FIBOCOM
9.3.2021 05:17:10 CET | Business Wire | Press release
Fibocom (Stock Code: 300638), a leading provider of cellular embedded wireless module solutions for the Internet of Things (IoT), announced the world-wide launch of the next generation 5G NR modules compliant with the 3GPP R16 standard during Mobile World Congress Shanghai 2021 (MWCS21). The new launch includes FM160 and FG160 5G module series of Sub-6GHz frequency range, as well as FM160W and FG160W series of mmWave range.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210308005973/en/
Product video on YouTube:
https://www.youtube.com/watch?v=Wg0nE1WtoBM
The new 5G NR module series is based on the newly-announced Qualcomm® Snapdragon™ X65 and X62 5G Modem-RF Systems and delivers enhanced mobile broadband and high-reliability, low-latency wireless services for IIoT (Industrial IoT), FWA ( Fixed Wireless Access), 4K/8K live streaming, telemedicine, private 5G networks, and other mass data scenarios by supporting lightening data transmission speeds up to 10Gbps, three modes of CA （Carrier Aggregation）combinations including FDD+TDD, TDD+TDD, FDD+FDD, global frequency bands of 5G SA/ENDC/4G, dynamic antenna tuning, and next-generation software algorithm.
“Qualcomm Technologies has closely worked with Fibocom over years to support innovation and deep collaboration in a multitude of IoT segments requiring high-performance, high-reliability across industries”, said Gang Sun, vice president, product marketing, Qualcomm International (Shanghai) Co., Ltd. “Based on the advantages of our fourth-generation 5G modem-to-antenna solution in data speeds, coverage, upgradeable architecture and power efficiency, we look forward to further seeing how Fibocom’s strong experience in IoT combined with Qualcomm Technologies’ advanced technologies brings 5G benefits to more consumers and industries.”
Tiger Ying, CEO of Fibocom, said, “The fourth industrial revolution has made digital production the currency of modern business models. 5G will bring possibilities to IoT and industrial digitalization beyond our imagination. Government utilities and enterprises are facing insufficient automation and reliable remote management to enhance operating efficiency and safety. Our new 5G series based on Qualcomm Technologies’ latest Snapdragon X65 and X62 5G Modem-RF Systems, is designed to answer the pain points, setting a new benchmark for high-speed, low latency, and reliable wireless communications services, and helping us become the trusted choice for 5G IoT solutions.”
Remarks:
Qualcomm and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.
Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. and/or its subsidiaries
About Fibocom Wireless Inc.
Founded in 1999, Fibocom is a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules. We are committed to bringing reliable, accessible, secure, and intelligent wireless solutions to every IoT application scenario for the increasingly digitalized industries and enriched smart life of the whole society. In 2017, Fibocom become the first stock-listed (Stock Code: 300638) wireless module provider in China.
We provide technically advanced and high-performance 5G, 4G, NB-IoT/eMTC, 3G, and 2G, smart, auto-grade, GNSS, Wi-Fi/BT wireless modules. By technically embedding Fibocom’s wireless solutions into IoT devices that will become smart and remotely manageable with stable data transmission between devices and operation center, we empower the intelligent future of all industries that mainly include smart retail, ACPC (Always Connected PC), industry 4.0, smart grid, smart homes, smart agriculture, smart cities, telemedicine, metering, smart security surveillance, and the intelligently connected cars, etc. We have many long-term industry customers including Fortune Global 500 enterprises, which is an important driven power of our fast development.
Fibocom is headquartered in Shenzhen, China, and has R&D centers in both Shenzhen and Xi'an. We are globally located with more than 30 subsidiaries and regional operation centers in China, Americas, EMEA, and Asia Pacific Regions. Currently, we have more than 1000 global employees, and provide products and services in more than 100 countries and regions.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210308005973/en/
Link:
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release
Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th
Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release
Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv
Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release
Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te
Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release
Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i
SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days2.6.2026 00:35:00 CEST | Press release
CINDE Assortment and Space closes the loop between assortment, planogram, and in-store execution, proven across 500-plus global CPG deployments Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram execution, and in-store compliance, compressing the category review cycle from four to six weeks to a matter of days. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602137061/en/ The platform is underpinned by SymphonyAI's Transferable Demand AI, a model trained across 25 years of retail data a
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom