EFPIA
11.4.2022 00:03:09 CEST | Business Wire | Press release
Europe's pharmaceutical sector is stepping up measures to help deliver faster, more equitable access to medicines for millions of patients across the EU.
The new pledge from the European Federation of Pharmaceutical Industries and Associations (EFPIA) member companies should drastically increase the availability of innovative medicines in EU countries and decrease the time patients must wait for new medicines by several months.
From today EFPIA Member companies commit to file for pricing and reimbursement in all EU countries as soon as possible and no later than 2 years from the central EU market authorisation, provided that local systems allow it. The commitment is designed to help deliver faster, more equitable access to medicines for patients across Europe.
Data published by EFPIA last week showed that disparities in the time it takes for patients to access new medicines in different EU Member States are increasing. Patients in Germany wait around 133 days to access new medicines compared to patients in Romania that endure a wait of 899 days. Significant disparities also occurred in terms of availability of innovative medicines since less than 30% of centrally approved products are available in smaller and Eastern European Member States compared with 92% in Germany and 46% in average in the European Union.
Modelling by IQVIA predicts that the commitment to file would increase the availability of medicines from 18% up to 64% in several countries depending on the country’s payer resource for assessment of the increased number of applications. Critically, the modelling also estimates that the commitment would reduce the time patients wait for new medicines by 4 to 5 months in several countries such as Bulgaria (-179 days), Poland (-129 days) and Romania (-155 days).
However, the time between getting marketing authorisation and companies filing for pricing and reimbursement in a country is just one part of the story. According to analysis by Charles River Associates , there are 10 inter-related factors that cause barriers and delays in patients getting access to new medicines. These causes are rooted in Member States’ access systems and processes and their corresponding impact on commercial decision-making.
This is why the commitment to file is supported by the launch of an online portal where marketing authorisation holders can provide timely information regarding the timing and processing of pricing and reimbursement applications in the EU-27 countries. Bringing greater transparency to the barriers and delays to access will facilitate finding solutions in partnership. Further details of both the commitment to file and the online portal are included in Addressing patient inequalities in Europe , a position paper published by EFPIA today.
In addition to a more equitable system for patients, EFPIA is opening discussions on a more equitable system for EU Members States where the price of innovative medicines can vary between countries depending on their economic level and ability to pay. Also published today, a discussion document entitled ‘A Shared Approach to Supporting Equity-based Tiered Pricing’ sets out the key features of an equity-based tiered pricing system, anchored in the principle of solidarity between Member States and enshrined in the EU treaties. To deliver an equity based, fairer system requires the Commission and Member States to amend external reference pricing systems and undertake mechanisms to prevent the unintended consequences from internal trade in medicines.
Speaking about the launch of the new commitments, EFPIA Director General Nathalie Moll said. “By reducing the time it takes to file for pricing and reimbursement in all 27 EU member States, by bringing greater transparency to the barriers and delays to access, by co-creating an equity-based pricing system, by adopting an efficient system of EU assessments of relative efficacy and by sharing information on the implementation of novel pricing mechanisms, we believe that together we can create a step-change in the access landscape for patients across Europe. ”
View source version on businesswire.com: https://www.businesswire.com/news/home/20220410005007/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
