CHINAPLAS
12.3.2019 03:02:11 CET | Business Wire | Press release
The operating environment for most industries became increasingly complex. It is more vital than ever for enterprising businesses to master technological innovation. CHINAPLAS , the Asia’s No. 1 plastics and rubber trade fair, offers an international platform for the release and exchange of advanced new technologies. The show will not only feature more than 3,500 exhibitors but will also organize a series of exciting concurrent events to address those industries’ needs.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190311005047/en/
Plastics Recycling & Circular Economy Conference and Showcase
To foster circular economy is a global consensus to achieve sustainable development. Great potential and bounteous market opportunities arise with it. More and more big brands have announced environmental protection policies of recycling. In 2017, Adidas sold 1 million pairs of running shoes made of ocean plastic waste. How can plastics contribute to sustainable development? Focusing on the concerns of the industry, a “Plastics Recycling & Circular Economy Conference and Showcase ”, will be held with the themes of “Material Science for Sustainability”, “Recycling Technology” and “Environmental Packaging”.
Industry 4.0 Factory of the Future
Industry practitioners can visit the “Industry 4.0 Factory of the Future ” at CHINAPLAS 2019. There will be two themed areas, “Manufacturing Intelligence Control Room” and “Smart Factory”, to demonstrate implementable intelligent solutions. The control room will display operational data recorded at both the on-site machines and a remote smart factory, while the “Smart Factory” will simulate the future manufacturing environment.
Design x Innovation
Recognizing the key role of design in product development, CHINAPLAS 2019 will organize the event “Design x Innovation ”, comprising three parts.
1. CMF Inspiration Walls will display rich resources on Color, Material and Finish.
2. Design Forum will share product experience covering recyclable & sustainable design, low carbon design and CMF applications.
3. CHINAPLAS Designers’ Night .
Tech Talk
By way of open forums, “Tech Talk ” will showcase the hottest product technologies, and focus clearly on cutting-edge solutions. Tech Talk will include 11 major themes, including new energy vehicles, automotive thermoplastic elastomers, 3D printing, Bioplastics, composites, antimicrobial applications, in-mold labeling, precision extrusion, green building solutions, plastics for wearable electronics, long fiber injection molding.
Medical Plastics Connect
“Medical Plastics Connect ” actively promotes medical-grade chemical raw materials and equipment to create an efficient communication platform for medical device, consumables, and pharmaceutical packaging manufacturers. These activities aim to pinpoint for potential buyers the unique medical plastics technologies among the many exhibits active in this sector. "Medical Plastics Connect” activities include “Open Forum”, “Pop-up Kiosk”, “Medical Plastics Guidebook” and “Medical Plastics Guided Tour”.
CHINAPLAS , the Asia’s No. 1 plastics and rubber trade fair, will be held in Guangzhou, PR China, from May 21-24, 2019. An estimated total of over 3,500 exhibitors from all over the world will be presenting to more than 180,000 professional visitors from 150 countries and regions. For more information and pre-registration, please click here .
View source version on businesswire.com: https://www.businesswire.com/news/home/20190311005047/en/
Contact:
Stella Yuen Chinaplas.PR@adsale.com.hk
Link:
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Motive Powers Latin America’s Next Wave of Mobile Innovation1.6.2026 17:00:00 CEST | Press release
Motive Entitlement Server enabling satellite connectivity in the Andes to fraud-free authentication in Brazil Motive, a global leader in entitlement and connected device & service management, joined operators and industry leaders at M360 LATAM in Mexico City, showcasing live deployments across the region's most consequential use cases: Satellite Direct-to-Device connectivity for unreachable geographies, end-to-end eSIM provisioning and visibility at scale, and SIM-based silent authentication replacing fraud-exposed SMS OTP. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260531906729/en/ Across landmark deployments with multiple Claro, Vivo, and Entel operations, Motive’s Entitlement Server (Motive ES) has moved from infrastructure component to regional growth engine. These deployments are citing measurable commercial growth, enabling streamlined eSIM provisioning, improved device onboarding experiences, and new revenue oppor
Interactive Brokers Integrates AI into Client Portfolios – Informed by Agentic Technology, Controlled by the Client1.6.2026 16:00:00 CEST | Press release
Clients Can Research Stocks, Analyze Performance, and Generate Trade Instructions in Claude. The Client Approves Every Trade. Interactive Brokers (Nasdaq: IBKR), an automated global broker, today announced agentic trading through direct integration with Claude, one of the world's leading AI platforms. Available through the AI platform’s certified connector marketplace, the integration lets clients manage their accounts and access more than 170 global markets. "Interactive Brokers has used technology for over four decades to help investors make more informed decisions and interact more efficiently with markets," said Milan Galik, Chief Executive Officer of Interactive Brokers. "Investors are increasingly using artificial intelligence to research markets, analyze information and generate ideas. We believe the next logical step is to allow clients to securely connect AI tools directly to their brokerage accounts — whether they want a simple conversational interface, deeper portfolio analy
AIM Expands Life Sciences Supply Chain Capabilities and Hires New Partner, Thomas Ebel1.6.2026 15:01:00 CEST | Press release
AIM today announced the appointment of veteran pharma supply chain expert Thomas Ebel as Partner, effective June 15. Mr. Ebel brings more than 25 years of supply chain consulting experience at leading firms including CAMELOT, McKinsey, and Accenture, and will anchor a broader initiative to expand AIM’s end-to-end supply chain capabilities. According to Richard de Bakker, Statutory Director and Founder at AIM, the firm is significantly expanding its capabilities around “end-to-end” supply chain needs. “AIM is well known as a leader in supply chain development for launch, as well as optimization of existing supply chains — supporting clients in getting their finished products to patients,” said Mr. de Bakker. “We are now adding new capabilities in supply chain diagnostics and strategy, end-to-end planning optimization, supply reliability, and working capital optimization, among others. Combined with AIM’s established supply chain expertise, this expanded offering gives clients true ‘end-
Seoul Semiconductor's World-First 'HV Opto-Semiconductor' Powers Up Global Top 4 Automakers1.6.2026 15:00:00 CEST | Press release
Seoul Semiconductor Co., Ltd. (KOSDAQ: 046890), a global opto-semiconductor technology company, announced that its world's first High Voltage (HV) opto-semiconductor technology has entered mass production with four of the world's top automotive brands across the Americas, Europe, and Asia, with plans to expand supply to 10 models by the end of the year. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601232986/en/ Comparison: Conventional 3V LED vs. Seoul Semiconductor 12V 'HV Opto-Semiconductor' (Figure: Seoul Semiconductor) The technology combines micro-scaled opto-semiconductor chips capable of 12V single-chip operation — as opposed to conventional 3V LEDs — with a high-voltage (HV) driver technology. This enables a reduction of more than 10% in the number of driver-related components used in hybrid and electric vehicles, while lowering power consumption by approximately 10%, contributing to cost reduction and simplific
Oscilloquartz delivers assured timing for mission-critical harsh environments with ruggedSync™ Series OSA 55101.6.2026 14:00:00 CEST | Press release
News summary: Defense operations require resilient timing architectures that maintain synchronization in contested and GNSS-denied environments ruggedSync™ Series OSA 5510 delivers assured timing and extended holdover in a MIL-qualified platform for tactical, deployable operations Zero-trust resiliency with diversified cPNT sources, including M-Code, PRS and STL, strengthens operational continuity for defense communications, navigation and mission-critical infrastructure Oscilloquartz today launched its ruggedSync™ Series OSA 5510, a ruggedized timing and synchronization platform engineered for defense and other harsh, mission-critical environments. Designed for deployment in tactical communications networks, mobile command centers (MCCs), aviation systems and other highly demanding operational environments, the OSA 5510 combines PTP grandmaster and NTP server functionality with synchronization assurance and resilient holdover in a compact MIL-qualified platform. Multi-band GNSS suppor
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom