DUBAI-INTERNET-CITY
20.10.2015 13:21:15 CEST | Business Wire | Press release
Dubai Internet City (DIC) , the official partner for the Smart City App Hack, has announced the competition’s 10 finalists; Boxit.com, Ithal, Einvite, Carpool Arabia, World Spotlight, D2D Auto Services, LupUp, GPSShield, MyGreenRank and App3ad. The competition is part of DIC’s role as a Strategic Partner for Smart Dubai, to support the development of UAE start-ups and app developers and bring together the tech community and foster innovation and creativity.
This Smart News Release features multimedia. View the full release here: http://www.businesswire.com/news/home/20151020005876/en/
Over the past five months, developers and entrepreneurs have had the chance to be involved in the building of a truly Smart City and have created and developed apps, mentored by a global team of tech experts. Applicants were invited to submit app ideas based around five Smart themes; Urban Mobility, Energy and Emissions, Culture and Tourism, Retail and Shopping and Collaborative City, ahead of selection on 3 October.
The winning team will be awarded a trip to Barcelona to pitch their app at the Smart City Expo in November, as well as in5 membership, and second and third place will be awarded four months of membership at in5, and the chance to be selected as one of the finalists to pitch their apps in Barcelona. The winner of the Smart City Expo will be invited to pitch at the MasterCard Masters of Code in Silicon Valley.
Majed Al Suwaidi, Managing Director of Dubai Internet City and Dubai Outsource Zone said;
“The Smart City App Hack competition is part of our wider focus on supporting the development of UAE start-ups, entrepreneurs, mobile application and web developers. Competitions such as this are instrumental in achieving Dubai’s wider smart objectives and will contribute to the government’s vision to make Dubai the smartest place in the world by 2017.”
To register for the competition, please visit http://dubai.smartcityapphack.com/
About Dubai Internet City
Dubai Internet City (DIC), part of TECOM Group, a member of Dubai Holding, is the Middle East and North Africa’s largest ICT hub. Since the year 2000, DIC has successfully developed a prosperous ecosystem for technology organisations and today is home to Fortune 500 listed companies and multinationals as well as some of the region’s most dynamic and successful technology SMEs and start-ups from all elements of the ICT value chain.
DIC provides a wide range of facilities including state-of-the-art offices, a robust IT infrastructure, 24-hour security, retail services and hotels, spread across the business park’s unique and tranquil landscape; an environment that helps ICT businesses develop, innovate and grow.
For more information, please visit: www.dubaiinternetcity.com .
*Source: ME NewsWire
View source version on businesswire.com: http://www.businesswire.com/news/home/20151020005876/en/
Contact:
For Dubai Internet City
Alexa Hooft Graafland, +971-55-559-7404
AHooftGraafland@bell-pottinger.com
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 02:30:00 CET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom