DISRUPTIVE.ASIA
7.7.2021 13:02:05 CEST | Business Wire | Press release
Disruptive.Asia finds that the real boost for AR will come from the consumer market – provided device prices come down far enough, and provided operators harness the combined power of 5G, cloud, edge, and AI to provide the best user experience for AR. AR is fast gaining traction in various enterprise segments, especially in China.
AR has been mainly an enterprise play. In Huawei Better World Summit for 5G + AR, Bob Cai, CMO of Huawei’s Carrier BG, talked about how the vendor has already found in-house uses for AR during the COVID-19 pandemic, such as showcasing products to clients virtually, and speeding up base station rollouts by providing AR info to field engineers to eliminate multiple site visits.
The consumer AR market hasn’t been languishing. David MacQueen, executive director of Strategy Analytics, noted that AR is already resonating with consumers with hits such as Pokémon Go, Snapchat and TikTok, driving heavy usage across a huge market of 1.5 billion devices that includes both AR headsets and AR-enabled smartphones and tablets. However, consumer AR will really take off once standalone AR headsets are light, comfortable and cheap enough. They will need to be supported by a good quality, 5G network.
From Disruptive.Asia’s point of view, it doesn’t just mean superfast connections to the base station – it also means leveraging other key features of 5G infrastructure. Mobile edge computing will help improve latency, and AI can interpret live video coming in and contextualize data. All of this is necessary for AR to deliver the best possible user experience, MacQueen said. This also means AR is a juicy opportunity for 5G operators as consumer AR is inherently a mobile play.
It was critical to develop an AR ecosystem of partners developing devices, networks and content. Eric Zhao, vice president of Huawei’s CNBG Marketing, said that the experience of LG U+ shows that a robust 5G network is crucial for developing valuable AR services.
About Disruptive.Asia
Disruptive.Asia covers the current state of digital disruption in the Asia-Pacific telecoms, fintech and internet sectors – where it’s coming from, what’s driving it, the impact it’s having on each industry, how the key players are responding and what’s next.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210707005446/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Growing with Purpose, Delivering with Impact: ProAmpac Releases 2026 Sustainability Impact Report4.8.2026 17:13:00 CEST | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the release of its 2026 Sustainability Impact Report, centered around the theme Growing with Purpose, Delivering with Impact, the report highlights the company's advancements in sustainable innovation, environmental stewardship, employee safety, and responsible business practices while expanding its global footprint. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804969765/en/ ProAmpac's 2026 Impact Report is here Reflecting another year of meaningful achievements, the report demonstrates how ProAmpac is embedding sustainability throughout its business, from advancing innovative packaging solutions and reducing environmental impacts to strengthening workplace safety and supporting the communities where employees live and work. Notable achievements highlighted in the 2026 Sustainability Impact Report include:Continued Global Growth: Expanded Pr
New Esri Press Book Empowers Users to Unlock the Potential of AI with the Power of Geography4.8.2026 16:35:00 CEST | Press release
Exploring GeoAI: Tools and Workflows Offers Cutting-Edge Geospatial AI Models and Step-By-Step Tutorials Using ArcGIS Esri has released Exploring GeoAI: Tools and Workflows, a practical guide for applying geospatial AI using ArcGIS. Designed for GIS professionals, analysts, and data scientists, the workbook supports real-world spatial analysis through hands-on GeoAI workflows. The book addresses the growing importance of GeoAI by guiding readers through data preparation, model training, evaluation, and deployment. Step-by-step tutorials use real-world datasets to demonstrate deep learning, object detection, lidar classification, transfer learning, and predictive spatial analysis in ArcGIS. Esri has released Exploring GeoAI: Tools and Workflows, a practical guide to applying geospatial artificial intelligence (GeoAI) using ArcGIS. Designed for GIS professionals, analysts, and data scientists, this hands-on workbook provides the knowledge and tools needed to integrate advanced AI workflo
Rehlko Defines What It Takes to Build AI-Ready Power Infrastructure as Data Center Energy Demands Evolve4.8.2026 15:15:00 CEST | Press release
New eBook highlights how increasingly dynamic AI workloads are reshaping critical power requirements and explores strategies for building resilient, scalable energy infrastructure Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today released new insights on the power infrastructure requirements emerging from the rapid growth of large language models and artificial intelligence. In its latest eBook, AI Readiness Starts with Power: Designing for Real-World Load Conditions, Rehlko examines how increasingly dynamic AI workloads are reshaping expectations for data center power systems and highlights key infrastructure considerations for operators seeking to scale AI capacity reliably and efficiently. As the eBook outlines, AI readiness is increasingly defined not by installed capacity, but by how systems perform under highly variable real-world load conditions. The AI Power Challen
HappyRobot Raises $150 Million Series C to Build Enterprise Superintelligence4.8.2026 14:30:00 CEST | Press release
New funding led by Prysm Capital and co-led by Eurazeo will accelerate global growth as HappyRobot expands its engineering, deployment and go-to-market teams HappyRobot, the company putting AI agents to work across complex enterprise operations, today announced it has raised $150 million in Series C funding led by Prysm Capital and co-led by Eurazeo. Existing investors a16z, Base10, Y Combinator are doubling down with participation from strategics like Koch Disruptive Technologies (KDT), Orange, and T.Capital (Deutsche Telekom), Bankinter, Endeavor Catalyst, Kfund and Wave-X. The round values the company at $1.2 billion post-money, bringing total funding to around $200 million and marking a new stage of growth as enterprises deploy AI agents across mission-critical work. HappyRobot works with more than 150+ enterprise customers, including DHL, Kuehne + Nagel, Naturgy, Repsol, and Uber, and has grown 5x since raising its Series B late last year. After first proving its platform in logis
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND4.8.2026 14:30:00 CEST | Press release
10th-generation QLC 3D flash memory represents a major leap forward for AI storage architectures, cloud platforms, and data‑intensive innovations Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804147821/en/ Leveraging the companies’ revolutionary CMOS directly Bonded to Array (CBA) technology2 which fabricates CMOS logic and the memory array on separate wafers before bonding them together with high-precision wafer-to-wafer alignment, the new generation improves read and write bandwidth c
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom