Business Wire

HK-TRD-DVLPMNT-COUNCIL

22.11.2022 02:59:38 CET | Business Wire | Press release

Share
HKTDC Hong Kong Toys & Games Fair is Set to Return in January 2023

Organised by the Hong Kong Trade Development Council, the 49th edition of Hong Kong Toys & Games Fair will run under the brand-new EXHIBITION+ model which integrates online and offline shows. The physical fair will run from 9-12 January 2023 at the Hong Kong Convention and Exhibition Centre (HKCEC), while the online exhibition will run from 9 until 19 January, helping global traders explore business opportunities both in person and online. Under this year’s theme of “Play To Bond ∙ Family and Beyond”, the fair will showcase a wide variety of products ranging from traditional toys to high-tech games, from famed names to emerging brands.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20221117005546/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

HKTDC Hong Kong Toys & Games Fair is Set to Return in January 2023 (Photo: Business Wire)

Further relaxation of quarantine measures to facilitate the visiting of global buyers

The Hong Kong SAR Government announced a further relaxation of quarantine measures for inbound travellers with effect from 26 Sep 2022. Under the “0+3” scheme, inbound travellers no longer need to do the pre-flight PCR test and quarantine in a designated hotel. Travellers with an amber code during the three days of medical surveillance can also participate in B2B events. The Return2hk Scheme and Come2hk Scheme will be extended to cover all places in the Mainland and Macao with no quota restriction. The latest quarantine arrangement for inbound travellers provides convenience for global buyers to visit the Hong Kong Toys & Game Fair, as well as the concurrent Hong Kong Baby Products Fair and the Hong Kong International Stationery & School Supplies Fair.

Wide Range of Exhibits on Display

To facilitate buyers’ sourcing needs, the fair will feature a number of product zones including the Brand Name Gallery, which will showcase branded products with eye-catching design and innovative functions. Kidult World will feature products for grown-ups like hobby goods, magic items, action and war game items, as well as art toys, models and figurines. Also returning in the upcoming edition will be the Smart-Tech Toys, displaying toys and games that incorporate innovative technologies such as AI, AR, VR, etc. Green toys, as one of the industry's currently hottest topics, will also be highlighted in the fair to meet market needs.

Register for FREE buyer admission: https://bit.ly/3EAHJ6O

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20221117005546/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 02:30:00 CET | Press release

Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye