GIGABYTE
24.6.2021 12:47:12 CEST | Business Wire | Press release
GIGABYTE, a world leader in computer technology, is excited to be part of MWC (Mobile World Congress) to present its products and insights on Edge computing , and be joined by innovators and decision-makers who will shape the future of 5G deployments and 6G planning.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210624005477/en/
GIGABYTE presents a series of servers that are “short and sweet”, and available in either x86 or Arm platforms to support diverse applications. Not only are these Edge servers shortened to depths ranging from only 400-600mm to fit in more environments for telecom deployments, but also ready to serve as HPCs to handle challenging workloads for AI and data processing that are closer to users’ applications.
- E152-ZE0 - Supports 3rd Gen AMD EPYC 7003 and 7002 processors, is extremely short with 400mm in depth, comes with 8 DIMM slots, and supports two U.2 NVMe SSDs. The E152 chamber for dual-slot GPUs can also be used for two single-slot cards operating at Gen4 x16, and two low-profile expansion slots on the front to provide user with powerful performance and flexibility for implementation.
- E162-220 - Designed for 3rd Gen Intel Xeon Scalable processors and has 16 DIMMs for industry standard 8-channel memory, and supports two U.2 SSDs and three M.2 connectors onboard with Gen4 PCIe transmission. All I/Os are designed in the same direction, making it suitable not only for installation in data centers, but also for deployment in base stations to provide 5G MEC or edge computing for services.
- E251-U70 - The first GIGABYTE edge server designed for 2nd Gen Intel Xeon Scalable processors, supporting six 2.5” SATA/SAS bays on the front-left, and a dual-slot GPU plus a FHFL single-slot card on the front-right. Notably, this server was chosen by NVIDIA Aerial Developer Kit for development and deployment of vRAN stack. E251-U71, a SKU variant that is NEBS design ready, is designed for extreme conditions such as high temperature, humidity or altitude.
- E252-P30 – Built for workloads on Arm architecture and uses Ampere Altra processors with up to 80 cores and 16 DIMMS for a wealth of possibilities in the cloud, the server is a viable option when considering TCO. It has six SSDs bays and lots of expansion slots for low-profile accelerators, storage, or networking.
The “short”ness of GIGABYTE Edge servers’ chassis and the “sweet”ness of its performance capabilities will prove to be indispensable equity in telecommunications, as the success in 5G deployments demands a widespread of MEC networks that are both closely-and-intelligently-connected.
GIGABYTE is an engineer, visionary, and leader in the tech world that uses its hardware expertise, patented innovations, and industry leadership to create, inspire, and advance. With over 30 years of celebrated experience, GIGABYTE is pleased to be the backbone of the IT infrastructure and provide the industry with data center expertise and cutting-edge server products that can accelerate scientific and technological breakthroughs.
https://www.mwcbarcelona.com/exhibitors/gigabyte-technology
See more presentations: https://www.gigabyte.com/Tech-Tune-In
View source version on businesswire.com: https://www.businesswire.com/news/home/20210624005477/en/
Link:
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release
Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th
Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release
Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv
Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release
Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te
Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release
Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i
SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days2.6.2026 00:35:00 CEST | Press release
CINDE Assortment and Space closes the loop between assortment, planogram, and in-store execution, proven across 500-plus global CPG deployments Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram execution, and in-store compliance, compressing the category review cycle from four to six weeks to a matter of days. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602137061/en/ The platform is underpinned by SymphonyAI's Transferable Demand AI, a model trained across 25 years of retail data a
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom