevice Expands GD25UF Series Density Empowering AI Computing with 1.2V Ultra-Low Power Storage10.3.2026 08:00:00 CET | Press release
GigaDevice (HKEX: 3986), a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today announced the expanded density range of its GD25UF series 1.2V ultra-low power SPI NOR Flash, now spanning from 8Mb to 256Mb. This expansion precisely addresses diverse storage needs across wide range of applications from the advanced high performance AI computing space to the low power battery operated devices. From its intrinsic low-voltage and ultra-low power performance, portable devices like wearables, hearables, AI ASIC platforms, medical devices, and other fast-growing emerging markets can have longer battery life while driving device miniaturization from edge AI to ultra-compact form factors. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310862079/en/ GD25UF SPI NOR Flash Expanded Density Powering the Low-Voltage SoC Era with a Smarter System Architecture As se
GigaDevice Introduces GD32M531 MCU, Empowering Technological Innovation in Motor Control10.3.2026 08:00:00 CET | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products today officially announced the launch of the GD32M531 series 32-bit microcontrollers (MCUs) specifically tailored for motor control applications. Powered by the Arm® Cortex®-M33 core, the series integrates dedicated hardware accelerators for motor control and highly integrated peripheral resources. With exceptional computing performance, precise control capability, and industrial-grade high reliability, it achieves accurate control of dual motors + PFC, providing a high-efficiency and cost-effective solution for various home appliance application scenarios such as air conditioner outdoor units, air source heat pumps, washing machines/dryers, dishwashers, and multi-burner induction cookers. Samples and development boards of the GD32M531 series MCU are now available, and mass production and supply will officially start in April. This press release feature
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
