COMPUTEX-TAIPEI
13.5.2021 07:30:13 CEST | Business Wire | Press release
As one of the most important tech summits globally, COMPUTEX Forum and its discussion topics have always garnered great attention. To facilitate the discussion on future technology trends, the COMPUTEX Forum on June 2 and 3 will evolve around the theme of “The New Era of Intelligence .” TAITRA announced the lineup of speakers to discuss key applications of 5G, AI, IoT, and electric vehicles, deep diving into business strategies in the post-pandemic era.
The Four Topics to Focus on IT Applications and Development
In the morning of Wednesday, June 2, COMPUTEX Forum will address the topic of “AIoT Evolution .” Leading semiconductor giants such as Intel, Micron, NVIDIA and Supermicro, will explore how they accelerate business opportunities in the 5G era.
In the afternoon, NXP Semiconductors will kick off the “AI Empowerment ” session by sharing its vision and lead the Secure Edge and AI Empowerment discussions in fields. As AI rises in various applications, Arm, Delta Electronics, Micron and Check Point Software will elaborate their latest solution in different scopes.
Thursday, June 3 morning session, will be on "Critical Technology ," with speakers from global companies, including Quanta Cloud Technology, Siemens, and WIN Semiconductors, as well as the mobile operator, Far EasTone Telecom. This session will talk about the development of potential 5G applications in the manufacturing, healthcare, and automotive industries that will redefine the 5G landscape in the future.
On June 3, the topic of the last session in the afternoon will be “Tomorrow Tech .” IBM, NVIDIA, and Qualcomm will take part in an in-depth discussion on the emerging applications of quantum computers, AI fueling future work and collaboration, and self-driving cars.
COMPUTEX Forum Will Be Livestreamed on the #COMPUTEXVirtual Platform
Every year, COMPUTEX presents invaluable information on the industry’s supply chain and trends around the world. This year, the global audience will have a front row seat to discover and see the latest technology. All COMPUTEX Forum sessions will be livestreamed on the official #COMPUTEXVirtual platform on June 2 and June 3.
COMPUTEX Forum is co-organized by the Bureau of Foreign Trade of the Ministry of Economic Affairs and the Taiwan External Trade Development Council (TAITRA). COMPUTEX Forum is now open for registration:
https://virtual.computextaipei.com.tw/events
For more updates:
COMPUTEX website: https://www.computextaipei.com.tw/
InnoVEX website : https://www.innovex.com.tw/
About COMPUTEX TAIPEI (also called COMPUTEX):
Established in 1981, COMPUTEX is one of the leading global ICT, IoT, and startup tradeshows with a complete supply chain and IoT ecosystems. Co-organized by the Taiwan External Trade Development Council (TAITRA) and Taipei Computer Association (TCA), COMPUTEX, based upon Taiwan’s complete ICT clusters, covers the whole spectrum of the ICT industry, from established brands to startups and from ICT supply chain to IoT ecosystems. With strong R&D and manufacturing capabilities and IPR protection, Taiwan is a strategic destination for foreign companies and investors looking for partners in global technology ecosystems. Follow COMPUTEX on its website at www.computextaipei.com.tw and Twitter @computex_taipei using the hashtag #COMPUTEX.
About COMPUTEX 2021 Hybrid:
As a pioneer in technology, COMPUTEX has been on the forefront in embracing digital transformation. COMPUTEX will launch the Online-Merge-Offline (OMO) exhibition platform "COMPUTEX 2021 Hybrid" in 2021. As the event organizer, the Taiwan External Trade Development Council (TAITRA) aims to deliver an exceptional exhibition experience by combining #COMPUTEXVirtual with the onsite exhibition. In collaborating with the Taiwanese unicorn startup, Appier, TAITRA is introducing AI computing capabilities to the exhibition to shape COMPUTEX as a global model.
About TAITRA:
Founded in 1970, TAITRA is Taiwan's foremost nonprofit trade promoting organization. Sponsored by the government and industry organizations, TAITRA assists enterprises to expand their global reach. Headquartered in Taipei, TAITRA has a team of 1,300 specialists and operates 5 local offices in Taoyuan, Hsinchu, Taichung, Tainan and Kaohsiung, as well as 63 branches worldwide. Together with Taipei World Trade Center (TWTC) and Taiwan Trade Center (TTC), TAITRA has formed a global network dedicated to promoting world trade.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210512006113/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom