HUAWEI
24.3.2023 05:15:29 CET | Business Wire | Press release
Huawei recently held the Top 10 Trends of Data Center Facilities conference, themed "Smart DC, Building the Green Future". Fei Zhenfu, President of Huawei Data Center Facility Domain, released a white paper outlining Huawei's insights on data center facility trends that aim to promote sustainable development in the data center industry.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230323005815/en/
Fei Zhenfu, President of Huawei Data Center Facility Domain, shared Huawei's insights on the top 10 data center facility trends. (Photo: Business Wire)
According to Mr. Fei, as global computing demand continues to grow exponentially in the digital intelligence era, there will be a surge in data center construction. To achieve carbon neutrality, the industry must prioritize energy conservation, carbon emission reduction, and green transformation. This presents both challenges and opportunities. Drawing from its experience and industry insights, Huawei has identified the following 10 trends:
Trend 1: Low Carbon
Data centers will adopt green, low-carbon solutions and utilize clean energy sources like PV, wind, and hydropower to minimize their carbon footprint. By 2027, green power utilization is expected to exceed 50%. Advanced energy conservation solutions and technologies, such as waste heat recovery, will be implemented to improve data center energy efficiency and recovery rates.
Trend 2: Sustainability
New sustainability indicators for data centers will be introduced, including renewable energy utilization, water usage effectiveness (WUE), carbon usage effectiveness (CUE), space usage effectiveness (SUE), grid usage effectiveness (GUE), material recovery rate, and lifetime contaminant emissions, in addition to the existing power usage effectiveness (PUE).
Trend 3: Fast Deployment
Data centers must be rapidly deployed to meet skyrocketing computing demands, with construction periods decreasing from 12 months to six months or less.
Trend 4: High Density
As chip performance and power consumption improve, the demand for high-density data centers will increase. Cloud data centers will become mainstream, and diversified computing collaboration will become the norm. Standard power density per IT rack will increase from 6–8 kW to 12–15 kW by 2027. Power density in supercomputing and intelligent computing centers will reach 30 kW or higher.
Trend 5: Elasticity
Future data centers will be more flexible regarding upgrades, with one generation of facilities supporting power evolution over two to three generations of IT equipment. A standard design will facilitate on-demand deployment and elastic capacity expansion.
Trend 6: Prefabrication
The prefabricated and simple architecture will tackle challenges like long construction periods and complex O&M faced by traditional data centers. In the future, a data center building will house over 1000 racks, and a campus will accommodate over 10,000 racks. The prefabricated design will shorten the construction period for a 1000-rack data center from 12 months to 6 months, enabling rapid delivery and on-demand deployment.
Trend 7: Storage and Backup Integration
Renewable energy and energy storage will be necessary for power-hungry data centers. Energy storage systems (ESSs) deployments in data centers will integrate short-term backup power systems to participate in frequency regulation and peak shaving, enhancing power grid stability. Peak shaving will also improve the grid usage effectiveness (GUE) so that more IT racks can be deployed to increase revenue.
Trend 8: Distributed Cooling
A distributed cooling system uses cooling sources for each data hall and adopts a redundancy configuration as required. In the future, distributed cooling systems will gradually replace centralized cooling as the preferred solution for large data centers due to their flexible architecture and high reliability.
Trend 9: Smart O&M
Smart O&M is crucial for enhancing data center resource utilization and reliability. Intelligent operations will automatically determine data center asset statuses to maximize asset value. Intelligent maintenance will identify faults and optimize energy conservation in real time to improve O&M efficiency, achieving predictive maintenance and optimal energy efficiency.
Trend 10: Security & Trustworthiness
As digitalization and intelligence advance, data centers will strengthen their hardware reliability, software security, system resilience, safety, privacy, and availability. AI technologies will implement predictive maintenance on components, devices, and systems at the hardware level. The hierarchical defense will be provided at the software level. A combination of software and hardware measures will boost data center reliability.
Moving forward, Huawei will strengthen technological innovation to lead industry development and offer more competitive products and solutions to build a solid digital foundation for a greener, low-carbon future for the data center industry.
For more information, please download the White Paper on the Top 10 Trends of Data Center Facilities at https://digitalpower.huawei.com/attachments/index/06be6a70172444d1a84f88b8e0db5c29.pdf
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230323005815/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
Toshiba Showcases End-to-End Innovations Shaping What’s Next in Retail at EuroShop 202617.2.2026 15:45:00 CET | Press release
At EuroShop, Toshiba showcases intelligent, scalable solutions that combine AI, computer vision, and energy-efficient design to transform the future of retail. At EuroShop 2026, Toshiba Global Commerce Solutions will showcase how retailers across Europe are using scalable, sustainable innovation to address today’s challenges and build what’s next. Exhibiting in Hall 6, Booth C41 from the 22nd to 26th February, Toshiba will demonstrate technologies designed to evolve with retailers, empowering flexibility, resilience, and long-term growth, and prepare them for what’s next. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260216755053/en/ At EuroShop, we’re showing how Toshiba empowers retailers across all segments to transform with confidence by scaling intelligent solutions to deliver lasting impact. “Retailers are under pressure to move faster, operate more efficiently, and deliver better experiences than ever before. At Euro
Andersen Consulting Expands Executive Talent Capabilities With Lansdowne Executive Search17.2.2026 15:30:00 CET | Press release
Andersen Consulting strengthens its human capital practice through a Collaboration Agreement with Lansdowne Executive Search, a Dublin-based firm specializing in executive search, interim management and board level appointments. Founded in 2015, Lansdowne Executive Search is an Irish-owned firm, delivering C-level executive search, fractional executives, and board placement services. As a partner-led, boutique practice, Lansdowne is known for the deep involvement of senior leadership in all client engagements. Lansdowne helps clients navigate complex leadership transitions and growth strategies across a wide range of sectors including financial services, construction, nonprofit, agriculture, higher education, public sector, and TMT. “Great leadership is contextual and getting it right means understanding far more than just a resume,” said Tom Keane, partner at Lansdowne Executive Search. “Collaborating with Andersen Consulting gives us the scale and access to expertise we need to conti
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom