DIGI-INTERNATIONAL
21.6.2022 09:02:08 CEST | Business Wire | Press release
Digi International ® , (NASDAQ: DGII) - a leading global provider of Internet of Things (IoT) connectivity products, solutions, services and wireless data plans - today announced it will showcase a wide range of its new solutions and devices at Embedded World 2022 that enable medical, transportation, agriculture and industrial enterprises to create innovative solutions faster.
Digi’s first-look of its Digi ConnectCore MP1 system-on-modules, Digi ConnectCore Voice Control software, and Digi XBee Intelligent Edge Controller takes place at Bressner Technology booth 1-236 in Hall 1. Digi ConnectCore MP1 is also on display at STMicroelectronics Wall of SOMs booth 4A-148. There are live demos of Digi XBee and its IX15 gateway and the new Digi ConnectCore Voice Control application at the NXP booth 4A-222.
Bolstered by Digi Remote Manager® —the command center of an intelligent network—Digi’s new and smaller embedded IoT technologies dramatically improve the way people, machines and processes interact. Network connectivity is the fundamental key to the true potential of these technologies that place Digi at the forefront of some of the most advanced networking solutions combining software, hardware and services for enterprises.
“This is an exceptionally exciting year to return to Embedded World,” said Andreas Burghart, Senior Product Manager at Digi. “Advances in connectivity and IoT devices are spurring the rapid development of next-generation, cost-effective, integrated solutions. That’s unleashing new waves of innovation across numerous industries that require reliable and secure connectivity. We’re looking forward to sharing our progress and collaborating with our customers on breakthrough embedded solutions.”
Digi’s Embedded World 2022 solution showcase includes three new or recently launched products:
- Digi ConnectCore® MP1 Family – The Digi ConnectCore® MP1 family of system-on-modules (SOMs) features the industry’s smallest STM32MP1 SOM that integrates Wi-Fi, Bluetooth and wired connectivity without comprising design flexibility. The solution also features its Connected Device platform and well-tested development tools and design support. Digi ConnectCore MP1 SOMs offer a cost-effective wireless solution for OEMs seeking to reduce product-development risk and effort.
- Digi ConnectCore Voice Control Software – This advanced voice-control software solution is designed for the acclaimed ConnectCore family of system-on-modules (SOMs). Digi ConnectCore Voice Control is a fully integrated, ready-to use software solution that enables developers to design a voice-based human-machine interface (HMI) to control device operations using speech. It provides voice processing on edge devices (including support for 30 languages and a 60,000-word vocabulary) with no cloud connectivity required. That reduces connectivity costs and data-privacy concerns while providing response times of less than 100ms.
- Digi XBee® Intelligent Edge Controller (IEC) - The Digi XBee® Intelligent Edge Controller (IEC) delivers a comprehensive networking architecture to close the gap between field devices and the cloud and provide powerful asset monitoring and control. In combination with Digi X-ON cloud, the Digi XBee IEC helps companies monitor sensors or remote-control assets over long-range, low-power wide area networks, including LoRaWAN, CAT-M1, and NB-IoT. Industrial devices can be monitored with sub-second latency with alarms and data wirelessly delivered through the Digi X-ON cloud.
At Embedded World, Digi will also demonstrate its wireless IoT solution for smart agriculture with a simulation of a complete ecosystem that can centrally manage multiple farms. This end-to-end solution provides crop managers with real-time weather conditions that help determine optimal irrigation cycles, maximize crop yields and lower labor and supply costs. The heart of the system is the Digi IX15 gateway and cellular router that communicates with irrigation pumps through a wireless mesh network of Digi XBee® modules. Using Digi Remote Manager® and a cloud-based web application, a crop manager monitors exact weather and soil conditions at each farm, and controls individual pumps. The commands pass through the internet to the IX15 by a cellular network, and the IX15 relays the commands to the XBee modules at each pump, turning them on and off remotely.
Digi will also preview its upcoming Digi ConnectCore 93, which includes NXP’s i.MX 93 system-on-a-chip (SOC). Digi is one of six Early Access Partners for this April 2023 release.
For more information about Digi, stop by Bresser Technology Booth 1-236 in Hall 1 or visit: www.digi.com .
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20220621005096/en/
Link:
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Biocytogen Announces Clinical Milestone with First Patient Dosed in Phase 1 Trial of IDEAYA’s First-in-Class B7H3/PTK7 Bispecific TOP1 ADC IDE03428.2.2026 01:00:00 CET | Press release
IDE034 is a B7H3/PTK7 bispecific TOP1 ADC designed to target tumor cells expressing both B7H3 and PTK7 preferentially, and is being evaluated as monotherapy and in combination with IDEAYA’s PARG inhibitor IDE161. IDEAYA has dosed the first patient in its Phase 1 trial of IDE034, initially evaluating safety, tolerability, and PK. First dosing triggers a $5 million milestone payment to Biocytogen under the companies’ option and license agreement. Biocytogen Pharmaceuticals (Beijing) Co., Ltd. (Biocytogen, SSE: 688796; HKEX: 02315), a global biotechnology company that drives the research and development of novel antibody-based drugs with innovative technologies, today announced that its partner IDEAYA Biosciences, Inc. (“IDEAYA”; Nasdaq: IDYA) has dosed the first patient in IDEAYA’s Phase 1 dose-escalation/expansion clinical trial of IDE034, an investigational B7H3/PTK7 bispecific TOP1 ADC. Pursuant to the companies’ option and license agreement, first patient dosing triggers a $5 million
IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 13:00:00 CET | Press release
IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p
HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 12:00:00 CET | Press release
HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP)Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 ConstraintsNot Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. Cha
Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 09:15:00 CET | Press release
Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char
DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 08:18:00 CET | Press release
Will accelerate the development and mass production of EUV lithography photomasks Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers co
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
