Business Wire

FIBOCOM

9.3.2021 05:17:10 CET | Business Wire | Press release

Share
Fibocom Announces Multiple Next-Gen 5G NR Modules to 3GPP R16 Standard at MWC Shanghai 2021

Fibocom (Stock Code: 300638), a leading provider of cellular embedded wireless module solutions for the Internet of Things (IoT), announced the world-wide launch of the next generation 5G NR modules compliant with the 3GPP R16 standard during Mobile World Congress Shanghai 2021 (MWCS21). The new launch includes FM160 and FG160 5G module series of Sub-6GHz frequency range, as well as FM160W and FG160W series of mmWave range.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210308005973/en/

Product video on YouTube:
https://www.youtube.com/watch?v=Wg0nE1WtoBM

The new 5G NR module series is based on the newly-announced Qualcomm® Snapdragon™ X65 and X62 5G Modem-RF Systems and delivers enhanced mobile broadband and high-reliability, low-latency wireless services for IIoT (Industrial IoT), FWA ( Fixed Wireless Access), 4K/8K live streaming, telemedicine, private 5G networks, and other mass data scenarios by supporting lightening data transmission speeds up to 10Gbps, three modes of CA (Carrier Aggregation)combinations including FDD+TDD, TDD+TDD, FDD+FDD, global frequency bands of 5G SA/ENDC/4G, dynamic antenna tuning, and next-generation software algorithm.

“Qualcomm Technologies has closely worked with Fibocom over years to support innovation and deep collaboration in a multitude of IoT segments requiring high-performance, high-reliability across industries”, said Gang Sun, vice president, product marketing, Qualcomm International (Shanghai) Co., Ltd. “Based on the advantages of our fourth-generation 5G modem-to-antenna solution in data speeds, coverage, upgradeable architecture and power efficiency, we look forward to further seeing how Fibocom’s strong experience in IoT combined with Qualcomm Technologies’ advanced technologies brings 5G benefits to more consumers and industries.”

Tiger Ying, CEO of Fibocom, said, “The fourth industrial revolution has made digital production the currency of modern business models. 5G will bring possibilities to IoT and industrial digitalization beyond our imagination. Government utilities and enterprises are facing insufficient automation and reliable remote management to enhance operating efficiency and safety. Our new 5G series based on Qualcomm Technologies’ latest Snapdragon X65 and X62 5G Modem-RF Systems, is designed to answer the pain points, setting a new benchmark for high-speed, low latency, and reliable wireless communications services, and helping us become the trusted choice for 5G IoT solutions.”

Remarks:
Qualcomm and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.
Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. and/or its subsidiaries

About Fibocom Wireless Inc.

Founded in 1999, Fibocom is a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules. We are committed to bringing reliable, accessible, secure, and intelligent wireless solutions to every IoT application scenario for the increasingly digitalized industries and enriched smart life of the whole society. In 2017, Fibocom become the first stock-listed (Stock Code: 300638) wireless module provider in China.

We provide technically advanced and high-performance 5G, 4G, NB-IoT/eMTC, 3G, and 2G, smart, auto-grade, GNSS, Wi-Fi/BT wireless modules. By technically embedding Fibocom’s wireless solutions into IoT devices that will become smart and remotely manageable with stable data transmission between devices and operation center, we empower the intelligent future of all industries that mainly include smart retail, ACPC (Always Connected PC), industry 4.0, smart grid, smart homes, smart agriculture, smart cities, telemedicine, metering, smart security surveillance, and the intelligently connected cars, etc. We have many long-term industry customers including Fortune Global 500 enterprises, which is an important driven power of our fast development.

Fibocom is headquartered in Shenzhen, China, and has R&D centers in both Shenzhen and Xi'an. We are globally located with more than 30 subsidiaries and regional operation centers in China, Americas, EMEA, and Asia Pacific Regions. Currently, we have more than 1000 global employees, and provide products and services in more than 100 countries and regions.

Link:

ClickThru

Social Media:

https://www.facebook.com/Fibocom/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products atKitakami Plant Fab23.7.2026 12:19:00 CEST | Press release

Companies Showcase Ongoing Buildout of Manufacturing Infrastructure at K2 to Address Growing Demand for NAND Flash Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their

VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 12:02:00 CEST | Press release

Enhancing image quality and visual perception for moving-camera systems VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adj

Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 11:11:00 CEST | Press release

Acquisition of WKS Group strengthens Messer’s Southeast Asia presence Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expert

Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 01:00:00 CEST | Press release

Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach

Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 01:00:00 CEST | Press release

Production planned at Fab2 of Kitakami Plant Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stac

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye